Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
2:40pm Power1_Electronics Measurement and Simulation Location: MOA 1+2 Chair: Aurelian Kotlar , Eberspächer
2:40pm - 3:05pm Dynamic Calibration of Junction Temperature of SiC MOSFETs for Power Cycling
Jakob Breuer, Fabian Dresel, Andreas Schletz, Juergen Leib , Bernd Eckardt, Martin Maerz
3:05pm - 3:30pm Contact Thermography – New Findings, New Ideas
Martin Oppermann , Lea Borngräber, Oliver Albrecht, Thomas Zerna
3:30pm - 3:55pm Abrasion Characterization of Graphene-enhanced Thermal Interface Materials for Electronics Thermal Management Applications
Kristoffer Harr , Yuanyuan Wang, Johan Möller, Johan Liu
5:00pm Power2_Power Semiconductor Packaging and Cooling Location: MOA 1+2 Chair: Gudrun Feix , ECPE European Center for Power Electronics
5:00pm - 5:25pm Model-based Development to Improve Electrical and Thermal Performances for Robust Si Power MOSFETs Using Embedded Die Packaging Technology
Kentaro Mori , Kohei Oasa, Hitoshi Imi, Yutaro Hayashi, Tatsuya Ohguro, Tatsuya Nishiwaki, Fumiyoshi Kawashiro
5:25pm - 5:50pm Research on Ultra-compact 3D SiC Power Module for EVs with Double Layer Cooling Technology
Keita Suzuki, Takumi Yumoto, Koji Bando, Tetsuo Endoh, Yoshikazu Takahashi
5:50pm - 6:15pm An Introduction to Wire-bondless Discrete GaN Power Packages with Top-Side Cu Sinterconnects®
Kaneeze Noorul Ain , Guo Qi Zhang, Augusto Rodrigues, Md Nazmul Hasan, Karen Geens, Urmimala Chatterjee, Ali Roshanghias, Dominik Holzmann
9:15am Rel1_Reliability Performance and Electromigration Behavior Location: MOA 1+2 Chair: Matthias Heimann , Siemens AG
9:15am - 9:40am Electromigration Reliability of Cu3Sn Microbumps for 3D Heterogeneous Integration
Nikhilendu Tiwary , Christian Grosse, Michael Kögel, Thilo Windemuth, Glenn Ross, Vesa Vuorinen, Sebastian Brand, Mervi Paulasto-Kröckel
9:40am - 10:05am Investigating the Failure Mechanisms of Electromigration and Copper Oxide Formation in Fine-pitch Cu RDL
Adrija Chaudhuri , Johannes Jaeschke, Astrid Gollhardt, Hermann Oppermann, Martin Schneider-Ramelow
10:05am - 10:30am Investigation of the Influence of Shear Height in the Wire Bond Shear Test
Simon Kuttler , Olaf Wittler, Martin Schneider-Ramelow
11:00am Rel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects Location: MOA 1+2 Chair: Romuald Roucou , NXP
11:00am - 11:25am Boundary Conditions for Reproducible and Comparable Condensation Tests to Prove the Migration Resistance of Assemblies
Bob Wittig , Adrian Kandziora, Gerret Asseburg, Markus Thoben
11:25am - 11:50am Analysis of LED Solder Joints During Combined Power and Thermal Cycling
Khalil Maarouf, Christine Roucoules , Helmut Klöcker, Sergio Sao-Joao
11:50am - 12:15pm Analysis of Degradation Effects for Different Epoxy-based Molding Compounds (EMC) Under High Temperature Aging
Falk Naumann , Tino Stephan, Marcel Mittag, Robert Klengel, Sandy Klengel
1:45pm Special Session Location: MOA 1+2
Education I: The Education, Training and Qualification Offer for Sustainable Electronics
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3:45pm Special Session Location: MOA 1+2 Chair: Jeffrey C. Suhling , Auburn UniversityChair: Klaus-Jürgen Wolter , TU Dresden
9:15am RF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems Location: MOA 1+2 Chair: Matthias Wietstruck , IHP - Leibniz Institut für innovative Mikroelektronik
9:15am - 9:40am Thin-Film Substrate-based mmWave Antennas for Automotive Radar Applications
Thi Huyen Le , Kavin Senthil Murugesan, Ivan Ndip, Lutz Gerhold, Habib Hichri, Ryohei Oishi, Reki Nakano, Martin Schneider-Ramelow
9:40am - 10:05am Fabrication and Implementation of BiCMOS BEOL Silicon Interposer Technologies with Integrated Metal Reflectors for Sub-THz Leaky-wave Antennas
Matthias Wietstruck , Patrick Krüger, Thomas Voß, Thomas Mausolf, Muhammad Faisal Bashir, Akanksha Bhutani
10:05am - 10:30am Broadband Antennas for High Performance 5G mmWave Modules
Thi Huyen Le , Ivan Ndip, Martin Schneider-Ramelow
11:00am Rel3_Progress in Failure Analytical and Material Testing Methods Location: MOA 1+2 Chair: Matthias Petzold , Fraunhofer IMWS
11:00am - 11:25am Full-field IR-Thermography for Bond-quality Inspection of Electroplated Aluminium Interconnects for Cryo-SiP Architectures
Bernhard Wunderle , Daniel May, Imants Cirulis, Silvia Braun, Uwe Zschenderlein, Jens Heilmann, Remi Pantou, Ralph Schacht, Mohamad Abo Ras
11:25am - 11:50am Using µ-RAMAN Spectroscopy to Inspect Sintered Interconnects
Gordon Elger, E Liu, Fabian Steinberger, Bernhard Wunderle, Zubair Mohd
11:50am - 12:15pm Determination of Mechanical Properties for Copper in Plated Through Holes by Combination of Tensile Test and Nanoindentation
Janine Conrad , Olaf Wittler, Martin Schneider-Ramelow
1:45pm Rel4_New Approaches in Reliability Simulation and Modelling Location: MOA 1+2 Chair: Olaf Wittler , Fraunhofer IZM
1:45pm - 2:10pm AI-Driven Digital Twin for Real-Time Health Monitoring of Wide Band Gap Semiconductors in Power Electronic Applications
Alireza Mehrabi , Keyvan Yari, Willem D. van Driel, Rene H. Poelma
2:10pm - 2:35pm Damage Parameter: Proposed Index to Quantify the Durability of Sintered Nano Silver and Multilayer Aluminum Foil Die Attach Materials
Keisuke Wakamoto , Takukazu Otsuka, Ken Nakahara
2:35pm - 3:00pm Energy-Based Approach on Calculating Stand-off Height of Different Solder Joints
Antal Bakonyi , Ambrus Zelei