Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview |
| Date: Friday, 13/Sept/2024 | |||||
| 8:30am - 9:15am |
Keynote 3 Location: MOA 10-12 "Challenges and Opportunities of Semiconductor Packaging in the Chiplet Era" Dr. Yasumitsu Orii Senior Managing Executive Officer in 3D Assembly Division, Rapidus Corporation |
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| 8:30am - 1:45pm |
Exhibition Location: Atrium |
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| 9:15am - 10:30am |
MIP4_Mechanical properties of Materials for Interconnects Location: MOA 10-12 Chair: Glenn Hamilton Ross, Aalto University |
AP7_Fan Out Packages Location: MOA 5 Chair: Erik Jung, Fraunhofer IZM |
AMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration Location: MOA 4 Chair: Hoang-Vu Nguyen, University of South-Eastern Norway |
Flex1_Reliability Assessment of Flexible Electronics Location: MOA 3 Chair: Jean Charles Souriau, CEA-Leti |
RF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems Location: MOA 1+2 Chair: Matthias Wietstruck, IHP - Leibniz Institut für innovative Mikroelektronik |
| 10:30am - 11:00am |
Coffee Break & Exhibition Location: Atrium |
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| 10:30am - 11:45am |
Poster Session 3 Location: Atrium Chair: Karl-Friedrich Becker, Fraunhofer IZM |
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| 11:00am - 12:15pm |
MIP5_Microstructural Properties of Materials for Interconnects Location: MOA 10-12 Chair: Kay Essig, ASE Group |
AP8_Fan Out Reliability Aspects Location: MOA 5 Chair: Grace O'Malley, INEMI |
AMT5_Advanced Materials and Processes Location: MOA 4 Chair: Attila Géczy, Budapest University of Technology and Economics |
Flex2_Formation of a Conductive Interconnection for Flexible Electronics Location: MOA 3 Chair: Jukka Hast, VTT Technical Research Centre of Finland ltd. |
Rel3_Progress in Failure Analytical and Material Testing Methods Location: MOA 1+2 Chair: Matthias Petzold, Fraunhofer IMWS |
| 12:15pm - 1:45pm |
Lunch |
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| 1:45pm - 3:00pm |
MIP6_New materials for Heterogeneous Integration Location: MOA 10-12 Chair: Nikhilendu Tiwary, Aalto University |
AP9_Power Electronics Packaging Location: MOA 5 Chair: Klaus Pressel, Infineon |
AMT6_Enhanced Process Control Location: MOA 4 Chair: Knut E. Aasmundtveit, University of South-Eastern Norway |
RF2_Embedded System-in-Package and Interconnections Technologies Location: MOA 3 Chair: Maurizio Cirillo, Rheinmetall Italia SpA |
Rel4_New Approaches in Reliability Simulation and Modelling Location: MOA 1+2 Chair: Olaf Wittler, Fraunhofer IZM |
| 3:00pm - 3:10pm |
Room Change Location: Atrium |
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| 3:10pm - 3:55pm |
Keynote 4 Location: MOA 10-12 "CHIPS -NAPMP: Overview and Next Steps" George Orji Deputy Director of CHIPS NAPMP, USA |
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| 3:55pm - 4:25pm |
Closing |
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