Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
 
Session Overview
Date: Friday, 13/Sept/2024
8:30am
-
9:15am
Keynote 3
Location: MOA 10-12

"Challenges and Opportunities of Semiconductor Packaging in the Chiplet Era"

Dr. Yasumitsu Orii
Senior Managing Executive Officer in 3D Assembly Division, Rapidus Corporation




8:30am
-
1:45pm
Exhibition
Location: Atrium
9:15am
-
10:30am
MIP4_Mechanical properties of Materials for Interconnects
Location: MOA 10-12
Chair: Glenn Hamilton Ross, Aalto University
AP7_Fan Out Packages
Location: MOA 5
Chair: Erik Jung, Fraunhofer IZM
AMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration
Location: MOA 4
Chair: Hoang-Vu Nguyen, University of South-Eastern Norway
Flex1_Reliability Assessment of Flexible Electronics
Location: MOA 3
Chair: Jean Charles Souriau, CEA-Leti
RF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems
Location: MOA 1+2
Chair: Matthias Wietstruck, IHP - Leibniz Institut für innovative Mikroelektronik
10:30am
-
11:00am
Coffee Break & Exhibition
Location: Atrium
10:30am
-
11:45am
Poster Session 3
Location: Atrium
Chair: Karl-Friedrich Becker, Fraunhofer IZM
11:00am
-
12:15pm
MIP5_Microstructural Properties of Materials for Interconnects
Location: MOA 10-12
Chair: Kay Essig, ASE Group
AP8_Fan Out Reliability Aspects
Location: MOA 5
Chair: Grace O'Malley, INEMI
AMT5_Advanced Materials and Processes
Location: MOA 4
Chair: Attila Géczy, Budapest University of Technology and Economics
Flex2_Formation of a Conductive Interconnection for Flexible Electronics
Location: MOA 3
Chair: Jukka Hast, VTT Technical Research Centre of Finland ltd.
Rel3_Progress in Failure Analytical and Material Testing Methods
Location: MOA 1+2
Chair: Matthias Petzold, Fraunhofer IMWS
12:15pm
-
1:45pm
Lunch
1:45pm
-
3:00pm
MIP6_New materials for Heterogeneous Integration
Location: MOA 10-12
Chair: Nikhilendu Tiwary, Aalto University
AP9_Power Electronics Packaging
Location: MOA 5
Chair: Klaus Pressel, Infineon
AMT6_Enhanced Process Control
Location: MOA 4
Chair: Knut E. Aasmundtveit, University of South-Eastern Norway
RF2_Embedded System-in-Package and Interconnections Technologies
Location: MOA 3
Chair: Maurizio Cirillo, Rheinmetall Italia SpA
Rel4_New Approaches in Reliability Simulation and Modelling
Location: MOA 1+2
Chair: Olaf Wittler, Fraunhofer IZM
3:00pm
-
3:10pm
Room Change
Location: Atrium
3:10pm
-
3:55pm
Keynote 4
Location: MOA 10-12

"CHIPS -NAPMP: Overview and Next Steps"

George Orji
Deputy Director of CHIPS NAPMP, USA




3:55pm
-
4:25pm
Closing

 
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