Prediction of High Strain Rate Properties of Bi-doped SnAgCu Solders after Sustained High-temperature Operation

Pradeep Lall, Vishal Mehta, Mrinmoy Saha

Quantification of Adhesion Strength and Mechanism of Adhesion Degradation Between Sputtered SUS304 and Mold Resin in Electromagnetic Wave Shield Packages

Soichi Homma, Daichi Okada, Akihito Sawanobori, Susumu Yamamoto, Hiroshi Nishikawa

Effect of Minor Element Addition on Mechanical Properties and Microstructure of Sn-Bi Alloys

Hiroshi Nishikawa, Yuki Hirata, Shiqi Zhou, Chih-han Yang, Shih-kang Lin

INVITED TALK: Accelerating the AI Economy through Heterogeneous Integration

CP Hung

Development of an Adaptive Re-distribution Patterning Process for Fan-out Packages with Embedded High I/O Components

Ruben Kahle, Lars Böttcher, Luc Steffen Borchardt, Dionysios Manessis, Anna Meierfrankenfeld, Andreas Zluc, Andrea Casto, Stefano Sergio Oggioni

On the Design and Fabrication of SMT-compatible 3D-Freeform Antennas Based on Compression Molding and Direct Cu-Metallization

Marc Dreissigacker, Friedrich Müller, Christian Tschoban, Tanja Braun, Karl-Friedrich Becker, Paul Perlwitz, Martin Schneider-Ramelow

First Electrical Performance of Self-assembly Applied to Die-to-wafer Hybrid Bonding

Adèle Thiolon, Pierre Montméat, Thierry Enot, Alice Bond, Carine Ladner, Loic Sanchez, Alain Campo, Thomas Magis, Floriane Baudin, Sébastien Dominguez, Frank Fournel, Emilie Bourjot

BiCMOS BEOL Coupon Fabrication and Micro Transfer Printing for Heterogeneous Integration Applications

Selin Tolunay Wipf, Steffen Marschmeyer, Martin Drost, Ketan Anand, Matthias Wietstruck

Impact of Dielectric Types & Surface Profile on Wafer-to-Wafer Hybrid Bonding

Vikas Dubey, Dirk Wünsch, Knut Gottfried, Tobias Fischer, Lutz Hofmann, Maik Wiemer, Stefan E. Schulz

Development and Reliability Assessment of a Flexible Printed Capacitive Sensor for Precise Twisting Movement Detection

Ahmed Zakwan, Colleen Stover, Rui Chen

Reliability Assessment of Temperature Sensors Integrated on Elastic Substrate

Tuomas Happonen, Petri Järvinen, Mikko Paakkolanvaara, Teemu Alajoki

Comparison of Electrical and Mechanical Properties of Stretchable Circuit Boards

Lukas Werft, Christine Kallmayer, Malte von Krshiwoblozki, Martin Schneider-Ramelow

Thin-Film Substrate-based mmWave Antennas for Automotive Radar Applications

Thi Huyen Le, Kavin Senthil Murugesan, Ivan Ndip, Lutz Gerhold, Habib Hichri, Ryohei Oishi, Reki Nakano, Martin Schneider-Ramelow

Fabrication and Implementation of BiCMOS BEOL Silicon Interposer Technologies with Integrated Metal Reflectors for Sub-THz Leaky-wave Antennas

Matthias Wietstruck, Patrick Krüger, Thomas Voß, Thomas Mausolf, Muhammad Faisal Bashir, Akanksha Bhutani

Broadband Antennas for High Performance 5G mmWave Modules

Thi Huyen Le, Ivan Ndip, Martin Schneider-Ramelow

An Overview of the Thick Film Copper Technology for Power Electronics

Jiri Hlina, Jan Reboun, Lukas Stepan, Marek Simonovsky

Monitoring Cu via Structures and Surrounding Dielectric Stack After CMP Process

Peter Basa, Attila Suto, Gyorgy Nadudvari, Silvia Poppa

Simulations of Thermocouple Measurements During Reactive Bonding Processes on LTCC Substrates

Adam Yuile, Nesrine Jaziri, Erik Wiss, Jens Müller, Steffen Wiese

Modelling the Influence of Stretched Molding Foil on the Overall Dimensions of Molded Packages.

