Conference Agenda

Session Overview
Location: MOA 10-12
MOA 10-12
 
Date: Wednesday, 11/Sept/2024
8:30am
-
10:30am
„IEEE EPS Heterogeneous Integration Roadmap“ (HIR) I
Location: MOA 10-12
10:45am
-
12:45pm
„IEEE EPS Heterogeneous Integration Roadmap“ (HIR) II
Location: MOA 10-12
1:30pm
-
1:45pm
Opening
Location: MOA 10-12

Opening remarks
Tanja Braun
General Chair IEEE ESTC2024

Welcome on behalf of the German Ministry for Education and Research (BMBF)
Engelbert Beyer
Deputy Director-General of Directorate 51, Technology-Oriented Research for Innovation, BMBF, Germany

1:45pm
-
2:30pm
Keynote 1
Location: MOA 10-12

"A Vision for Modular, Ubiquitous and Scalable Compute Systems"

Bernd Waidhas
Principal Engineer, Silicon Packaging Architecture, Intel




2:40pm
-
3:55pm
MIP1_Advanced Material Architectures for Interconnects
Location: MOA 10-12
Chair: Glenn Hamilton Ross, Aalto University
4:25pm
-
4:55pm
Exhibitor Pitches
Location: MOA 10-12
5:00pm
-
6:15pm
MIP2_Advanced Interconnection Metallurgical Materials and Interconnects
Location: MOA 10-12
Chair: Ali Roshanghias, Silicon Austria Labs GmbH

 
Date: Thursday, 12/Sept/2024
8:30am
-
9:15am
Keynote 2
Location: MOA 10-12

"Electronics Integration: Challenges in Computed Tomography Scanners"

Dr. Michael Hosemann
Head of Digital Electronics at Healthineers Computed Tomography Detector Center, Siemens




9:15am
-
10:30am
MIP3_Low-temperature Materials for Interconnects and Packaging
Location: MOA 10-12
Chair: Hiroshi Nishikawa, Osaka University
11:00am
-
12:15pm
Emerging I_From Mounting to Recycling – Highlites from Emerging Technologies
Location: MOA 10-12
Chair: Martin Oppermann, TU Dresden
1:45pm
-
3:15pm
Special Session
Location: MOA 10-12
Chair: Steffen Kroehnert, ESPAT-Consulting
Chair: Klaus Pressel, Infineon

The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing I
IPCEI ME/CT and Pack4EU/ EU CHIPS ACT



3:45pm
-
5:15pm
Special Session
Location: MOA 10-12
Chair: Klaus Pressel, Infineon
Chair: Steffen Kroehnert, ESPAT-Consulting

The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing II
IPCEI ME/CT and Pack4EU/ EU CHIPS ACT




 
Date: Friday, 13/Sept/2024
8:30am
-
9:15am
Keynote 3
Location: MOA 10-12

"Challenges and Opportunities of Semiconductor Packaging in the Chiplet Era"

Dr. Yasumitsu Orii
Senior Managing Executive Officer in 3D Assembly Division, Rapidus Corporation




9:15am
-
10:30am
MIP4_Mechanical properties of Materials for Interconnects
Location: MOA 10-12
Chair: Glenn Hamilton Ross, Aalto University
11:00am
-
12:15pm
MIP5_Microstructural Properties of Materials for Interconnects
Location: MOA 10-12
Chair: Kay Essig, ASE Group
1:45pm
-
3:00pm
MIP6_New materials for Heterogeneous Integration
Location: MOA 10-12
Chair: Nikhilendu Tiwary, Aalto University
3:10pm
-
3:55pm
Keynote 4
Location: MOA 10-12

"CHIPS -NAPMP: Overview and Next Steps"

George Orji
Deputy Director of CHIPS NAPMP, USA