Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

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Only Sessions at Location/Venue		Sessions at any Location/Venue  -----  uncertain [0]  MOA 10-12 [17]  MOA 5 [11]  MOA 4 [11]  MOA 3 [11]  MOA 1+2 [11]  Foyer [0]  Atrium [13]

Session Overview

Location: MOA 3 MOA 3

Date: Wednesday, 11/Sept/2024
8:30am - 10:30am	PDC: “Flip Chip Fabrication and Applications“ I Location: MOA 3 Course instructor: Eric Perfecto more Info
10:45am - 12:45pm	PDC: “Flip Chip Fabrication and Applications“ II Location: MOA 3 Course instructor: Eric Perfecto more Info
2:40pm - 3:55pm	DTM1_Co-design and Modeling for Chiplets Location: MOA 3 Session Chair: Chris Bailey, Arizona State University
5:00pm - 6:15pm	DTM2_Reduced Order Modeling for Advanced Packaging Location: MOA 3 Session Chair: Kshitij Anil Kolas, Fraunhofer ENAS

Date: Thursday, 12/Sept/2024
9:15am - 10:30am	DTM3_Reliability and Virtual Prototyping Location: MOA 3 Session Chair: Pradeep Lall, Auburn University
11:00am - 12:15pm	DTM4_Device Level Modeling Location: MOA 3 Session Chair: Przemyslaw Gromala, Robert Bosch GmbH
1:45pm - 3:15pm	Special Session Location: MOA 3 PUNCH - Photonic Packaging more Info
3:45pm - 5:15pm	Special Session Location: MOA 3 Session Chair: Toni Mattila, Business Finland Quantum Computing more Info

Date: Friday, 13/Sept/2024
9:15am - 10:30am	Flex1_Reliability Assessment of Flexible Electronics Location: MOA 3 Session Chair: Jean Charles Souriau, CEA-Leti
11:00am - 12:15pm	Flex2_Formation of a Conductive Interconnection for Flexible Electronics Location: MOA 3 Session Chair: Jukka Hast, VTT Technical Research Centre of Finland ltd.
1:45pm - 3:00pm	RF2_Embedded System-in-Package and Interconnections Technologies Location: MOA 3 Session Chair: Maurizio Cirillo, Rheinmetall Italia SpA