Jurrian Zijl, Edwin Lamers, Thijs Besseling, Niels Nijenmanting

Mitigating Gas-induced Performance Degradation in High Reliability Electronic and Optoelectronic Systems

Alessio Corazza, Giovanni Zafarana, Enea Rizzi, Luca Mauri

Ag and SiO2 Mixed Powder Sintering System

Minoru Ueshima

Investigation of Side Wall Loss for Development of 6 µm Microbumps for 3D/2.5D Integration

Adil Shehzad, Maksym Myndyk, Manuela Junghähnel, Juliana Panchenko

Improving The Thinning Module Robustness Vis-a-vis the Bonding Misalignment & the TBM EBR

NADER JEDIDI, Koen Kennes, ALain Phommahaxay

LidroCUT - Laser Processing in Liquids for New Packaging Applications

Alexander Kanitz, Jan-Philipp Wessels, Jan Stefan Hoppius, Katharina Laake

Alignment Between Subsequent 3D Molding Layers for Optimized Performance of 3D Integrated Patch Antennas for Advanced Sensing Applications

Nyake Gahein-Sama, Marc Dreissigacker, Friedrich Müller, Christian Tschoban, Tanja Braun, Karl-Friedrich Becker, Martin Schneider-Ramelow

Use of 3D Printing Techniques in the Development of Electronic Systems, Support Stage in the Digital Transformation of the Laboratories

Miruna-Lucretia Comeaga, Madalin Vasile Moise, Octavian Dontu, Dan Andrei Luca

Evolved Finite Difference Model to Investigate Humidity-related Failure Modes for Microelectronic and Power Electronic Devices

Alexander Reichel, Falk Naumann, Marco Rudolph, Marcel Mittag, Sandy Klengel

Study of the Water and Steam Resistance of Thick Film Materials for Sensor Applications up to 300 °C

Maik Mueller, Sergey Saakyan, Marco Luniak, Heiko Pietruske, Eckhard Schleicher, Juliana Panchenko

Tape Automated Bonding of an ALPIDE Chip with Flexible PCB

David Novel, Alessandro Lega, Tiziano Facchinelli, Roberto Iuppa, Stefania Beolé, Pierluigi Bellutti

Direct Flip Chip Bonding on Laser Induced Graphene Structures for Low-cost Flexible Sensor Devices

Muhammad Hassan Malik, Lukas Neumaier, Fabiane Fantinelli Franco, Ali Roshanghias

Reliable Fabrication Methodology for Consistent Supercapacitor Performance

Irina Madalina Burcea, Rodica Cristina Negroiu, Bogdan Traian Mihailescu, Vasile Madalin Moise, Cristina Marghescu, Paul Svasta

Effect of Electromigration on Micro Tensile Test Mechanical Properties and Micro Structure of Pure Copper

Chih-Yu Wang, Kwang-Lung Lin

Thermal-Mechanical Analysis of Electroplated Copper for IC Packaging

Abdellah Salahouelhadj, Kris Vanstreels, Joke De Messemaeker, Carine Gerets, John Slabbekoorn, Zaid El-Mekki, Punith Kumar Mudigere Krishne Gowda, Mario Gonzalez, Eric Beyne

Study of Intermetallic Compound Evolution of Pure Sn and SnAg Alloy Solder on Single and Multi-layer Under-bump Materials

Tassawar Hussain, Jaber Derakhshandeh, Tom Cochet, Eric Beyne, Jack Hsu, Dongming He, Ingrid De Wolf

Power Delivery for AI/HPC Microprocessors

Mark Li, Vikas Gupta

Reliability and RF Performance Assessment of Heterogeneous Integrated FO-WLP Test Structure Packages for Mixed RF Digital Front-End Application

Jesse C. Riedl, Vincent Bortolussi, Christophe Chang, Didier Floriot, Jonathan Leroy, Romain Mathieu, Julien Perraud, Hermann Stieglauer, Gregory Uren, Benoit Lambert

No Warpage and Fast Cure: UV-molding for FOWLP/FOPLP

Markus Schindler, Severin Ringelstetter, Martin Bues, Tobias Königer, Kilian Kreul

Thin Substrate Bonding

Partia Naghibi

System-in-package Building block Development for Future Space Equipment

Hélène Jochem, Hugo Garcia, Norbert Venet, Mirko Rocci, Lucas Sollecchia, Paolo Scalmati, Monique Mayr, Carlo Tuninetti, Giovanni Cucinella, Kim Ankeraa, Poul Juul

Single Die Process Using Shadow Masks for a 55µm Fine Pitch Array of 4µm-tall Indium Bumps Across an Entire Chip

Andreas Schneider, Aswathi Koorikkat, Navid Ghorbanian, Toby G. Brookes, John D. Lipp, David Burt, Marcus J. French

Additively Manufactured Flexible Electronics with Selectively Soldered Surface-mounted Devices Utilising StarJet Technology

