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Session Overview | |
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Location: MOA 10-12 MOA 10-12 |
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| 8:30am - 10:30am |
„IEEE EPS Heterogeneous Integration Roadmap“ (HIR) I Location: MOA 10-12 |
| 10:45am - 12:45pm |
„IEEE EPS Heterogeneous Integration Roadmap“ (HIR) II Location: MOA 10-12 |
| 1:30pm - 1:45pm |
Opening Location: MOA 10-12 Opening remarks Tanja Braun General Chair IEEE ESTC2024 Welcome on behalf of the German Ministry for Education and Research (BMBF) Engelbert Beyer Deputy Director-General of Directorate 51, Technology-Oriented Research for Innovation, BMBF, Germany |
| 1:45pm - 2:30pm |
Keynote 1 Location: MOA 10-12 "A Vision for Modular, Ubiquitous and Scalable Compute Systems" Bernd Waidhas Principal Engineer, Silicon Packaging Architecture, Intel |
| 2:40pm - 3:55pm |
MIP1_Advanced Material Architectures for Interconnects Location: MOA 10-12 Chair: Glenn Hamilton Ross, Aalto University |
| 4:25pm - 4:55pm |
Exhibitor Pitches Location: MOA 10-12 |
| 5:00pm - 6:15pm |
MIP2_Advanced Interconnection Metallurgical Materials and Interconnects Location: MOA 10-12 Chair: Ali Roshanghias, Silicon Austria Labs GmbH |
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| 8:30am - 9:15am |
Keynote 2 Location: MOA 10-12 "Electronics Integration: Challenges in Computed Tomography Scanners" Dr. Michael Hosemann Head of Digital Electronics at Healthineers Computed Tomography Detector Center, Siemens |
| 9:15am - 10:30am |
MIP3_Low-temperature Materials for Interconnects and Packaging Location: MOA 10-12 Chair: Hiroshi Nishikawa, Osaka University |
| 11:00am - 12:15pm |
Emerging I_From Mounting to Recycling – Highlites from Emerging Technologies Location: MOA 10-12 Chair: Martin Oppermann, TU Dresden |
| 1:45pm - 3:15pm |
Special Session Location: MOA 10-12 Chair: Steffen Kroehnert, ESPAT-Consulting Chair: Klaus Pressel, Infineon The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing I IPCEI ME/CT and Pack4EU/ EU CHIPS ACT |
| 3:45pm - 5:15pm |
Special Session Location: MOA 10-12 Chair: Klaus Pressel, Infineon Chair: Steffen Kroehnert, ESPAT-Consulting The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing II IPCEI ME/CT and Pack4EU/ EU CHIPS ACT |
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| 8:30am - 9:15am |
Keynote 3 Location: MOA 10-12 "Challenges and Opportunities of Semiconductor Packaging in the Chiplet Era" Dr. Yasumitsu Orii Senior Managing Executive Officer in 3D Assembly Division, Rapidus Corporation |
| 9:15am - 10:30am |
MIP4_Mechanical properties of Materials for Interconnects Location: MOA 10-12 Chair: Glenn Hamilton Ross, Aalto University |
| 11:00am - 12:15pm |
MIP5_Microstructural Properties of Materials for Interconnects Location: MOA 10-12 Chair: Kay Essig, ASE Group |
| 1:45pm - 3:00pm |
MIP6_New materials for Heterogeneous Integration Location: MOA 10-12 Chair: Nikhilendu Tiwary, Aalto University |
| 3:10pm - 3:55pm |
Keynote 4 Location: MOA 10-12 "CHIPS -NAPMP: Overview and Next Steps" George Orji Deputy Director of CHIPS NAPMP, USA |