Simulations of Wafer-to-wafer Bonding Dynamics and Deformation Mechanisms

Oguzhan Orkut Okudur, Serena Iacovo, Shuo Kang, Mario Gonzalez, Eric Beyne

Signal Integrity Optimization for CoWoS Chiplet Interconnection Design Assisted by Reinforcement Learning

Weiyang Miao, Chuan Seng Tan, Mihai Dragos Rotaru

Finite Element Analysis of Stress Variation of Hybrid Bonding During Miniaturization of Interconnects

Yudong Yang, Fengze Hou, Chi Zhang, Rui Ma, Shangyang Shi, Fei Ding, Yu Zhang, Renxi Jin, Qidong Wang, Wei Wang

Reduced-Order Modelling for Coupled Thermal-Mechanical Analysis and Reliability Assessments of Power Electronic Modules with Nonlinear Material Behaviours

Sheikh Hassan, Stoyan Stoyanov, Pushparajah Rajaguru, Christopher Bailey

Highly Efficient Modeling of Solder Balls and Their Visco-plastic Behavior Applying the Energy Conserving Sampling and Weighting Method

Mike Feuchter, Hanna Baumgartl, Martin Hanke, Sven Rzepka

Coupled Electrothermal Analysis with Reduced Order Models for Optimizing GaN HEMTs Performance in Traction Inverters

Abinash Pradhan, Giovanna Grosso, Varaha Satya Bharath Kurukuru, Claudio Romano, Roberto Petrella

Reliability Testing and Virtual Prototyping for Embedded GaN Power Modules in Automotive Applications

Kshitij Anil Kolas, Alexander Otto, Maximilian Hepp, Rico Eichhorn, Jan Albrecht, Sven Rzepka

Fully Connected Neural Network (FCNN) Based Validation Framework for FEA Post Processing to improve SAC Solder Reliability Analysis

Mohd Zubair Akhtar, Christian Kreiner, Maximilian Schmid, Andreas Zippelius, Ulrich Tetzlaff, Gordon Elger

Re-Integrating a Reduced-Order Model into Finite Element Environment for Thermo-Mechanical Reliability Analysis in Microelectronics

Chengdong Yuan, Sönke Maeter, Youssef Maniar, Tamara Bechtold

Latency Insertion Method for FinFET Simulation Incorporating Parasitic Source/Drain Resistances

Yi Zhou, Jose E. Schutt-Aine

CANCELLED: Adaptive Artificial Neural Networks for Power Loss Prediction in SiC MOSFETs

Giovanni Di Nuzzo, Ajay Poonjal Pai, YiChe Su

Simulation Analysis on Thermal Performance of Lidless Fan-out Package

Yongbo Wu, Jian Cai, Changming Song, Lin Tan, Qian Wang

Development and Reliability Assessment of a Flexible Printed Capacitive Sensor for Precise Twisting Movement Detection

Ahmed Zakwan, Colleen Stover, Rui Chen

Reliability Assessment of Temperature Sensors Integrated on Elastic Substrate

Tuomas Happonen, Petri Järvinen, Mikko Paakkolanvaara, Teemu Alajoki

Comparison of Electrical and Mechanical Properties of Stretchable Circuit Boards

Lukas Werft, Christine Kallmayer, Malte von Krshiwoblozki, Martin Schneider-Ramelow

Additively Manufactured Flexible Electronics with Selectively Soldered Surface-mounted Devices Utilising StarJet Technology

Daniel Straubinger, Zeba Khan, Peter Koltay, Roland Zengerle, Sabrina Kartmann, Zhe Shu

Electroless Nickel/Immersion Gold and Immersion Tin as Final Finish Solutions for Flexible Substrates in EV Batteries

Britta Schafsteller, Mario Rosin, Michael Schwaemmlein, Boris Kraft, Hubertus Mertens, Jasemin Tuerkelly, Sandra Nelle

Electrical Characterization of an ALPIDE Chip TAB Bonded with Flexible PCBs

David Novel, Alessandro Lega, Tiziano Facchinelli, Roberto Iuppa, Stefania Beolé, Pierluigi Bellutti

Integration of Microwave SMD Components into Organic Multilayer PCBs

Lorenzo Giambuzzi, Maurizio Cirillo, David Schütze, Martin Hempel, Thomas Löher

Integration of III-V Components of 5G Transceiver in Embedding PCB-based Technology

Tekfouy Lim, Stefan Kosmider, Kavin Senthil Murugesan, Andreas Ostmann

Passive Intermodulation Estimation of a Novel Printed Circuit Board Interconnection Technology Based on Static I-V

Karamat Adavi, Sebastian Quednau, Xaver Mueller, Daniel Ernst, Karsten Meier, Hanno Platz