Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
 
Session Overview
Date: Thursday, 12/Sept/2024
8:30am
-
9:15am
Keynote 2
Location: MOA 10-12

"Electronics Integration: Challenges in Computed Tomography Scanners"

Dr. Michael Hosemann
Head of Digital Electronics at Healthineers Computed Tomography Detector Center, Siemens




8:30am
-
7:00pm
Exhibition
Location: Atrium
9:15am
-
10:30am
MIP3_Low-temperature Materials for Interconnects and Packaging
Location: MOA 10-12
Chair: Hiroshi Nishikawa, Osaka University
AP3_Hybrid Bonding II
Location: MOA 5
Chair: Rolf Aschenbrenner, Fraunhofer IZM
AMT1_Innovative Assembly Processes
Location: MOA 4
Chair: Attila Géczy, Budapest University of Technology and Economics
DTM3_Reliability and Virtual Prototyping
Location: MOA 3
Chair: Pradeep Lall, Auburn University
Rel1_Reliability Performance and Electromigration Behavior
Location: MOA 1+2
Chair: Matthias Heimann, Siemens AG
10:30am
-
11:00am
Coffee Break & Exhibition
Location: Atrium
10:30am
-
11:45am
Poster Session 2
Location: Atrium
Chair: Karl-Friedrich Becker, Fraunhofer IZM
11:00am
-
12:15pm
Emerging I_From Mounting to Recycling – Highlites from Emerging Technologies
Location: MOA 10-12
Chair: Martin Oppermann, TU Dresden
AP4_Advances in WLP Technologies I
Location: MOA 5
Chair: Rolf Aschenbrenner, Fraunhofer IZM
AMT2_Computer-aided Process Control
Location: MOA 4
Chair: Erik Jung, Fraunhofer IZM
DTM4_Device Level Modeling
Location: MOA 3
Chair: Przemyslaw Gromala, Robert Bosch GmbH
Rel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects
Location: MOA 1+2
Chair: Romuald Roucou, NXP
12:15pm
-
1:45pm
Lunch
1:45pm
-
3:15pm
Special Session
Location: MOA 10-12
Chair: Steffen Kroehnert, ESPAT-Consulting
Chair: Klaus Pressel, Infineon

The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing I
IPCEI ME/CT and Pack4EU/ EU CHIPS ACT



AP5_Advances in WLP Technologies II
Location: MOA 5
Chair: Michael Schiffer, Fraunhofer IZM
AMT3_Process for Enhancement of Device Robustness
Location: MOA 4
Chair: David Henry, CEA LETI
Special Session
Location: MOA 3

PUNCH - Photonic Packaging



Special Session
Location: MOA 1+2

Education I: The Education, Training and Qualification Offer for Sustainable Electronics



3:15pm
-
3:45pm
Coffee Break & Exhibition
Location: Atrium
3:45pm
-
5:15pm
Special Session
Location: MOA 10-12
Chair: Klaus Pressel, Infineon
Chair: Steffen Kroehnert, ESPAT-Consulting

The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing II
IPCEI ME/CT and Pack4EU/ EU CHIPS ACT



AP6_Challenges and Solutions for HI
Location: MOA 5
Chair: Kay Essig, ASE Group
Emerging II
Location: MOA 4
Chair: Martin Schneider-Ramelow, Fraunhofer IZM
Special Session
Location: MOA 3
Chair: Toni Mattila, Business Finland

Quantum Computing



Special Session
Location: MOA 1+2
Chair: Jeffrey C. Suhling, Auburn University
Chair: Klaus-Jürgen Wolter, TU Dresden

Education II: t.b.c.



5:15pm
-
6:45pm
Panel Discussion

"Chiplet Architectures for Automotive: Package Options and Special Considerations"

E. Jan Vardaman, TechSearch International, Inc.
Vikas Gupta, ASE





7:10pm
-
7:35pm
Bus Transfer
7:30pm
-
11:00pm
Gala Dinner at Wasserwerk

 
Contact and Legal Notice · Contact Address:
Privacy Statement · Conference: IEEE ESTC 2024
Conference Software: ConfTool Pro 2.8.103+TC
© 2001–2024 by Dr. H. Weinreich, Hamburg, Germany