IEEE ESTC 2024

September 11–13, 2024 | Berlin, Germany

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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Date: Friday, 13/Sept/2024
8:30am - 9:15am	Keynote 3 Location: MOA 10-12 "Challenges and Opportunities of Semiconductor Packaging in the Chiplet Era" Dr. Yasumitsu Orii Senior Managing Executive Officer in 3D Assembly Division, Rapidus Corporation
8:30am - 1:45pm	Exhibition Location: Atrium
9:15am - 10:30am	MIP4_Mechanical properties of Materials for Interconnects Location: MOA 10-12 Chair: Glenn Hamilton Ross, Aalto University	AP7_Fan Out Packages Location: MOA 5 Chair: Erik Jung, Fraunhofer IZM	AMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration Location: MOA 4 Chair: Hoang-Vu Nguyen, University of South-Eastern Norway	Flex1_Reliability Assessment of Flexible Electronics Location: MOA 3 Chair: Jean Charles Souriau, CEA-Leti	RF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems Location: MOA 1+2 Chair: Matthias Wietstruck, IHP - Leibniz Institut für innovative Mikroelektronik
10:30am - 11:00am	Coffee Break & Exhibition Location: Atrium
10:30am - 11:45am	Poster Session 3 Location: Atrium Chair: Karl-Friedrich Becker, Fraunhofer IZM
11:00am - 12:15pm	MIP5_Microstructural Properties of Materials for Interconnects Location: MOA 10-12 Chair: Kay Essig, ASE Group	AP8_Fan Out Reliability Aspects Location: MOA 5 Chair: Grace O'Malley, INEMI	AMT5_Advanced Materials and Processes Location: MOA 4 Chair: Attila Géczy, Budapest University of Technology and Economics	Flex2_Formation of a Conductive Interconnection for Flexible Electronics Location: MOA 3 Chair: Jukka Hast, VTT Technical Research Centre of Finland ltd.	Rel3_Progress in Failure Analytical and Material Testing Methods Location: MOA 1+2 Chair: Matthias Petzold, Fraunhofer IMWS
12:15pm - 1:45pm	Lunch
1:45pm - 3:00pm	MIP6_New materials for Heterogeneous Integration Location: MOA 10-12 Chair: Nikhilendu Tiwary, Aalto University	AP9_Power Electronics Packaging Location: MOA 5 Chair: Klaus Pressel, Infineon	AMT6_Enhanced Process Control Location: MOA 4 Chair: Knut E. Aasmundtveit, University of South-Eastern Norway	RF2_Embedded System-in-Package and Interconnections Technologies Location: MOA 3 Chair: Maurizio Cirillo, Rheinmetall Italia SpA	Rel4_New Approaches in Reliability Simulation and Modelling Location: MOA 1+2 Chair: Olaf Wittler, Fraunhofer IZM
3:00pm - 3:10pm	Room Change Location: Atrium
3:10pm - 3:55pm	Keynote 4 Location: MOA 10-12 "CHIPS -NAPMP: Overview and Next Steps" George Orji Deputy Director of CHIPS NAPMP, USA
3:55pm - 4:25pm	Closing

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