Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview |
| Date: Thursday, 12/Sept/2024 | |||||
| 8:30am - 9:15am |
Keynote 2 Location: MOA 10-12 "Electronics Integration: Challenges in Computed Tomography Scanners" Dr. Michael Hosemann Head of Digital Electronics at Healthineers Computed Tomography Detector Center, Siemens |
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| 8:30am - 7:00pm |
Exhibition Location: Atrium |
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| 9:15am - 10:30am |
MIP3_Low-temperature Materials for Interconnects and Packaging Location: MOA 10-12 Chair: Hiroshi Nishikawa, Osaka University |
AP3_Hybrid Bonding II Location: MOA 5 Chair: Rolf Aschenbrenner, Fraunhofer IZM |
AMT1_Innovative Assembly Processes Location: MOA 4 Chair: Attila Géczy, Budapest University of Technology and Economics |
DTM3_Reliability and Virtual Prototyping Location: MOA 3 Chair: Pradeep Lall, Auburn University |
Rel1_Reliability Performance and Electromigration Behavior Location: MOA 1+2 Chair: Matthias Heimann, Siemens AG |
| 10:30am - 11:00am |
Coffee Break & Exhibition Location: Atrium |
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| 10:30am - 11:45am |
Poster Session 2 Location: Atrium Chair: Karl-Friedrich Becker, Fraunhofer IZM |
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| 11:00am - 12:15pm |
Emerging I_From Mounting to Recycling – Highlites from Emerging Technologies Location: MOA 10-12 Chair: Martin Oppermann, TU Dresden |
AP4_Advances in WLP Technologies I Location: MOA 5 Chair: Rolf Aschenbrenner, Fraunhofer IZM |
AMT2_Computer-aided Process Control Location: MOA 4 Chair: Erik Jung, Fraunhofer IZM |
DTM4_Device Level Modeling Location: MOA 3 Chair: Przemyslaw Gromala, Robert Bosch GmbH |
Rel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects Location: MOA 1+2 Chair: Romuald Roucou, NXP |
| 12:15pm - 1:45pm |
Lunch |
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| 1:45pm - 3:15pm |
Special Session Location: MOA 10-12 Chair: Steffen Kroehnert, ESPAT-Consulting Chair: Klaus Pressel, Infineon The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing I IPCEI ME/CT and Pack4EU/ EU CHIPS ACT |
AP5_Advances in WLP Technologies II Location: MOA 5 Chair: Michael Schiffer, Fraunhofer IZM |
AMT3_Process for Enhancement of Device Robustness Location: MOA 4 Chair: David Henry, CEA LETI |
Special Session Location: MOA 3 PUNCH - Photonic Packaging |
Special Session Location: MOA 1+2 Education I: The Education, Training and Qualification Offer for Sustainable Electronics |
| 3:15pm - 3:45pm |
Coffee Break & Exhibition Location: Atrium |
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| 3:45pm - 5:15pm |
Special Session Location: MOA 10-12 Chair: Klaus Pressel, Infineon Chair: Steffen Kroehnert, ESPAT-Consulting The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing II IPCEI ME/CT and Pack4EU/ EU CHIPS ACT |
AP6_Challenges and Solutions for HI Location: MOA 5 Chair: Kay Essig, ASE Group |
Emerging II Location: MOA 4 Chair: Martin Schneider-Ramelow, Fraunhofer IZM |
Special Session Location: MOA 3 Chair: Toni Mattila, Business Finland Quantum Computing |
Special Session Location: MOA 1+2 Chair: Jeffrey C. Suhling, Auburn University Chair: Klaus-Jürgen Wolter, TU Dresden Education II: t.b.c. |
| 5:15pm - 6:45pm |
Panel Discussion "Chiplet Architectures for Automotive: Package Options and Special Considerations" E. Jan Vardaman, TechSearch International, Inc. |
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| 7:10pm - 7:35pm |
Bus Transfer |
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| 7:30pm - 11:00pm |
Gala Dinner at Wasserwerk |
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