|
Session Overview | |
|
Location: MOA 5 MOA 5 |
|
| |
| 8:30am - 10:30am |
PDC: “Advanced Packaging for MEMS and Sensors” I Location: MOA 5 Course instructor: Horst Theuss |
| 10:45am - 12:45pm |
PDC: “Advanced Packaging for MEMS and Sensors” II Location: MOA 5 Course instructor: Horst Theuss |
| 2:40pm - 3:55pm |
AP1_Advanced Substrates Location: MOA 5 Chair: Andreas Ostmann, IZM |
| 5:00pm - 6:15pm |
AP2_Hybrid Bonding I Location: MOA 5 Chair: E Jan Vardaman, TechSearch International, Inc. |
|
| |
| 9:15am - 10:30am |
AP3_Hybrid Bonding II Location: MOA 5 Chair: Rolf Aschenbrenner, Fraunhofer IZM |
| 11:00am - 12:15pm |
AP4_Advances in WLP Technologies I Location: MOA 5 Chair: Rolf Aschenbrenner, Fraunhofer IZM |
| 1:45pm - 3:15pm |
AP5_Advances in WLP Technologies II Location: MOA 5 Chair: Michael Schiffer, Fraunhofer IZM |
| 3:45pm - 5:15pm |
AP6_Challenges and Solutions for HI Location: MOA 5 Chair: Kay Essig, ASE Group |
|
| |
| 9:15am - 10:30am |
AP7_Fan Out Packages Location: MOA 5 Chair: Erik Jung, Fraunhofer IZM |
| 11:00am - 12:15pm |
AP8_Fan Out Reliability Aspects Location: MOA 5 Chair: Grace O'Malley, INEMI |
| 1:45pm - 3:00pm |
AP9_Power Electronics Packaging Location: MOA 5 Chair: Klaus Pressel, Infineon |