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Conference Time: 23rd Nov 2024, 03:16:38pm CET
 

Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
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Session Overview
Date: Wednesday, 11/Sept/2024
8:00am - 2:30pmRegistration
8:30am - 10:30am„IEEE EPS Heterogeneous Integration Roadmap“ (HIR) I
Location: MOA 10-12
8:30am - 10:30amPDC: “Advanced Packaging for MEMS and Sensors” I
Location: MOA 5

Course instructor: Horst Theuss
8:30am - 10:30amPDC: “Automotive Electronics Reliability – Assurance Approaches and Challenges” I
Location: MOA 4

Course instructor: Pradeep Lall
8:30am - 10:30amPDC: “Flip Chip Fabrication and Applications“ I
Location: MOA 3

Course instructor: Eric Perfecto
10:30am - 10:45amBreak
10:45am - 12:45pm„IEEE EPS Heterogeneous Integration Roadmap“ (HIR) II
Location: MOA 10-12
10:45am - 12:45pmPDC: “Advanced Packaging for MEMS and Sensors” II
Location: MOA 5

Course instructor: Horst Theuss
10:45am - 12:45pmPDC: “Automotive Electronics Reliability – Assurance Approaches and Challenges” II
Location: MOA 4

Course instructor: Pradeep Lall
10:45am - 12:45pmPDC: “Flip Chip Fabrication and Applications“ II
Location: MOA 3

Course instructor: Eric Perfecto
11:00am - 3:00pmExhibition Setup
Location: Atrium
12:45pm - 1:30pmBreak
1:30pm - 1:45pmOpening
Location: MOA 10-12

Opening remarks
Tanja Braun
General Chair IEEE ESTC2024

Welcome on behalf of the German Ministry for Education and Research (BMBF)
Engelbert Beyer
Deputy Director-General of Directorate 51, Technology-Oriented Research for Innovation, BMBF, Germany

1:45pm - 2:30pmKeynote 1
Location: MOA 10-12

"A Vision for Modular, Ubiquitous and Scalable Compute Systems"

Bernd Waidhas
Principal Engineer, Silicon Packaging Architecture, Intel
2:30pm - 2:40pmRoom change
2:40pm - 3:55pmMIP1_Advanced Material Architectures for Interconnects
Location: MOA 10-12
Session Chair: Glenn Hamilton Ross, Aalto University
2:40pm - 3:55pmAP1_Advanced Substrates
Location: MOA 5
Session Chair: Andreas Ostmann, IZM
2:40pm - 3:55pmOpto1_Photonic Module Packaging
Location: MOA 4
Session Chair: Henning Schröder, Fraunhofer IZM
2:40pm - 3:55pmDTM1_Co-design and Modeling for Chiplets
Location: MOA 3
Session Chair: Chris Bailey, Arizona State University
2:40pm - 3:55pmPower1_Electronics Measurement and Simulation
Location: MOA 1+2
Session Chair: Aurelian Kotlar, Eberspächer
3:00pm - 8:00pmExhibition
Location: Atrium
3:55pm - 4:25pmCoffee Break & Exhibition
Location: Atrium
3:55pm - 5:00pmPoster Session 1
Location: Atrium
Session Chair: Karl-Friedrich Becker, Fraunhofer IZM
4:25pm - 4:55pmExhibitor Pitches
Location: MOA 10-12
4:55pm - 5:00pmRoom change
5:00pm - 6:15pmMIP2_Advanced Interconnection Metallurgical Materials and Interconnects
Location: MOA 10-12
Session Chair: Ali Roshanghias, Silicon Austria Labs GmbH
5:00pm - 6:15pmAP2_Hybrid Bonding I
Location: MOA 5
Session Chair: E Jan Vardaman, TechSearch International, Inc.
5:00pm - 6:15pmOpto2_Heterogenous PIC Integration
Location: MOA 4
Session Chair: Giovanni Delrosso, VTT
5:00pm - 6:15pmDTM2_Reduced Order Modeling for Advanced Packaging
Location: MOA 3
Session Chair: Kshitij Anil Kolas, Fraunhofer ENAS
5:00pm - 6:15pmPower2_Power Semiconductor Packaging and Cooling
Location: MOA 1+2
Session Chair: Gudrun Feix, ECPE European Center for Power Electronics
6:15pm - 8:00pmWelcome Reception
Location: Atrium

 
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