IEEE ESTC 2024

September 11–13, 2024 | Berlin, Germany

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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview
Location: MOA 4 MOA 4

Date: Wednesday, 11/Sept/2024
8:30am - 10:30am	PDC: “Automotive Electronics Reliability – Assurance Approaches and Challenges” I Location: MOA 4 Course instructor: Pradeep Lall
10:45am - 12:45pm	PDC: “Automotive Electronics Reliability – Assurance Approaches and Challenges” II Location: MOA 4 Course instructor: Pradeep Lall
2:40pm - 3:55pm	Opto1_Photonic Module Packaging Location: MOA 4 Chair: Henning Schröder, Fraunhofer IZM 2:40pm - 3:05pm Array Packaging with Integrated Mirrors for High Power Multi-chip UVC-LED Modules Ulli Hansen, Xiaodong Hu, Simon Maus, Oliver Gyenge 3:05pm - 3:30pm Modular Integration of Quantum Cascade Lasers and Drivers in Glass Bench Gunnar Böttger, Michael Häußler, Lasse Felix Weißenburg, Martin Hempel, Ralf Ziegler, Martin Schneider-Ramelow 3:30pm - 3:55pm Improving the Thermal Management of Power LED Arrays with Diamonds Shusmitha Kyatam, Antonio A. Marques, Luis Rodrigues, Luis Nero Alves, Joana Catarina Mendes
5:00pm - 6:15pm	Opto2_Heterogenous PIC Integration Location: MOA 4 Chair: Giovanni Delrosso, VTT 5:00pm - 5:25pm Laser-Assisted Bonding of a Miniature Multichannel Laser Diode Chip to a Silicon Photonics Integrated Circuit with Through-Silicon Alignment Aleksandr Vlasov, Santeri Lehtinen, Evgenii Lepukhov, Heikki Virtanen, Samu-Pekka Ojanen, Jukka Viheriälä, Mircea Guina 5:25pm - 5:50pm Over 100-GHz Bridge Chip Interconnection Between Photonic and Electrical ICs with a Heat-insulating Stress-relief Membrane Structure Taichi Misawa, Hiroshi Uemura, Keiji Tanaka, Katsumi Uesaka, Yoichiro Kurita 5:50pm - 6:15pm Advanced Ultrathin Spray Coating Process Technology for Heterogeneous Integration Applications Johanna Rimboeck, Stefan Ertl, Prasanna Ramaswamy, Alex Farrell, Ali Uzun, Mariana Pires, Brian Corbett, Ruggero Loi, Ksenija Varga, Peter Ossieur

Date: Thursday, 12/Sept/2024
9:15am - 10:30am	AMT1_Innovative Assembly Processes Location: MOA 4 Chair: Attila Géczy, Budapest University of Technology and Economics 9:15am - 9:40am Secondary Optics Assembly for Micro Concentrating Photovoltaics: A Parallelized and Scalable Approach Marcus Voitel, Elisa Kaiser, Salar Mehrafsun, Maike Wiesenfarth, Henning Helmers, Karl-Friedrich Becker, Tanja Braun, Martin Schneider-Ramelow 9:40am - 10:05am Massive Parallel Assembly and Interconnection for Micro-LEDs – a Technical Feasibility Study Charles-Alix Manier, Kai Zoschke, Hermann Oppermann 10:05am - 10:30am Tape Frozen Detachment Process Using Freeze Chuck for Chip to Wafer Tadatomo Yamada, Ken Takano, Toshiaki Menjo, Shinya Takyu
11:00am - 12:15pm	AMT2_Computer-aided Process Control Location: MOA 4 Chair: Erik Jung, Fraunhofer IZM 11:00am - 11:25am Advancements in Epoxy Pattern Quality Checks: Harnessing Artificial Intelligence for Enhanced Low-Contrast Analysis Guodong Zeng, Farnaz Forooghifar, Andreas Wiedmer, Ernst Barmettler, Norbert Ackerl 11:25am - 11:50am Dicing Lane Quality Quantification & Wafer Assessment Using Image Thresholding Techniques Damien Jon Leech, Akito Hiro, Geert Schoofs, Bensu Tunca Altintas, Alain Phommahaxay, Koen Kennes, Gerald Beyer, Eric Beyne 11:50am - 12:15pm AI Deep-Learning Approach for Manufacturing Optimization During Chiplets and Heterogeneous Package Inspection Shahab Chitchian, SeungYeol Kim, TaeYoung Jung, TaeYong Lee, ByeongGweon Joo
1:45pm - 3:15pm	AMT3_Process for Enhancement of Device Robustness Location: MOA 4 Chair: David Henry, CEA LETI 1:45pm - 2:10pm Advanced Wafer Singulation Technique for Miniaturized Metal-oxide (MOX) Micro-hotplates Based Gas Analyzer Serguei Stoukatch, Francois Dupont, Jean-Michel Redouté 2:10pm - 2:35pm Characterizations of Metal-based Thermal Interface Materials (TIM) in a Singulated Flip Chip Ball Grid Array Package Ming-Che Hsieh, Pu-Shan Huang, Chi-Yuan Chen, Stanley Lin, JoonYoung Choi, WooSoon Kim, YoungCheol Kim 2:35pm - 3:00pm Automated Highspeed Characterization of Optical Waveguide in large-format Glass Substrates Hashem Al-Shami, Julian Schwietering, Henning Schröder
3:45pm - 5:15pm	Emerging II Location: MOA 4 Chair: Martin Schneider-Ramelow, Fraunhofer IZM 10 Golden Rules of Chip- Package- Board Interactions Evelyn Napetschnig Trench-Based Fully Integrated Capacitors for Power Delivery in Heterogeneous Integration Platforms Yousef Safari, Yushu Zhao, Boris Vaisband Sustainable Temperature and Pressure Sensing Solution for Tire Kimmo Antero Keränen, Timo Kurkela, Jyrki Ollila, Antti Tanskanen, Marko Korkalainen, Antoine Balin

