Low Temperature Die-attach Bonding Using Copper Particle Free Inks

Fabian Steinberger, Nihesh Mohan, Olaf Rämer, Gordon Elger

Cu–(Sn–Bi) SLID Bond Microstructure Under Different Bonding Temperatures

Lisette Hernandez Gonzalez, Knut E. Aasmundtveit, Hoang-Vu Nguyen

Die Shear Strength of Au-In-Bi SLID Bonds at Elevated Temperatures

GAYATHRY THAMPI, HOANG-VU NGUYEN, KNUT EILIF AASMUNDTVEIT

High Precision Direct Transfer Bonding for Submicron Die-to-wafer in 3D/Heterogeneous Integration

Ichiro Sano, Katsuya Yamada, Yuya Hirai, Masanori Yamagishi, Shinya Takyu, Yusuke Fumita, Yoichiro Kurita

Bond Strength Measurement for Wafer-level and Chip-level Hybrid Bonding

Junya Fuse, Yuki Yoshihara, Marie Sano, Fumihiro Inoue

Optimization of Cu/SiCN Hybrid Bonding Process Using a Cohesive Zone Model

Dong Yan, Ali Roshanghias

Secondary Optics Assembly for Micro Concentrating Photovoltaics: A Parallelized and Scalable Approach

Marcus Voitel, Elisa Kaiser, Salar Mehrafsun, Maike Wiesenfarth, Henning Helmers, Karl-Friedrich Becker, Tanja Braun, Martin Schneider-Ramelow

Massive Parallel Assembly and Interconnection for Micro-LEDs – a Technical Feasibility Study

Charles-Alix Manier, Kai Zoschke, Hermann Oppermann

Tape Frozen Detachment Process Using Freeze Chuck for Chip to Wafer

Tadatomo Yamada, Ken Takano, Toshiaki Menjo, Shinya Takyu

Reliability Testing and Virtual Prototyping for Embedded GaN Power Modules in Automotive Applications

Kshitij Anil Kolas, Alexander Otto, Maximilian Hepp, Rico Eichhorn, Jan Albrecht, Sven Rzepka

Fully Connected Neural Network (FCNN) Based Validation Framework for FEA Post Processing to improve SAC Solder Reliability Analysis

Mohd Zubair Akhtar, Christian Kreiner, Maximilian Schmid, Andreas Zippelius, Ulrich Tetzlaff, Gordon Elger

Re-Integrating a Reduced-Order Model into Finite Element Environment for Thermo-Mechanical Reliability Analysis in Microelectronics

Chengdong Yuan, Sönke Maeter, Youssef Maniar, Tamara Bechtold

Electromigration Reliability of Cu3Sn Microbumps for 3D Heterogeneous Integration

Nikhilendu Tiwary, Christian Grosse, Michael Kögel, Thilo Windemuth, Glenn Ross, Vesa Vuorinen, Sebastian Brand, Mervi Paulasto-Kröckel

Investigating the Failure Mechanisms of Electromigration and Copper Oxide Formation in Fine-pitch Cu RDL

Adrija Chaudhuri, Johannes Jaeschke, Astrid Gollhardt, Hermann Oppermann, Martin Schneider-Ramelow

Investigation of the Influence of Shear Height in the Wire Bond Shear Test

Simon Kuttler, Olaf Wittler, Martin Schneider-Ramelow

Critical Parameters of Bond Strength Measurement on Wafer Bonding

Yusuke Kondo, Junya Fuse, Yuki Yoshihara, Marie Sano, Yuzo Nakamura, Isamu Matsubara, Fumihiro Inoue

Investigating Competing Failure Modes in Microelectronics due to Temperature Variations (ΔT)

Muhammad Musadiq, Adwait Inamdar, Romuald Roucou, W.D Van Driel

Development and Characterization of a Chip-film Patch Interposer Integrating an Ultrathin Electrophysiology Chip

Michael Kübler, Alexander Frank, Ulrike Passlack, Christine Harendt, Joachim N. Burghartz

Reliability Analysis of Surface Mount Interconnect Technologies Suitable for Temperatures up to 200 °C

Oliver Albrecht, Lukas Petersen, Luca Finn Tom Nowotnik, Maik Müller, Juliana Panchenko

