Solid-state Growth Kinetics of Compound Layers in Electroplated Cu-In Layer Systems

Steffen Bickel, Juliana Panchenko, Manuela Junghähnel

Superconducting Superlattice Interconnects for Cryogenic Systems

Charles Bon-mardion, Edouard Deschaseaux, Thierry Farjot, Alain Campo, Frédéric Ritton, Rémi Vélard, Hélène Duchemin, Céline Feautrier, Jean-Luc Sauvageot, Jean Charbonnier, Candice Thomas

Aluminium-Aluminium Wafer Level Thermo Compression Bonding Using Thick Electroplated Aluminium Bonding Frames

Silvia Braun, Imants Cirulis, Klaus Vogel, Christian Hofmann, Maik Wiemer

Development of Packaging Technology for 2.xD Advanced Packages; Fine Bump Interconnection, Fine Cu Wiring and Large Package

Kei Togasaki, Masashi Minami, Dongchul Kang, Sadaaki Katoh

Advancing Chiplet Architecture Through Heterogeneous Integration on Laser-processed Glass Substrates

Richard Noack, Nils Anspach, Roman Ostholt, Daniel Dunker, Norbert Ambrosius

High Rate and Selective (Deep) Reactive-ion Etching Process for the Formation of High-density Vertical Interconnects into Dielectric Build-up Films

Ioannis Tsigaras, Ioannis Alexiou, Christian Voigt, Lars Böttcher, Ewald Strolz, Roland Rettenmeier

Array Packaging with Integrated Mirrors for High Power Multi-chip UVC-LED Modules

Ulli Hansen, Xiaodong Hu, Simon Maus, Oliver Gyenge

Modular Integration of Quantum Cascade Lasers and Drivers in Glass Bench

Gunnar Böttger, Michael Häußler, Lasse Felix Weißenburg, Martin Hempel, Ralf Ziegler, Martin Schneider-Ramelow

Improving the Thermal Management of Power LED Arrays with Diamonds

Shusmitha Kyatam, Antonio A. Marques, Luis Rodrigues, Luis Nero Alves, Joana Catarina Mendes

Simulations of Wafer-to-wafer Bonding Dynamics and Deformation Mechanisms

Oguzhan Orkut Okudur, Serena Iacovo, Shuo Kang, Mario Gonzalez, Eric Beyne

Signal Integrity Optimization for CoWoS Chiplet Interconnection Design Assisted by Reinforcement Learning

Weiyang Miao, Chuan Seng Tan, Mihai Dragos Rotaru

Finite Element Analysis of Stress Variation of Hybrid Bonding During Miniaturization of Interconnects

Yudong Yang, Fengze Hou, Chi Zhang, Rui Ma, Shangyang Shi, Fei Ding, Yu Zhang, Renxi Jin, Qidong Wang, Wei Wang

Dynamic Calibration of Junction Temperature of SiC MOSFETs for Power Cycling

Jakob Breuer, Fabian Dresel, Andreas Schletz, Juergen Leib, Bernd Eckardt, Martin Maerz

Contact Thermography – New Findings, New Ideas

Martin Oppermann, Lea Borngräber, Oliver Albrecht, Thomas Zerna

Abrasion Characterization of Graphene-enhanced Thermal Interface Materials for Electronics Thermal Management Applications

Kristoffer Harr, Yuanyuan Wang, Johan Möller, Johan Liu

Fabrication of Fine-Pitch Cu-Sn Microbumps Using Electroplating and Wet Seed Layer Etching

Yunfan Shi, Zilin Wang, Zheyao Wang

Eclipse Versus Conventional Optical Choppers: Modeling and Analysis

Virgil-Florin Duma, Eduard-Sebastian Csukas, Cosmin Moisa

Development of HTC Tests on Module Basis

Victoria Zimmermann, Lukas Farnbacher, Tamara Reck, Dawei Zhao, Jürgen Leib, Bernd Eckardt

Low-temperature Adhesive Wafer Bonding for Film Layer Transfer

Augusto Daniel Rodrigues, Nikolai Andrianov, Munir Syed Azeem, Madeleine Petschnigg, Tai Nguyen, Thang Duy Dao, Ali Roshanghias

Adhesive Solutions for Closed Cavity Packaging

Patrick Schirmer, Severin Ringelstetter

Infrared Optical Solutions for Void Inspection of Bonded Wafers and Bonding Overlay Control

Gyorgy Nadudvari, Zsolt Kovács, Zoltan Tamas Kiss, Zoltan Lábszki, Imre Balogh, Silvia Poppa, Denes Szaz

Investigation of RF Characteristics of Chiplet to PCB Transitions for Advanced HPC Packaging Solutions

Alexander Gaebler, Uwe Maaß, Ivan Ndip

Molding Process Simulation and Viscoelastic Model for Package Warpage Anticipation

