IEEE ESTC 2024

September 11–13, 2024 | Berlin, Germany

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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview
Location: MOA 1+2 MOA 1+2

Date: Wednesday, 11/Sept/2024

2:40pm
-
3:55pm

Power1_Electronics Measurement and Simulation
Location: MOA 1+2
Chair: Aurelian Kotlar, Eberspächer

2:40pm - 3:05pm

Dynamic Calibration of Junction Temperature of SiC MOSFETs for Power Cycling

Jakob Breuer, Fabian Dresel, Andreas Schletz, Juergen Leib, Bernd Eckardt, Martin Maerz

3:05pm - 3:30pm

Contact Thermography – New Findings, New Ideas

Martin Oppermann, Lea Borngräber, Oliver Albrecht, Thomas Zerna

3:30pm - 3:55pm

Abrasion Characterization of Graphene-enhanced Thermal Interface Materials for Electronics Thermal Management Applications

Kristoffer Harr, Yuanyuan Wang, Johan Möller, Johan Liu

5:00pm
-
6:15pm

Power2_Power Semiconductor Packaging and Cooling
Location: MOA 1+2
Chair: Gudrun Feix, ECPE European Center for Power Electronics

5:00pm - 5:25pm

Model-based Development to Improve Electrical and Thermal Performances for Robust Si Power MOSFETs Using Embedded Die Packaging Technology

Kentaro Mori, Kohei Oasa, Hitoshi Imi, Yutaro Hayashi, Tatsuya Ohguro, Tatsuya Nishiwaki, Fumiyoshi Kawashiro

5:25pm - 5:50pm

Research on Ultra-compact 3D SiC Power Module for EVs with Double Layer Cooling Technology

Keita Suzuki, Takumi Yumoto, Koji Bando, Tetsuo Endoh, Yoshikazu Takahashi

5:50pm - 6:15pm

An Introduction to Wire-bondless Discrete GaN Power Packages with Top-Side Cu Sinterconnects®

Kaneeze Noorul Ain, Guo Qi Zhang, Augusto Rodrigues, Md Nazmul Hasan, Karen Geens, Urmimala Chatterjee, Ali Roshanghias, Dominik Holzmann

Date: Thursday, 12/Sept/2024
9:15am - 10:30am	Rel1_Reliability Performance and Electromigration Behavior Location: MOA 1+2 Chair: Matthias Heimann, Siemens AG 9:15am - 9:40am Electromigration Reliability of Cu3Sn Microbumps for 3D Heterogeneous Integration Nikhilendu Tiwary, Christian Grosse, Michael Kögel, Thilo Windemuth, Glenn Ross, Vesa Vuorinen, Sebastian Brand, Mervi Paulasto-Kröckel 9:40am - 10:05am Investigating the Failure Mechanisms of Electromigration and Copper Oxide Formation in Fine-pitch Cu RDL Adrija Chaudhuri, Johannes Jaeschke, Astrid Gollhardt, Hermann Oppermann, Martin Schneider-Ramelow 10:05am - 10:30am Investigation of the Influence of Shear Height in the Wire Bond Shear Test Simon Kuttler, Olaf Wittler, Martin Schneider-Ramelow
11:00am - 12:15pm	Rel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects Location: MOA 1+2 Chair: Romuald Roucou, NXP 11:00am - 11:25am Boundary Conditions for Reproducible and Comparable Condensation Tests to Prove the Migration Resistance of Assemblies Bob Wittig, Adrian Kandziora, Gerret Asseburg, Markus Thoben 11:25am - 11:50am Analysis of LED Solder Joints During Combined Power and Thermal Cycling Khalil Maarouf, Christine Roucoules, Helmut Klöcker, Sergio Sao-Joao 11:50am - 12:15pm Analysis of Degradation Effects for Different Epoxy-based Molding Compounds (EMC) Under High Temperature Aging Falk Naumann, Tino Stephan, Marcel Mittag, Robert Klengel, Sandy Klengel
1:45pm - 3:15pm	Special Session Location: MOA 1+2 Education I: The Education, Training and Qualification Offer for Sustainable Electronics
3:45pm - 5:15pm	Special Session Location: MOA 1+2 Chair: Jeffrey C. Suhling, Auburn University Chair: Klaus-Jürgen Wolter, TU Dresden Education II: t.b.c.

Date: Friday, 13/Sept/2024
9:15am - 10:30am	RF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems Location: MOA 1+2 Chair: Matthias Wietstruck, IHP - Leibniz Institut für innovative Mikroelektronik 9:15am - 9:40am Thin-Film Substrate-based mmWave Antennas for Automotive Radar Applications Thi Huyen Le, Kavin Senthil Murugesan, Ivan Ndip, Lutz Gerhold, Habib Hichri, Ryohei Oishi, Reki Nakano, Martin Schneider-Ramelow 9:40am - 10:05am Fabrication and Implementation of BiCMOS BEOL Silicon Interposer Technologies with Integrated Metal Reflectors for Sub-THz Leaky-wave Antennas Matthias Wietstruck, Patrick Krüger, Thomas Voß, Thomas Mausolf, Muhammad Faisal Bashir, Akanksha Bhutani 10:05am - 10:30am Broadband Antennas for High Performance 5G mmWave Modules Thi Huyen Le, Ivan Ndip, Martin Schneider-Ramelow
11:00am - 12:15pm	Rel3_Progress in Failure Analytical and Material Testing Methods Location: MOA 1+2 Chair: Matthias Petzold, Fraunhofer IMWS 11:00am - 11:25am Full-field IR-Thermography for Bond-quality Inspection of Electroplated Aluminium Interconnects for Cryo-SiP Architectures Bernhard Wunderle, Daniel May, Imants Cirulis, Silvia Braun, Uwe Zschenderlein, Jens Heilmann, Remi Pantou, Ralph Schacht, Mohamad Abo Ras 11:25am - 11:50am Using µ-RAMAN Spectroscopy to Inspect Sintered Interconnects Gordon Elger, E Liu, Fabian Steinberger, Bernhard Wunderle, Zubair Mohd 11:50am - 12:15pm Determination of Mechanical Properties for Copper in Plated Through Holes by Combination of Tensile Test and Nanoindentation Janine Conrad, Olaf Wittler, Martin Schneider-Ramelow
1:45pm - 3:00pm	Rel4_New Approaches in Reliability Simulation and Modelling Location: MOA 1+2 Chair: Olaf Wittler, Fraunhofer IZM 1:45pm - 2:10pm AI-Driven Digital Twin for Real-Time Health Monitoring of Wide Band Gap Semiconductors in Power Electronic Applications Alireza Mehrabi, Keyvan Yari, Willem D. van Driel, Rene H. Poelma 2:10pm - 2:35pm Damage Parameter: Proposed Index to Quantify the Durability of Sintered Nano Silver and Multilayer Aluminum Foil Die Attach Materials Keisuke Wakamoto, Takukazu Otsuka, Ken Nakahara 2:35pm - 3:00pm Energy-Based Approach on Calculating Stand-off Height of Different Solder Joints Antal Bakonyi, Ambrus Zelei

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