Using Polymer Paste as Dielectric Material for PCB Based Module-to-Module Sintering

Tobias Tiedje, Jörg Meyer, Marco Luniak, Philip Knoch, Karsten Meier, Thomas Zerna, Andreas Munding

Non-phthalate and Biobased Plasticizers in Suspensions for Tape Casting

Kostja Makarovič, Barbara Malic

The Potential of Machine Learning for Thermal Modelling of SiC Power Modules - A Review

Zihan Zhang, Alireza Mehrabi, Willem vanDriel, René Poelma

Simulation and Experimental Analysis of Thermomechanical Stresses Around Interconnects for W2W Hybrid Bonding

Guoqiang Zhao, Yanping Zeng, Yi Zhao

RF Characterization and Analysis of Low-loss PCB Materials and Transmission Lines up to 110 GHz

Kavin Senthil Murugesan, Ivan Ndip, Jack Frankosky, Brian Amos, Georgi Georgiev, Ralph Fiehler, Jens Schneider, Martin Schneider-Ramelow

Bilayer Encapsulant for Lower Stress Moisture Protection

Mohammed Ibaad Gandikota, Francis Patrick McCluskey

Laser Assisted Bonding (LAB) Based Flip-chip Process for Fine Pitch Solder Bumps Device Using Laser Non-conductive Paste (NCP)

Ki-Seok JANG, Yong-Sung EOM, Gwang-Mun CHOI, Jiho JOO, Jungho SHIN, Jin-Hyuk OH, Chan-Mi LEE, Ji-Eun JUNG, Ga-Eun LEE, Kwang-Seong CHOI

Recycling SMD Components for E-Textile Fabrication: A Salt Spray Ageing Study

Martin Hirman, Jiri Navratil, Andrea Benesova, Frantisek Steiner

Experimental Study on Reactive Joining Processes on LTCC Substrates

Erik Wiss, Nesrine Jaziri, Adam Yuile, Jens Müller, Steffen Wiese

Development and Realization of Plasma Activated Low Temperature SiOx-SiOx Fusion Bonding Based on a Collective Die-to-wafer Bonding Process

Patrick Krüger, Thomas Voß, Sebastian Schulze, Matthias Wietstruck

A Novel 8GHz/50MHz Low Noise Dual Frequency PLL.

Ahmad hatem Jadery, Mehdi Ehsanian, Elias Rachid, Adnan Harb

Innovative Active Cell Balancing Circuit Using Common Capacitor for Energy Redistribution

Ana Metes, Toma Patarau, Aurelian Kotlar

Feasibility of Micro-grass on Silicon Cap as An Alternative Antireflective Layer in Vacuum Packaging of Microbolometer Arrays

Hoang-Vu Nguyen, Eivind Bardalen

Biodegradable PCBs with PLA/flax Substrate: FTIR and SEM Analysis of Degradation

Attila Géczy, Lívia Gyenizse, Csaba Farkas, Dániel Rigler, Balázs Sáfár, András Csiszár

A Novel Ultra-thin Dicing Die Attach Film for Various Dicing Processes

Masanori Yamagishi, Yutaro Ishii, Tomoka Kirihata, Manabu Miyawaki

Semi-Additive Fine Pitch RDL Litho-Process Development of 1000nm CD Using low-NA 300mm i-line Stepper

Lili Wang, Murat Pak, Nelson Pinho, John Slabbekoorn, Andy Miller, Eric Beyne

Study of Cross-contamination in Multi-chamber PVD Systems used for High-throughput Seed Layer Deposition

Patrik Carazzetti, Carl Drechsel, Roland Rettenmeier, Jürgen Weichart, Kay Viehweger, Ewald Strolz

Enhanced Defect Detection with Deep Neural Networks Post Wafer Bonding

Fiete Stoll, Vikas Dubey, Dirk Wünsch, Frank Roscher, Maik Wiemer

Advancements in Epoxy Pattern Quality Checks: Harnessing Artificial Intelligence for Enhanced Low-Contrast Analysis

Guodong Zeng, Farnaz Forooghifar, Andreas Wiedmer, Ernst Barmettler, Norbert Ackerl