Daniel Straubinger, Zeba Khan, Peter Koltay, Roland Zengerle, Sabrina Kartmann, Zhe Shu

Electroless Nickel/Immersion Gold and Immersion Tin as Final Finish Solutions for Flexible Substrates in EV Batteries

Britta Schafsteller, Mario Rosin, Michael Schwaemmlein, Boris Kraft, Hubertus Mertens, Jasemin Tuerkelly, Sandra Nelle

Electrical Characterization of an ALPIDE Chip TAB Bonded with Flexible PCBs

David Novel, Alessandro Lega, Tiziano Facchinelli, Roberto Iuppa, Stefania Beolé, Pierluigi Bellutti

Full-field IR-Thermography for Bond-quality Inspection of Electroplated Aluminium Interconnects for Cryo-SiP Architectures

Bernhard Wunderle, Daniel May, Imants Cirulis, Silvia Braun, Uwe Zschenderlein, Jens Heilmann, Remi Pantou, Ralph Schacht, Mohamad Abo Ras

Using µ-RAMAN Spectroscopy to Inspect Sintered Interconnects

Gordon Elger, E Liu, Fabian Steinberger, Bernhard Wunderle, Zubair Mohd

Determination of Mechanical Properties for Copper in Plated Through Holes by Combination of Tensile Test and Nanoindentation

Janine Conrad, Olaf Wittler, Martin Schneider-Ramelow

Development of Novel BT Laminate Materials for mmWave Antenna and Heterogeneous Integration

Masashi Okaniwa, Yuji Kamata, Amane Matsunaga, Takashi Kobayashi, Takaaki Ogashiwa

Parylene as a Novel Material for Adhesive Bonding, Flexible Electronics and Wafer Level Packaging

Franz Selbmann, Martin Kühn, Frank Roscher, Maik Wiemer, Harald Kuhn, Yvonne Joseph

Manufacturing and Characterization of Thin-Film Tantalum Pentoxide Integrated Capacitors

Andrei Costina, Markus Wöhrmann, Michael Schiffer, Martin Schneider-Ramelow

Additive Fan-out Panel-level Processing for Power MOSFET Devices

Eric Rubingh, Edsger Smits, Francesca Chiappini, Roel Kusters, Tindara Verduci, Jackson Gualberto de Sousa, Thijs Bel, Jeroen van den Brand, Mark Luke Farrugia, Hero ‘t Mannetje

Advancing Packaging Solutions: Integrating Power Electronics Using LTCC Technology

Qaisar Khushi Muhammad, Peter Keil, Uwe Krieger, Manuel Heidenreich, Jörg Töpfer, Beate Capraro, Dirk Schabbel, Koji Koiwai

Thermal Diffusivity Investigation of a Heat Pipe

Corina Ruxandra Mitulescu, Bogdan-Traian Mihailescu, Mihai Branzei, Paul Svasta

Invited Paper: A Novel Approach for Wafer level Solder Reflow and Cleaning of Semiconductor Wafer in Silicon Photonics, MEMS and Advanced Packaging

Daniel Lieske

In-situ Measurement of HCOOH, CO2 and H2O Concentrations During Formic Acid Reflow Soldering

Aaron Hutzler

Enhanced Process Control for Dry Etching of Functional TiN Structures on 300 mm Wafer Level.

Johann Fell, Steffen Bickel, Conny Fiedler, Annekatrin Delan, Manuela Junghähnel

Integration of Microwave SMD Components into Organic Multilayer PCBs

Lorenzo Giambuzzi, Maurizio Cirillo, David Schütze, Martin Hempel, Thomas Löher

Integration of III-V Components of 5G Transceiver in Embedding PCB-based Technology

Tekfouy Lim, Stefan Kosmider, Kavin Senthil Murugesan, Andreas Ostmann

Passive Intermodulation Estimation of a Novel Printed Circuit Board Interconnection Technology Based on Static I-V

Karamat Adavi, Sebastian Quednau, Xaver Mueller, Daniel Ernst, Karsten Meier, Hanno Platz

AI-Driven Digital Twin for Real-Time Health Monitoring of Wide Band Gap Semiconductors in Power Electronic Applications

Alireza Mehrabi, Keyvan Yari, Willem D. van Driel, Rene H. Poelma

Damage Parameter: Proposed Index to Quantify the Durability of Sintered Nano Silver and Multilayer Aluminum Foil Die Attach Materials

Keisuke Wakamoto, Takukazu Otsuka, Ken Nakahara

Energy-Based Approach on Calculating Stand-off Height of Different Solder Joints

Antal Bakonyi, Ambrus Zelei