Date: Friday, 13/Sept/2024
9:15am - 10:30am	AMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration Location: MOA 4 Chair: Hoang-Vu Nguyen, University of South-Eastern Norway 9:15am - 9:40am First Electrical Performance of Self-assembly Applied to Die-to-wafer Hybrid Bonding Adèle Thiolon, Pierre Montméat, Thierry Enot, Alice Bond, Carine Ladner, Loic Sanchez, Alain Campo, Thomas Magis, Floriane Baudin, Sébastien Dominguez, Frank Fournel, Emilie Bourjot 9:40am - 10:05am BiCMOS BEOL Coupon Fabrication and Micro Transfer Printing for Heterogeneous Integration Applications Selin Tolunay Wipf, Steffen Marschmeyer, Martin Drost, Ketan Anand, Matthias Wietstruck 10:05am - 10:30am Impact of Dielectric Types & Surface Profile on Wafer-to-Wafer Hybrid Bonding Vikas Dubey, Dirk Wünsch, Knut Gottfried, Tobias Fischer, Lutz Hofmann, Maik Wiemer, Stefan E. Schulz
11:00am - 12:15pm	AMT5_Advanced Materials and Processes Location: MOA 4 Chair: Attila Géczy, Budapest University of Technology and Economics 11:00am - 11:25am Thin Substrate Bonding Partia Naghibi 11:25am - 11:50am System-in-package Building block Development for Future Space Equipment Hélène Jochem, Hugo Garcia, Norbert Venet, Mirko Rocci, Lucas Sollecchia, Paolo Scalmati, Monique Mayr, Carlo Tuninetti, Giovanni Cucinella, Kim Ankeraa, Poul Juul 11:50am - 12:15pm Single Die Process Using Shadow Masks for a 55µm Fine Pitch Array of 4µm-tall Indium Bumps Across an Entire Chip Andreas Schneider, Aswathi Koorikkat, Navid Ghorbanian, Toby G. Brookes, John D. Lipp, David Burt, Marcus J. French
1:45pm - 3:00pm	AMT6_Enhanced Process Control Location: MOA 4 Chair: Knut E. Aasmundtveit, University of South-Eastern Norway 1:45pm - 2:10pm Invited Paper: A Novel Approach for Wafer level Solder Reflow and Cleaning of Semiconductor Wafer in Silicon Photonics, MEMS and Advanced Packaging Daniel Lieske 2:10pm - 2:35pm In-situ Measurement of HCOOH, CO2 and H2O Concentrations During Formic Acid Reflow Soldering Aaron Hutzler 2:35pm - 3:00pm Enhanced Process Control for Dry Etching of Functional TiN Structures on 300 mm Wafer Level. Johann Fell, Steffen Bickel, Conny Fiedler, Annekatrin Delan, Manuela Junghähnel

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