Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

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Only Sessions at Location/Venue		Sessions at any Location/Venue  -----  uncertain [0]  MOA 10-12 [17]  MOA 5 [11]  MOA 4 [11]  MOA 3 [11]  MOA 1+2 [11]  Foyer [0]  Atrium [13]

Session Overview

Location: MOA 5 MOA 5

Date: Wednesday, 11/Sept/2024
8:30am - 10:30am	PDC: “Advanced Packaging for MEMS and Sensors” I Location: MOA 5 Course instructor: Horst Theuss more Info
10:45am - 12:45pm	PDC: “Advanced Packaging for MEMS and Sensors” II Location: MOA 5 Course instructor: Horst Theuss more Info
2:40pm - 3:55pm	AP1_Advanced Substrates Location: MOA 5 Chair: Andreas Ostmann, IZM
5:00pm - 6:15pm	AP2_Hybrid Bonding I Location: MOA 5 Chair: E Jan Vardaman, TechSearch International, Inc.

Date: Thursday, 12/Sept/2024
9:15am - 10:30am	AP3_Hybrid Bonding II Location: MOA 5 Chair: Rolf Aschenbrenner, Fraunhofer IZM
11:00am - 12:15pm	AP4_Advances in WLP Technologies I Location: MOA 5 Chair: Rolf Aschenbrenner, Fraunhofer IZM
1:45pm - 3:15pm	AP5_Advances in WLP Technologies II Location: MOA 5 Chair: Michael Schiffer, Fraunhofer IZM
3:45pm - 5:15pm	AP6_Challenges and Solutions for HI Location: MOA 5 Chair: Kay Essig, ASE Group

Date: Friday, 13/Sept/2024
9:15am - 10:30am	AP7_Fan Out Packages Location: MOA 5 Chair: Erik Jung, Fraunhofer IZM
11:00am - 12:15pm	AP8_Fan Out Reliability Aspects Location: MOA 5 Chair: Grace O'Malley, INEMI
1:45pm - 3:00pm	AP9_Power Electronics Packaging Location: MOA 5 Chair: Klaus Pressel, Infineon