IEEE ESTC 2024

September 11–13, 2024 | Berlin, Germany

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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Date: Thursday, 12/Sept/2024
8:30am - 9:15am	Keynote 2 Location: MOA 10-12 "Electronics Integration: Challenges in Computed Tomography Scanners" Dr. Michael Hosemann Head of Digital Electronics at Healthineers Computed Tomography Detector Center, Siemens
8:30am - 7:00pm	Exhibition Location: Atrium
9:15am - 10:30am	MIP3_Low-temperature Materials for Interconnects and Packaging Location: MOA 10-12 Chair: Hiroshi Nishikawa, Osaka University	AP3_Hybrid Bonding II Location: MOA 5 Chair: Rolf Aschenbrenner, Fraunhofer IZM	AMT1_Innovative Assembly Processes Location: MOA 4 Chair: Attila Géczy, Budapest University of Technology and Economics	DTM3_Reliability and Virtual Prototyping Location: MOA 3 Chair: Pradeep Lall, Auburn University	Rel1_Reliability Performance and Electromigration Behavior Location: MOA 1+2 Chair: Matthias Heimann, Siemens AG
10:30am - 11:00am	Coffee Break & Exhibition Location: Atrium
10:30am - 11:45am	Poster Session 2 Location: Atrium Chair: Karl-Friedrich Becker, Fraunhofer IZM
11:00am - 12:15pm	Emerging I_From Mounting to Recycling – Highlites from Emerging Technologies Location: MOA 10-12 Chair: Martin Oppermann, TU Dresden	AP4_Advances in WLP Technologies I Location: MOA 5 Chair: Rolf Aschenbrenner, Fraunhofer IZM	AMT2_Computer-aided Process Control Location: MOA 4 Chair: Erik Jung, Fraunhofer IZM	DTM4_Device Level Modeling Location: MOA 3 Chair: Przemyslaw Gromala, Robert Bosch GmbH	Rel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects Location: MOA 1+2 Chair: Romuald Roucou, NXP
12:15pm - 1:45pm	Lunch
1:45pm - 3:15pm	Special Session Location: MOA 10-12 Chair: Steffen Kroehnert, ESPAT-Consulting Chair: Klaus Pressel, Infineon The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing I IPCEI ME/CT and Pack4EU/ EU CHIPS ACT	AP5_Advances in WLP Technologies II Location: MOA 5 Chair: Michael Schiffer, Fraunhofer IZM	AMT3_Process for Enhancement of Device Robustness Location: MOA 4 Chair: David Henry, CEA LETI	Special Session Location: MOA 3 PUNCH - Photonic Packaging	Special Session Location: MOA 1+2 Education I: The Education, Training and Qualification Offer for Sustainable Electronics
3:15pm - 3:45pm	Coffee Break & Exhibition Location: Atrium
3:45pm - 5:15pm	Special Session Location: MOA 10-12 Chair: Klaus Pressel, Infineon Chair: Steffen Kroehnert, ESPAT-Consulting The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing II IPCEI ME/CT and Pack4EU/ EU CHIPS ACT	AP6_Challenges and Solutions for HI Location: MOA 5 Chair: Kay Essig, ASE Group	Emerging II Location: MOA 4 Chair: Martin Schneider-Ramelow, Fraunhofer IZM	Special Session Location: MOA 3 Chair: Toni Mattila, Business Finland Quantum Computing	Special Session Location: MOA 1+2 Chair: Jeffrey C. Suhling, Auburn University Chair: Klaus-Jürgen Wolter, TU Dresden Education II: t.b.c.
5:15pm - 6:45pm	Panel Discussion "Chiplet Architectures for Automotive: Package Options and Special Considerations" E. Jan Vardaman, TechSearch International, Inc. Vikas Gupta, ASE
7:10pm - 7:35pm	Bus Transfer
7:30pm - 11:00pm	Gala Dinner at Wasserwerk

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