IEEE ESTC 2024

September 11–13, 2024 | Berlin, Germany

JavaScript is Disabled
Your browser's JavaScript functionality is disabled. It has to be enabled to use this function of ConfTool.
Here you can find information on how to enable JavaScript
If you have any problems, please contact the organizers at office@estc-conference.net.

Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview
Location: MOA 10-12 MOA 10-12

Date: Wednesday, 11/Sept/2024
8:30am - 10:30am	„IEEE EPS Heterogeneous Integration Roadmap“ (HIR) I Location: MOA 10-12
10:45am - 12:45pm	„IEEE EPS Heterogeneous Integration Roadmap“ (HIR) II Location: MOA 10-12
1:30pm - 1:45pm	Opening Location: MOA 10-12 Opening remarks Tanja Braun General Chair IEEE ESTC2024 Welcome on behalf of the German Ministry for Education and Research (BMBF) Engelbert Beyer Deputy Director-General of Directorate 51, Technology-Oriented Research for Innovation, BMBF, Germany
1:45pm - 2:30pm	Keynote 1 Location: MOA 10-12 "A Vision for Modular, Ubiquitous and Scalable Compute Systems" Bernd Waidhas Principal Engineer, Silicon Packaging Architecture, Intel
2:40pm - 3:55pm	MIP1_Advanced Material Architectures for Interconnects Location: MOA 10-12 Chair: Glenn Hamilton Ross, Aalto University 2:40pm - 3:05pm Solid-state Growth Kinetics of Compound Layers in Electroplated Cu-In Layer Systems Steffen Bickel, Juliana Panchenko, Manuela Junghähnel 3:05pm - 3:30pm Superconducting Superlattice Interconnects for Cryogenic Systems Charles Bon-mardion, Edouard Deschaseaux, Thierry Farjot, Alain Campo, Frédéric Ritton, Rémi Vélard, Hélène Duchemin, Céline Feautrier, Jean-Luc Sauvageot, Jean Charbonnier, Candice Thomas 3:30pm - 3:55pm Aluminium-Aluminium Wafer Level Thermo Compression Bonding Using Thick Electroplated Aluminium Bonding Frames Silvia Braun, Imants Cirulis, Klaus Vogel, Christian Hofmann, Maik Wiemer
4:25pm - 4:55pm	Exhibitor Pitches Location: MOA 10-12
5:00pm - 6:15pm	MIP2_Advanced Interconnection Metallurgical Materials and Interconnects Location: MOA 10-12 Chair: Ali Roshanghias, Silicon Austria Labs GmbH 5:00pm - 5:25pm Tuning of Copper Grain Size for Integration in Hybrid Bonding Applications Sarabjot Singh, Kathleen Dunn 5:25pm - 5:50pm Fine Pitch Aluminum Hybrid Bonding at Wafer Level: Overcoming the Challenges in Plating, Passivation and Planarization Imants Cirulis, Vikas Dubey, Silvia Braun, Dirk Wünsch, Maik Wiemer 5:50pm - 6:15pm Surface Activated Bonding for Hybrid and All-metal 3D (AM3D) Interconnect Tadatomo Suga, Kanji Otsuka, Junsha Wang

Date: Thursday, 12/Sept/2024
8:30am - 9:15am	Keynote 2 Location: MOA 10-12 "Electronics Integration: Challenges in Computed Tomography Scanners" Dr. Michael Hosemann Head of Digital Electronics at Healthineers Computed Tomography Detector Center, Siemens
9:15am - 10:30am	MIP3_Low-temperature Materials for Interconnects and Packaging Location: MOA 10-12 Chair: Hiroshi Nishikawa, Osaka University 9:15am - 9:40am Low Temperature Die-attach Bonding Using Copper Particle Free Inks Fabian Steinberger, Nihesh Mohan, Olaf Rämer, Gordon Elger 9:40am - 10:05am Cu–(Sn–Bi) SLID Bond Microstructure Under Different Bonding Temperatures Lisette Hernandez Gonzalez, Knut E. Aasmundtveit, Hoang-Vu Nguyen 10:05am - 10:30am Die Shear Strength of Au-In-Bi SLID Bonds at Elevated Temperatures GAYATHRY THAMPI, HOANG-VU NGUYEN, KNUT EILIF AASMUNDTVEIT
11:00am - 12:15pm	Emerging I_From Mounting to Recycling – Highlites from Emerging Technologies Location: MOA 10-12 Chair: Martin Oppermann, TU Dresden 11:00am - 11:25am Feasibility of Micro-grass on Silicon Cap as An Alternative Antireflective Layer in Vacuum Packaging of Microbolometer Arrays Hoang-Vu Nguyen, Eivind Bardalen 11:25am - 11:50am Biodegradable PCBs with PLA/flax Substrate: FTIR and SEM Analysis of Degradation Attila Géczy, Lívia Gyenizse, Csaba Farkas, Dániel Rigler, Balázs Sáfár, András Csiszár 11:50am - 12:15pm A Novel Ultra-thin Dicing Die Attach Film for Various Dicing Processes Masanori Yamagishi, Yutaro Ishii, Tomoka Kirihata, Manabu Miyawaki
1:45pm - 3:15pm	Special Session Location: MOA 10-12 Chair: Steffen Kroehnert, ESPAT-Consulting Chair: Klaus Pressel, Infineon The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing I IPCEI ME/CT and Pack4EU/ EU CHIPS ACT
3:45pm - 5:15pm	Special Session Location: MOA 10-12 Chair: Klaus Pressel, Infineon Chair: Steffen Kroehnert, ESPAT-Consulting The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing II IPCEI ME/CT and Pack4EU/ EU CHIPS ACT