Dicing Lane Quality Quantification & Wafer Assessment Using Image Thresholding Techniques

Damien Jon Leech, Akito Hiro, Geert Schoofs, Bensu Tunca Altintas, Alain Phommahaxay, Koen Kennes, Gerald Beyer, Eric Beyne

AI Deep-Learning Approach for Manufacturing Optimization During Chiplets and Heterogeneous Package Inspection

Shahab Chitchian, SeungYeol Kim, TaeYoung Jung, TaeYong Lee, ByeongGweon Joo

Latency Insertion Method for FinFET Simulation Incorporating Parasitic Source/Drain Resistances

Yi Zhou, Jose E. Schutt-Aine

CANCELLED: Adaptive Artificial Neural Networks for Power Loss Prediction in SiC MOSFETs

Giovanni Di Nuzzo, Ajay Poonjal Pai, YiChe Su

Simulation Analysis on Thermal Performance of Lidless Fan-out Package

Yongbo Wu, Jian Cai, Changming Song, Lin Tan, Qian Wang

Boundary Conditions for Reproducible and Comparable Condensation Tests to Prove the Migration Resistance of Assemblies

Bob Wittig, Adrian Kandziora, Gerret Asseburg, Markus Thoben

Analysis of LED Solder Joints During Combined Power and Thermal Cycling

Khalil Maarouf, Christine Roucoules, Helmut Klöcker, Sergio Sao-Joao

Analysis of Degradation Effects for Different Epoxy-based Molding Compounds (EMC) Under High Temperature Aging

Falk Naumann, Tino Stephan, Marcel Mittag, Robert Klengel, Sandy Klengel

Package Assembly Design Kits (PADK’s) – The Future of Advanced Wafer-level Manufacturing

Ruben Fuentes

Fan-out Packaging Reaching New Heights: Market and Technology Overview

Gabriela Pereira

Optimizing Laser Direct Write for Fan Out Packaging

Matthias Wahl, Steffen Diez, Christina Lopper, Markus Wöhrmann

Advanced Wafer Singulation Technique for Miniaturized Metal-oxide (MOX) Micro-hotplates Based Gas Analyzer

Serguei Stoukatch, Francois Dupont, Jean-Michel Redouté

Characterizations of Metal-based Thermal Interface Materials (TIM) in a Singulated Flip Chip Ball Grid Array Package

Ming-Che Hsieh, Pu-Shan Huang, Chi-Yuan Chen, Stanley Lin, JoonYoung Choi, WooSoon Kim, YoungCheol Kim

Automated Highspeed Characterization of Optical Waveguide in large-format Glass Substrates

Hashem Al-Shami, Julian Schwietering, Henning Schröder

Acoustic MEMS Packaging for Audio Micro-System Applications

Luca Maggi, Fabrizio Cerini, Silvia Adorno, Amedeo Maierna, Marco Del Sarto, Alex Gritti, Andrea Ratti, Nazariy Nashkolnyy

IMC Assisted Die-bonding for Stacked Device Integration

Masataka Maehara, Jaber Derakhshandeh, Carine Gerets, Tom Cochet, Dieter H Cuypers, Andy Miller, Gerald Beyer, Geert Van der Plas, Eric Beyne

High-throughput In-line SEM Metrology for Cu Pad Nanotopography for Hybrid Bonding Applications

Bensu Tunca Altintas, Mohamed Saib, Alain Moussa, Soon Aik Chew, Boyao Zhang, Joeri De Vos, Andy Miller, Eric Beyne, Gian Lorusso, Anne-Laure Charley, Janusz Bogdanowicz, Hiroaki Kasai, Kazuhisa Hasumi, Nobuyuki Mise, Mayuka Osaki, Maki Tanaka

10 Golden Rules of Chip- Package- Board Interactions

Evelyn Napetschnig

Trench-Based Fully Integrated Capacitors for Power Delivery in Heterogeneous Integration Platforms

Yousef Safari, Yushu Zhao, Boris Vaisband

Sustainable Temperature and Pressure Sensing Solution for Tire

Kimmo Antero Keränen, Timo Kurkela, Jyrki Ollila, Antti Tanskanen, Marko Korkalainen, Antoine Balin