Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview |
| Date: Wednesday, 11/Sept/2024 | |||||
| 8:00am - 2:30pm |
Registration |
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| 8:30am - 10:30am |
„IEEE EPS Heterogeneous Integration Roadmap“ (HIR) I Location: MOA 10-12 |
PDC: “Advanced Packaging for MEMS and Sensors” I Location: MOA 5 Course instructor: Horst Theuss
more Info
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PDC: “Automotive Electronics Reliability – Assurance Approaches and Challenges” I Location: MOA 4 Course instructor: Pradeep Lall
more Info |
PDC: “Flip Chip Fabrication and Applications“ I Location: MOA 3 Course instructor: Eric Perfecto
more Info |
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| 10:30am - 10:45am |
Break |
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| 10:45am - 12:45pm |
„IEEE EPS Heterogeneous Integration Roadmap“ (HIR) II Location: MOA 10-12 |
PDC: “Advanced Packaging for MEMS and Sensors” II Location: MOA 5 Course instructor: Horst Theuss
more Info |
PDC: “Automotive Electronics Reliability – Assurance Approaches and Challenges” II Location: MOA 4 Course instructor: Pradeep Lall
more Info |
PDC: “Flip Chip Fabrication and Applications“ II Location: MOA 3 Course instructor: Eric Perfecto
more Info |
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| 11:00am - 3:00pm |
Exhibition Setup Location: Atrium |
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| 12:45pm - 1:30pm |
Break |
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| 1:30pm - 1:45pm |
Opening Location: MOA 10-12 Opening remarks Tanja Braun General Chair IEEE ESTC2024 Welcome on behalf of the German Ministry for Education and Research (BMBF) Engelbert Beyer Deputy Director-General of Directorate 51, Technology-Oriented Research for Innovation, BMBF, Germany |
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| 1:45pm - 2:30pm |
Keynote 1 Location: MOA 10-12 "A Vision for Modular, Ubiquitous and Scalable Compute Systems" Bernd Waidhas Principal Engineer, Silicon Packaging Architecture, Intel |
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| 2:30pm - 2:40pm |
Room change |
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| 2:40pm - 3:55pm |
MIP1_Advanced Material Architectures for Interconnects Location: MOA 10-12 Chair: Glenn Hamilton Ross, Aalto University |
AP1_Advanced Substrates Location: MOA 5 Chair: Andreas Ostmann, IZM |
Opto1_Photonic Module Packaging Location: MOA 4 Chair: Henning Schröder, Fraunhofer IZM |
DTM1_Co-design and Modeling for Chiplets Location: MOA 3 Chair: Chris Bailey, Arizona State University |
Power1_Electronics Measurement and Simulation Location: MOA 1+2 Chair: Aurelian Kotlar, Eberspächer |
| 3:00pm - 8:00pm |
Exhibition Location: Atrium |
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| 3:55pm - 4:25pm |
Coffee Break & Exhibition Location: Atrium |
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| 3:55pm - 5:00pm |
Poster Session 1 Location: Atrium Chair: Karl-Friedrich Becker, Fraunhofer IZM |
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| 4:25pm - 4:55pm |
Exhibitor Pitches Location: MOA 10-12 |
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| 4:55pm - 5:00pm |
Room change |
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| 5:00pm - 6:15pm |
MIP2_Advanced Interconnection Metallurgical Materials and Interconnects Location: MOA 10-12 Chair: Ali Roshanghias, Silicon Austria Labs GmbH |
AP2_Hybrid Bonding I Location: MOA 5 Chair: E Jan Vardaman, TechSearch International, Inc. |
Opto2_Heterogenous PIC Integration Location: MOA 4 Chair: Giovanni Delrosso, VTT |
DTM2_Reduced Order Modeling for Advanced Packaging Location: MOA 3 Chair: Kshitij Anil Kolas, Fraunhofer ENAS |
Power2_Power Semiconductor Packaging and Cooling Location: MOA 1+2 Chair: Gudrun Feix, ECPE European Center for Power Electronics |
| 6:15pm - 8:00pm |
Welcome Reception Location: Atrium |
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