Marco Rovitto

2.5D/3D Chiplets Approach to Advanced Packaging Solutions

Hiroki Oshida, Tadashi Kubota, Engin Tinas, Yuichi Koba

Automatized Multi-objective Optimization for Reliability of Power Electronics

Tibor Debreceni, Bence Dániel Darázs, Christian Freitag, Bálint Garai

Adhesion Layer Analysis by Spectroscopic Ellipsometry

Uwe Richter

Inline Oxide Removal Through Openair-plasma to Solve Delamination and Improve Bonding in Electronics

nico coenen, Dhia Bensalem, Daphne Pappas

Heat Spreading in Uncovered Copper Sintered Die-Attach Layers Examined with Lock-In Thermography

Olaf Rämer, Marek Zajaczkowski, Corinna Grosse-Kockert, Daniel May, Sri Krishna Bhogaraju

Evaluation of Mobile Data Center Cooling Performance Based on Embedded Cooling

Yuxin Ye, Xiangbin Du, Chenxi Gao, Yanmei Kong, Guoran Lu, Xinhao Meng, Binbin Jiao

Tuning of Copper Grain Size for Integration in Hybrid Bonding Applications

Sarabjot Singh, Kathleen Dunn

Fine Pitch Aluminum Hybrid Bonding at Wafer Level: Overcoming the Challenges in Plating, Passivation and Planarization

Imants Cirulis, Vikas Dubey, Silvia Braun, Dirk Wünsch, Maik Wiemer

Surface Activated Bonding for Hybrid and All-metal 3D (AM3D) Interconnect

Tadatomo Suga, Kanji Otsuka, Junsha Wang

Ultra Low Temperature Hybrid Bonding: Morphological and Electrical Characterizations

Margot Faure, Christophe Dubarry, Pablo Renaud, Floriane Baudin, Sébastien Dominguez, Karine Abadie, Christophe Morales, Constantin Matei, Frank Fournel

Overlay Scaling Error Reduction for Hybrid Die-To-wafer Bonding

Pieter Bex, Mario Gonzalez, Steven Brems, Alain Phommahaxay, Koen D`Havé, Prathamesh Dhakras, Dieter H. Cuypers, Ye Lin, Eric Beyne, Jonathan Abdilla, Kawsar Ahmed Prince, Benedikt Auer, Djuro Bikaljevic, Manuel Deubler, Thiago Moura, Stefan Schmid, Pavel Seroglazov

Scatterometry Application on Cu/SiCN Surface Topography Towards High Volume Manufacturing

Soon Aik Chew, Joey Hung, Igor Turoves, Avron Ger, Mohamed Saib, Alain Moussa, Boyao Zhang, Joeri De Vos, Andy Miller, Anne-Laure Charley, Philippe Leray, Eric Beyne

Laser-Assisted Bonding of a Miniature Multichannel Laser Diode Chip to a Silicon Photonics Integrated Circuit with Through-Silicon Alignment

Aleksandr Vlasov, Santeri Lehtinen, Evgenii Lepukhov, Heikki Virtanen, Samu-Pekka Ojanen, Jukka Viheriälä, Mircea Guina

Over 100-GHz Bridge Chip Interconnection Between Photonic and Electrical ICs with a Heat-insulating Stress-relief Membrane Structure

Taichi Misawa, Hiroshi Uemura, Keiji Tanaka, Katsumi Uesaka, Yoichiro Kurita

Advanced Ultrathin Spray Coating Process Technology for Heterogeneous Integration Applications

Johanna Rimboeck, Stefan Ertl, Prasanna Ramaswamy, Alex Farrell, Ali Uzun, Mariana Pires, Brian Corbett, Ruggero Loi, Ksenija Varga, Peter Ossieur

Reduced-Order Modelling for Coupled Thermal-Mechanical Analysis and Reliability Assessments of Power Electronic Modules with Nonlinear Material Behaviours

Sheikh Hassan, Stoyan Stoyanov, Pushparajah Rajaguru, Christopher Bailey

Highly Efficient Modeling of Solder Balls and Their Visco-plastic Behavior Applying the Energy Conserving Sampling and Weighting Method

Mike Feuchter, Hanna Baumgartl, Martin Hanke, Sven Rzepka

Coupled Electrothermal Analysis with Reduced Order Models for Optimizing GaN HEMTs Performance in Traction Inverters

Abinash Pradhan, Giovanna Grosso, Varaha Satya Bharath Kurukuru, Claudio Romano, Roberto Petrella

Model-based Development to Improve Electrical and Thermal Performances for Robust Si Power MOSFETs Using Embedded Die Packaging Technology

Kentaro Mori, Kohei Oasa, Hitoshi Imi, Yutaro Hayashi, Tatsuya Ohguro, Tatsuya Nishiwaki, Fumiyoshi Kawashiro

Research on Ultra-compact 3D SiC Power Module for EVs with Double Layer Cooling Technology

Keita Suzuki, Takumi Yumoto, Koji Bando, Tetsuo Endoh, Yoshikazu Takahashi

An Introduction to Wire-bondless Discrete GaN Power Packages with Top-Side Cu Sinterconnects®

Kaneeze Noorul Ain, Guo Qi Zhang, Augusto Rodrigues, Md Nazmul Hasan, Karen Geens, Urmimala Chatterjee, Ali Roshanghias, Dominik Holzmann