Conference Agenda

Session Overview
Location: MOA 5
MOA 5
 
Date: Wednesday, 11/Sept/2024
8:30am
-
10:30am
PDC: “Advanced Packaging for MEMS and Sensors” I
Location: MOA 5

Course instructor: Horst Theuss

10:45am
-
12:45pm
PDC: “Advanced Packaging for MEMS and Sensors” II
Location: MOA 5

Course instructor: Horst Theuss

2:40pm
-
3:55pm
AP1_Advanced Substrates
Location: MOA 5
Chair: Andreas Ostmann, IZM
5:00pm
-
6:15pm
AP2_Hybrid Bonding I
Location: MOA 5
Chair: E Jan Vardaman, TechSearch International, Inc.

 
Date: Thursday, 12/Sept/2024
9:15am
-
10:30am
AP3_Hybrid Bonding II
Location: MOA 5
Chair: Rolf Aschenbrenner, Fraunhofer IZM
11:00am
-
12:15pm
AP4_Advances in WLP Technologies I
Location: MOA 5
Chair: Rolf Aschenbrenner, Fraunhofer IZM
1:45pm
-
3:15pm
AP5_Advances in WLP Technologies II
Location: MOA 5
Chair: Michael Schiffer, Fraunhofer IZM
3:45pm
-
5:15pm
AP6_Challenges and Solutions for HI
Location: MOA 5
Chair: Kay Essig, ASE Group

 
Date: Friday, 13/Sept/2024
9:15am
-
10:30am
AP7_Fan Out Packages
Location: MOA 5
Chair: Erik Jung, Fraunhofer IZM
11:00am
-
12:15pm
AP8_Fan Out Reliability Aspects
Location: MOA 5
Chair: Grace O'Malley, INEMI
1:45pm
-
3:00pm
AP9_Power Electronics Packaging
Location: MOA 5
Chair: Klaus Pressel, Infineon