Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview | |
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Location: MOA 3 MOA 3 |
| Date: Wednesday, 11/Sept/2024 | |
| 8:30am - 10:30am |
PDC: “Flip Chip Fabrication and Applications“ I Location: MOA 3 Course instructor: Eric Perfecto |
| 10:45am - 12:45pm |
PDC: “Flip Chip Fabrication and Applications“ II Location: MOA 3 Course instructor: Eric Perfecto |
| 2:40pm - 3:55pm |
DTM1_Co-design and Modeling for Chiplets Location: MOA 3 Chair: Chris Bailey, Arizona State University |
| 5:00pm - 6:15pm |
DTM2_Reduced Order Modeling for Advanced Packaging Location: MOA 3 Chair: Kshitij Anil Kolas, Fraunhofer ENAS |
| Date: Thursday, 12/Sept/2024 | |
| 9:15am - 10:30am |
DTM3_Reliability and Virtual Prototyping Location: MOA 3 Chair: Pradeep Lall, Auburn University |
| 11:00am - 12:15pm |
DTM4_Device Level Modeling Location: MOA 3 Chair: Przemyslaw Gromala, Robert Bosch GmbH |
| 1:45pm - 3:15pm |
Special Session Location: MOA 3 PUNCH - Photonic Packaging |
| 3:45pm - 5:15pm |
Special Session Location: MOA 3 Chair: Toni Mattila, Business Finland Quantum Computing |
| Date: Friday, 13/Sept/2024 | |
| 9:15am - 10:30am |
Flex1_Reliability Assessment of Flexible Electronics Location: MOA 3 Chair: Jean Charles Souriau, CEA-Leti |
| 11:00am - 12:15pm |
Flex2_Formation of a Conductive Interconnection for Flexible Electronics Location: MOA 3 Chair: Jukka Hast, VTT Technical Research Centre of Finland ltd. |
| 1:45pm - 3:00pm |
RF2_Embedded System-in-Package and Interconnections Technologies Location: MOA 3 Chair: Maurizio Cirillo, Rheinmetall Italia SpA |