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Session Overview | |
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Location: MOA 1+2 MOA 1+2 |
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| 2:40pm - 3:55pm |
Power1_Electronics Measurement and Simulation Location: MOA 1+2 Chair: Aurelian Kotlar, Eberspächer |
| 5:00pm - 6:15pm |
Power2_Power Semiconductor Packaging and Cooling Location: MOA 1+2 Chair: Gudrun Feix, ECPE European Center for Power Electronics |
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| 9:15am - 10:30am |
Rel1_Reliability Performance and Electromigration Behavior Location: MOA 1+2 Chair: Matthias Heimann, Siemens AG |
| 11:00am - 12:15pm |
Rel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects Location: MOA 1+2 Chair: Romuald Roucou, NXP |
| 1:45pm - 3:15pm |
Special Session Location: MOA 1+2 Education I: The Education, Training and Qualification Offer for Sustainable Electronics |
| 3:45pm - 5:15pm |
Special Session Location: MOA 1+2 Chair: Jeffrey C. Suhling, Auburn University Chair: Klaus-Jürgen Wolter, TU Dresden Education II: t.b.c. |
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| 9:15am - 10:30am |
RF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems Location: MOA 1+2 Chair: Matthias Wietstruck, IHP - Leibniz Institut für innovative Mikroelektronik |
| 11:00am - 12:15pm |
Rel3_Progress in Failure Analytical and Material Testing Methods Location: MOA 1+2 Chair: Matthias Petzold, Fraunhofer IMWS |
| 1:45pm - 3:00pm |
Rel4_New Approaches in Reliability Simulation and Modelling Location: MOA 1+2 Chair: Olaf Wittler, Fraunhofer IZM |