IEEE ESTC 2024
September 11–13, 2024 | Berlin, Germany
Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview | |
Location: MOA 1+2 MOA 1+2 |
Date: Wednesday, 11/Sept/2024 | |
2:40pm - 3:55pm | Power1_Electronics Measurement and Simulation Location: MOA 1+2 Session Chair: Aurelian Kotlar, Eberspächer |
5:00pm - 6:15pm | Power2_Power Semiconductor Packaging and Cooling Location: MOA 1+2 Session Chair: Gudrun Feix, ECPE European Center for Power Electronics |
Date: Thursday, 12/Sept/2024 | |
9:15am - 10:30am | Rel1_Reliability Performance and Electromigration Behavior Location: MOA 1+2 Session Chair: Matthias Heimann, Siemens AG |
11:00am - 12:15pm | Rel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects Location: MOA 1+2 Session Chair: Romuald Roucou, NXP |
1:45pm - 3:15pm | Special Session Location: MOA 1+2 Education I: The Education, Training and Qualification Offer for Sustainable Electronics |
3:45pm - 5:15pm | Special Session Location: MOA 1+2 Session Chair: Jeffrey C. Suhling, Auburn University Session Chair: Klaus-Jürgen Wolter, TU Dresden Education II: t.b.c. |
Date: Friday, 13/Sept/2024 | |
9:15am - 10:30am | RF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems Location: MOA 1+2 Session Chair: Matthias Wietstruck, IHP - Leibniz Institut für innovative Mikroelektronik |
11:00am - 12:15pm | Rel3_Progress in Failure Analytical and Material Testing Methods Location: MOA 1+2 Session Chair: Matthias Petzold, Fraunhofer IMWS |
1:45pm - 3:00pm | Rel4_New Approaches in Reliability Simulation and Modelling Location: MOA 1+2 Session Chair: Olaf Wittler, Fraunhofer IZM |
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