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Conference Time: 19th Sept 2024, 06:18:50pm CEST
 

Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
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Session Overview
Date: Friday, 13/Sept/2024
8:30am - 9:15amKeynote 3
Location: MOA 10-12

"Challenges and Opportunities of Semiconductor Packaging in the Chiplet Era"

Dr. Yasumitsu Orii
Senior Managing Executive Officer in 3D Assembly Division, Rapidus Corporation
8:30am - 1:45pmExhibition
Location: Atrium
9:15am - 10:30amMIP4_Mechanical properties of Materials for Interconnects
Location: MOA 10-12
Session Chair: Glenn Hamilton Ross, Aalto University
9:15am - 10:30amAP7_Fan Out Packages
Location: MOA 5
Session Chair: Erik Jung, Fraunhofer IZM
9:15am - 10:30amAMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration
Location: MOA 4
Session Chair: Hoang-Vu Nguyen, University of South-Eastern Norway
9:15am - 10:30amFlex1_Reliability Assessment of Flexible Electronics
Location: MOA 3
Session Chair: Jean Charles Souriau, CEA-Leti
9:15am - 10:30amRF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems
Location: MOA 1+2
Session Chair: Matthias Wietstruck, IHP - Leibniz Institut für innovative Mikroelektronik
10:30am - 11:00amCoffee Break & Exhibition
Location: Atrium
10:30am - 11:45amPoster Session 3
Location: Atrium
Session Chair: Karl-Friedrich Becker, Fraunhofer IZM
11:00am - 12:15pmMIP5_Microstructural Properties of Materials for Interconnects
Location: MOA 10-12
Session Chair: Kay Essig, ASE Group
11:00am - 12:15pmAP8_Fan Out Reliability Aspects
Location: MOA 5
Session Chair: Grace O'Malley, INEMI
11:00am - 12:15pmAMT5_Advanced Materials and Processes
Location: MOA 4
Session Chair: Attila Géczy, Budapest University of Technology and Economics
11:00am - 12:15pmFlex2_Formation of a Conductive Interconnection for Flexible Electronics
Location: MOA 3
Session Chair: Jukka Hast, VTT Technical Research Centre of Finland ltd.
11:00am - 12:15pmRel3_Progress in Failure Analytical and Material Testing Methods
Location: MOA 1+2
Session Chair: Matthias Petzold, Fraunhofer IMWS
12:15pm - 1:45pmLunch
1:45pm - 3:00pmMIP6_New materials for Heterogeneous Integration
Location: MOA 10-12
Session Chair: Nikhilendu Tiwary, Aalto University
1:45pm - 3:00pmAP9_Power Electronics Packaging
Location: MOA 5
Session Chair: Klaus Pressel, Infineon
1:45pm - 3:00pmAMT6_Enhanced Process Control
Location: MOA 4
Session Chair: Knut E. Aasmundtveit, University of South-Eastern Norway
1:45pm - 3:00pmRF2_Embedded System-in-Package and Interconnections Technologies
Location: MOA 3
Session Chair: Maurizio Cirillo, Rheinmetall Italia SpA
1:45pm - 3:00pmRel4_New Approaches in Reliability Simulation and Modelling
Location: MOA 1+2
Session Chair: Olaf Wittler, Fraunhofer IZM
3:00pm - 3:10pmRoom Change
Location: Atrium
3:10pm - 3:55pmKeynote 4
Location: MOA 10-12

"CHIPS -NAPMP: Overview and Next Steps"

George Orji
Deputy Director of CHIPS NAPMP, USA
3:55pm - 4:25pmClosing

 
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