Conference Agenda

Session Overview
Location: MOA 1+2
MOA 1+2
 
Date: Wednesday, 11/Sept/2024
2:40pm
-
3:55pm
Power1_Electronics Measurement and Simulation
Location: MOA 1+2
Chair: Aurelian Kotlar, Eberspächer
5:00pm
-
6:15pm
Power2_Power Semiconductor Packaging and Cooling
Location: MOA 1+2
Chair: Gudrun Feix, ECPE European Center for Power Electronics

 
Date: Thursday, 12/Sept/2024
9:15am
-
10:30am
Rel1_Reliability Performance and Electromigration Behavior
Location: MOA 1+2
Chair: Matthias Heimann, Siemens AG
11:00am
-
12:15pm
Rel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects
Location: MOA 1+2
Chair: Romuald Roucou, NXP
1:45pm
-
3:15pm
Special Session
Location: MOA 1+2

Education I: The Education, Training and Qualification Offer for Sustainable Electronics



3:45pm
-
5:15pm
Special Session
Location: MOA 1+2
Chair: Jeffrey C. Suhling, Auburn University
Chair: Klaus-Jürgen Wolter, TU Dresden

Education II: t.b.c.




 
Date: Friday, 13/Sept/2024
9:15am
-
10:30am
RF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems
Location: MOA 1+2
Chair: Matthias Wietstruck, IHP - Leibniz Institut für innovative Mikroelektronik
11:00am
-
12:15pm
Rel3_Progress in Failure Analytical and Material Testing Methods
Location: MOA 1+2
Chair: Matthias Petzold, Fraunhofer IMWS
1:45pm
-
3:00pm
Rel4_New Approaches in Reliability Simulation and Modelling
Location: MOA 1+2
Chair: Olaf Wittler, Fraunhofer IZM