Date: Friday, 13/Sept/2024
8:30am - 9:15am	Keynote 3 Location: MOA 10-12 "Challenges and Opportunities of Semiconductor Packaging in the Chiplet Era" Dr. Yasumitsu Orii Senior Managing Executive Officer in 3D Assembly Division, Rapidus Corporation
9:15am - 10:30am	MIP4_Mechanical properties of Materials for Interconnects Location: MOA 10-12 Chair: Glenn Hamilton Ross, Aalto University 9:15am - 9:40am Prediction of High Strain Rate Properties of Bi-doped SnAgCu Solders after Sustained High-temperature Operation Pradeep Lall, Vishal Mehta, Mrinmoy Saha 9:40am - 10:05am Quantification of Adhesion Strength and Mechanism of Adhesion Degradation Between Sputtered SUS304 and Mold Resin in Electromagnetic Wave Shield Packages Soichi Homma, Daichi Okada, Akihito Sawanobori, Susumu Yamamoto, Hiroshi Nishikawa 10:05am - 10:30am Effect of Minor Element Addition on Mechanical Properties and Microstructure of Sn-Bi Alloys Hiroshi Nishikawa, Yuki Hirata, Shiqi Zhou, Chih-han Yang, Shih-kang Lin
11:00am - 12:15pm	MIP5_Microstructural Properties of Materials for Interconnects Location: MOA 10-12 Chair: Kay Essig, ASE Group 11:00am - 11:25am Effect of Electromigration on Micro Tensile Test Mechanical Properties and Micro Structure of Pure Copper Chih-Yu Wang, Kwang-Lung Lin 11:25am - 11:50am Thermal-Mechanical Analysis of Electroplated Copper for IC Packaging Abdellah Salahouelhadj, Kris Vanstreels, Joke De Messemaeker, Carine Gerets, John Slabbekoorn, Zaid El-Mekki, Punith Kumar Mudigere Krishne Gowda, Mario Gonzalez, Eric Beyne 11:50am - 12:15pm Study of Intermetallic Compound Evolution of Pure Sn and SnAg Alloy Solder on Single and Multi-layer Under-bump Materials Tassawar Hussain, Jaber Derakhshandeh, Tom Cochet, Eric Beyne, Jack Hsu, Dongming He, Ingrid De Wolf
1:45pm - 3:00pm	MIP6_New materials for Heterogeneous Integration Location: MOA 10-12 Chair: Nikhilendu Tiwary, Aalto University 1:45pm - 2:10pm Development of Novel BT Laminate Materials for mmWave Antenna and Heterogeneous Integration Masashi Okaniwa, Yuji Kamata, Amane Matsunaga, Takashi Kobayashi, Takaaki Ogashiwa 2:10pm - 2:35pm Parylene as a Novel Material for Adhesive Bonding, Flexible Electronics and Wafer Level Packaging Franz Selbmann, Martin Kühn, Frank Roscher, Maik Wiemer, Harald Kuhn, Yvonne Joseph 2:35pm - 3:00pm Manufacturing and Characterization of Thin-Film Tantalum Pentoxide Integrated Capacitors Andrei Costina, Markus Wöhrmann, Michael Schiffer, Martin Schneider-Ramelow
3:10pm - 3:55pm	Keynote 4 Location: MOA 10-12 "CHIPS -NAPMP: Overview and Next Steps" George Orji Deputy Director of CHIPS NAPMP, USA

Mobile View Print View

Contact and Legal Notice · Contact Address:
Privacy Statement · Conference: IEEE ESTC 2024