IEEE ESTC 2024

September 11–13, 2024 | Berlin, Germany

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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Date: Wednesday, 11/Sept/2024
8:00am - 2:30pm	Registration
8:30am - 10:30am	„IEEE EPS Heterogeneous Integration Roadmap“ (HIR) I Location: MOA 10-12	PDC: “Advanced Packaging for MEMS and Sensors” I Location: MOA 5 Course instructor: Horst Theuss more Info	PDC: “Automotive Electronics Reliability – Assurance Approaches and Challenges” I Location: MOA 4 Course instructor: Pradeep Lall more Info	PDC: “Flip Chip Fabrication and Applications“ I Location: MOA 3 Course instructor: Eric Perfecto more Info
10:30am - 10:45am	Break
10:45am - 12:45pm	„IEEE EPS Heterogeneous Integration Roadmap“ (HIR) II Location: MOA 10-12	PDC: “Advanced Packaging for MEMS and Sensors” II Location: MOA 5 Course instructor: Horst Theuss more Info	PDC: “Automotive Electronics Reliability – Assurance Approaches and Challenges” II Location: MOA 4 Course instructor: Pradeep Lall more Info	PDC: “Flip Chip Fabrication and Applications“ II Location: MOA 3 Course instructor: Eric Perfecto more Info
11:00am - 3:00pm	Exhibition Setup Location: Atrium
12:45pm - 1:30pm	Break
1:30pm - 1:45pm	Opening Location: MOA 10-12 Opening remarks Tanja Braun General Chair IEEE ESTC2024 Welcome on behalf of the German Ministry for Education and Research (BMBF) Engelbert Beyer Deputy Director-General of Directorate 51, Technology-Oriented Research for Innovation, BMBF, Germany
1:45pm - 2:30pm	Keynote 1 Location: MOA 10-12 "A Vision for Modular, Ubiquitous and Scalable Compute Systems" Bernd Waidhas Principal Engineer, Silicon Packaging Architecture, Intel
2:30pm - 2:40pm	Room change
2:40pm - 3:55pm	MIP1_Advanced Material Architectures for Interconnects Location: MOA 10-12 Chair: Glenn Hamilton Ross, Aalto University	AP1_Advanced Substrates Location: MOA 5 Chair: Andreas Ostmann, IZM	Opto1_Photonic Module Packaging Location: MOA 4 Chair: Henning Schröder, Fraunhofer IZM	DTM1_Co-design and Modeling for Chiplets Location: MOA 3 Chair: Chris Bailey, Arizona State University	Power1_Electronics Measurement and Simulation Location: MOA 1+2 Chair: Aurelian Kotlar, Eberspächer
3:00pm - 8:00pm	Exhibition Location: Atrium
3:55pm - 4:25pm	Coffee Break & Exhibition Location: Atrium
3:55pm - 5:00pm	Poster Session 1 Location: Atrium Chair: Karl-Friedrich Becker, Fraunhofer IZM
4:25pm - 4:55pm	Exhibitor Pitches Location: MOA 10-12
4:55pm - 5:00pm	Room change
5:00pm - 6:15pm	MIP2_Advanced Interconnection Metallurgical Materials and Interconnects Location: MOA 10-12 Chair: Ali Roshanghias, Silicon Austria Labs GmbH	AP2_Hybrid Bonding I Location: MOA 5 Chair: E Jan Vardaman, TechSearch International, Inc.	Opto2_Heterogenous PIC Integration Location: MOA 4 Chair: Giovanni Delrosso, VTT	DTM2_Reduced Order Modeling for Advanced Packaging Location: MOA 3 Chair: Kshitij Anil Kolas, Fraunhofer ENAS	Power2_Power Semiconductor Packaging and Cooling Location: MOA 1+2 Chair: Gudrun Feix, ECPE European Center for Power Electronics
6:15pm - 8:00pm	Welcome Reception Location: Atrium

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