Fabrication of Fine-Pitch Cu-Sn Microbumps Using Electroplating and Wet Seed Layer Etching

Yunfan Shi, Zilin Wang, Zheyao Wang

Eclipse Versus Conventional Optical Choppers: Modeling and Analysis

Virgil-Florin Duma, Eduard-Sebastian Csukas, Cosmin Moisa

Development of HTC Tests on Module Basis

Victoria Zimmermann, Lukas Farnbacher, Tamara Reck, Dawei Zhao, Jürgen Leib, Bernd Eckardt

Low-temperature Adhesive Wafer Bonding for Film Layer Transfer

Augusto Daniel Rodrigues, Nikolai Andrianov, Munir Syed Azeem, Madeleine Petschnigg, Tai Nguyen, Thang Duy Dao, Ali Roshanghias

Adhesive Solutions for Closed Cavity Packaging

Patrick Schirmer, Severin Ringelstetter

Infrared Optical Solutions for Void Inspection of Bonded Wafers and Bonding Overlay Control

Gyorgy Nadudvari, Zsolt Kovács, Zoltan Tamas Kiss, Zoltan Lábszki, Imre Balogh, Silvia Poppa, Denes Szaz

Investigation of RF Characteristics of Chiplet to PCB Transitions for Advanced HPC Packaging Solutions

Alexander Gaebler, Uwe Maaß, Ivan Ndip

Molding Process Simulation and Viscoelastic Model for Package Warpage Anticipation

Marco Rovitto

2.5D/3D Chiplets Approach to Advanced Packaging Solutions

Hiroki Oshida, Tadashi Kubota, Engin Tinas, Yuichi Koba

Automatized Multi-objective Optimization for Reliability of Power Electronics

Tibor Debreceni, Bence Dániel Darázs, Christian Freitag, Bálint Garai

Adhesion Layer Analysis by Spectroscopic Ellipsometry

Uwe Richter

Inline Oxide Removal Through Openair-plasma to Solve Delamination and Improve Bonding in Electronics

nico coenen, Dhia Bensalem, Daphne Pappas

Heat Spreading in Uncovered Copper Sintered Die-Attach Layers Examined with Lock-In Thermography

Olaf Rämer, Marek Zajaczkowski, Corinna Grosse-Kockert, Daniel May, Sri Krishna Bhogaraju

Evaluation of Mobile Data Center Cooling Performance Based on Embedded Cooling

Yuxin Ye, Xiangbin Du, Chenxi Gao, Yanmei Kong, Guoran Lu, Xinhao Meng, Binbin Jiao

Critical Parameters of Bond Strength Measurement on Wafer Bonding

Yusuke Kondo, Junya Fuse, Yuki Yoshihara, Marie Sano, Yuzo Nakamura, Isamu Matsubara, Fumihiro Inoue

Investigating Competing Failure Modes in Microelectronics due to Temperature Variations (ΔT)

Muhammad Musadiq, Adwait Inamdar, Romuald Roucou, W.D Van Driel

Development and Characterization of a Chip-film Patch Interposer Integrating an Ultrathin Electrophysiology Chip

Michael Kübler, Alexander Frank, Ulrike Passlack, Christine Harendt, Joachim N. Burghartz

Reliability Analysis of Surface Mount Interconnect Technologies Suitable for Temperatures up to 200 °C

Oliver Albrecht, Lukas Petersen, Luca Finn Tom Nowotnik, Maik Müller, Juliana Panchenko

Using Polymer Paste as Dielectric Material for PCB Based Module-to-Module Sintering

Tobias Tiedje, Jörg Meyer, Marco Luniak, Philip Knoch, Karsten Meier, Thomas Zerna, Andreas Munding

Non-phthalate and Biobased Plasticizers in Suspensions for Tape Casting

Kostja Makarovič, Barbara Malic

The Potential of Machine Learning for Thermal Modelling of SiC Power Modules - A Review

Zihan Zhang, Alireza Mehrabi, Willem vanDriel, René Poelma

Simulation and Experimental Analysis of Thermomechanical Stresses Around Interconnects for W2W Hybrid Bonding

Guoqiang Zhao, Yanping Zeng, Yi Zhao

RF Characterization and Analysis of Low-loss PCB Materials and Transmission Lines up to 110 GHz

Kavin Senthil Murugesan, Ivan Ndip, Jack Frankosky, Brian Amos, Georgi Georgiev, Ralph Fiehler, Jens Schneider, Martin Schneider-Ramelow

Bilayer Encapsulant for Lower Stress Moisture Protection

Mohammed Ibaad Gandikota, Francis Patrick McCluskey

Laser Assisted Bonding (LAB) Based Flip-chip Process for Fine Pitch Solder Bumps Device Using Laser Non-conductive Paste (NCP)

