IEEE ESTC 2024

September 11–13, 2024 | Berlin, Germany

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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview
Location: MOA 10-12 MOA 10-12

Date: Wednesday, 11/Sept/2024
8:30am - 10:30am	„IEEE EPS Heterogeneous Integration Roadmap“ (HIR) I Location: MOA 10-12
10:45am - 12:45pm	„IEEE EPS Heterogeneous Integration Roadmap“ (HIR) II Location: MOA 10-12
1:30pm - 1:45pm	Opening Location: MOA 10-12 Opening remarks Tanja Braun General Chair IEEE ESTC2024 Welcome on behalf of the German Ministry for Education and Research (BMBF) Engelbert Beyer Deputy Director-General of Directorate 51, Technology-Oriented Research for Innovation, BMBF, Germany
1:45pm - 2:30pm	Keynote 1 Location: MOA 10-12 "A Vision for Modular, Ubiquitous and Scalable Compute Systems" Bernd Waidhas Principal Engineer, Silicon Packaging Architecture, Intel
2:40pm - 3:55pm	MIP1_Advanced Material Architectures for Interconnects Location: MOA 10-12 Session Chair: Glenn Hamilton Ross, Aalto University
4:25pm - 4:55pm	Exhibitor Pitches Location: MOA 10-12
5:00pm - 6:15pm	MIP2_Advanced Interconnection Metallurgical Materials and Interconnects Location: MOA 10-12 Session Chair: Ali Roshanghias, Silicon Austria Labs GmbH

Date: Thursday, 12/Sept/2024
8:30am - 9:15am	Keynote 2 Location: MOA 10-12 "Electronics Integration: Challenges in Computed Tomography Scanners" Dr. Michael Hosemann Head of Digital Electronics at Healthineers Computed Tomography Detector Center, Siemens
9:15am - 10:30am	MIP3_Low-temperature Materials for Interconnects and Packaging Location: MOA 10-12 Session Chair: Hiroshi Nishikawa, Osaka University
11:00am - 12:15pm	Emerging I_From Mounting to Recycling – Highlites from Emerging Technologies Location: MOA 10-12 Session Chair: Martin Oppermann, TU Dresden
1:45pm - 3:15pm	Special Session Location: MOA 10-12 Session Chair: Steffen Kroehnert, ESPAT-Consulting Session Chair: Klaus Pressel, Infineon The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing I IPCEI ME/CT and Pack4EU/ EU CHIPS ACT
3:45pm - 5:15pm	Special Session Location: MOA 10-12 Session Chair: Klaus Pressel, Infineon Session Chair: Steffen Kroehnert, ESPAT-Consulting The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing II IPCEI ME/CT and Pack4EU/ EU CHIPS ACT

Date: Friday, 13/Sept/2024
8:30am - 9:15am	Keynote 3 Location: MOA 10-12 "Challenges and Opportunities of Semiconductor Packaging in the Chiplet Era" Dr. Yasumitsu Orii Senior Managing Executive Officer in 3D Assembly Division, Rapidus Corporation
9:15am - 10:30am	MIP4_Mechanical properties of Materials for Interconnects Location: MOA 10-12 Session Chair: Glenn Hamilton Ross, Aalto University
11:00am - 12:15pm	MIP5_Microstructural Properties of Materials for Interconnects Location: MOA 10-12 Session Chair: Kay Essig, ASE Group
1:45pm - 3:00pm	MIP6_New materials for Heterogeneous Integration Location: MOA 10-12 Session Chair: Nikhilendu Tiwary, Aalto University
3:10pm - 3:55pm	Keynote 4 Location: MOA 10-12 "CHIPS -NAPMP: Overview and Next Steps" George Orji Deputy Director of CHIPS NAPMP, USA

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