Ki-Seok JANG, Yong-Sung EOM, Gwang-Mun CHOI, Jiho JOO, Jungho SHIN, Jin-Hyuk OH, Chan-Mi LEE, Ji-Eun JUNG, Ga-Eun LEE, Kwang-Seong CHOI

Recycling SMD Components for E-Textile Fabrication: A Salt Spray Ageing Study

Martin Hirman, Jiri Navratil, Andrea Benesova, Frantisek Steiner

Experimental Study on Reactive Joining Processes on LTCC Substrates

Erik Wiss, Nesrine Jaziri, Adam Yuile, Jens Müller, Steffen Wiese

Development and Realization of Plasma Activated Low Temperature SiOx-SiOx Fusion Bonding Based on a Collective Die-to-wafer Bonding Process

Patrick Krüger, Thomas Voß, Sebastian Schulze, Matthias Wietstruck

A Novel 8GHz/50MHz Low Noise Dual Frequency PLL.

Ahmad hatem Jadery, Mehdi Ehsanian, Elias Rachid, Adnan Harb

Innovative Active Cell Balancing Circuit Using Common Capacitor for Energy Redistribution

Ana Metes, Toma Patarau, Aurelian Kotlar

An Overview of the Thick Film Copper Technology for Power Electronics

Jiri Hlina, Jan Reboun, Lukas Stepan, Marek Simonovsky

Monitoring Cu via Structures and Surrounding Dielectric Stack After CMP Process

Peter Basa, Attila Suto, Gyorgy Nadudvari, Silvia Poppa

Simulations of Thermocouple Measurements During Reactive Bonding Processes on LTCC Substrates

Adam Yuile, Nesrine Jaziri, Erik Wiss, Jens Müller, Steffen Wiese

Modelling the Influence of Stretched Molding Foil on the Overall Dimensions of Molded Packages.

Jurrian Zijl, Edwin Lamers, Thijs Besseling, Niels Nijenmanting

Mitigating Gas-induced Performance Degradation in High Reliability Electronic and Optoelectronic Systems

Alessio Corazza, Giovanni Zafarana, Enea Rizzi, Luca Mauri

Ag and SiO2 Mixed Powder Sintering System

Minoru Ueshima

Investigation of Side Wall Loss for Development of 6 µm Microbumps for 3D/2.5D Integration

Adil Shehzad, Maksym Myndyk, Manuela Junghähnel, Juliana Panchenko

Improving The Thinning Module Robustness Vis-a-vis the Bonding Misalignment & the TBM EBR

NADER JEDIDI, Koen Kennes, ALain Phommahaxay

LidroCUT - Laser Processing in Liquids for New Packaging Applications

Alexander Kanitz, Jan-Philipp Wessels, Jan Stefan Hoppius, Katharina Laake

Alignment Between Subsequent 3D Molding Layers for Optimized Performance of 3D Integrated Patch Antennas for Advanced Sensing Applications

Nyake Gahein-Sama, Marc Dreissigacker, Friedrich Müller, Christian Tschoban, Tanja Braun, Karl-Friedrich Becker, Martin Schneider-Ramelow

Use of 3D Printing Techniques in the Development of Electronic Systems, Support Stage in the Digital Transformation of the Laboratories

Miruna-Lucretia Comeaga, Madalin Vasile Moise, Octavian Dontu, Dan Andrei Luca

Evolved Finite Difference Model to Investigate Humidity-related Failure Modes for Microelectronic and Power Electronic Devices

Alexander Reichel, Falk Naumann, Marco Rudolph, Marcel Mittag, Sandy Klengel

Study of the Water and Steam Resistance of Thick Film Materials for Sensor Applications up to 300 °C

Maik Mueller, Sergey Saakyan, Marco Luniak, Heiko Pietruske, Eckhard Schleicher, Juliana Panchenko

Tape Automated Bonding of an ALPIDE Chip with Flexible PCB

David Novel, Alessandro Lega, Tiziano Facchinelli, Roberto Iuppa, Stefania Beolé, Pierluigi Bellutti

Direct Flip Chip Bonding on Laser Induced Graphene Structures for Low-cost Flexible Sensor Devices

Muhammad Hassan Malik, Lukas Neumaier, Fabiane Fantinelli Franco, Ali Roshanghias

Reliable Fabrication Methodology for Consistent Supercapacitor Performance

Irina Madalina Burcea, Rodica Cristina Negroiu, Bogdan Traian Mihailescu, Vasile Madalin Moise, Cristina Marghescu, Paul Svasta