IEEE ESTC 2024
September 11–13, 2024 | Berlin, Germany
Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview |
| Date: Wednesday, 11/Sept/2024 | ||||
| 8:00am - 2:30pm |
Registration |
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| 8:30am - 10:30am |
„IEEE EPS Heterogeneous Integration Roadmap“ (HIR) I Location: MOA 10-12 |
PDC: “Advanced Packaging for MEMS and Sensors” I Location: MOA 5 Course instructor: Horst Theuss
more Info
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PDC: “Automotive Electronics Reliability – Assurance Approaches and Challenges” I Location: MOA 4 Course instructor: Pradeep Lall
more Info |
PDC: “Flip Chip Fabrication and Applications“ I Location: MOA 3 Course instructor: Eric Perfecto
more Info |
| 10:30am - 10:45am |
Break |
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| 10:45am - 12:45pm |
„IEEE EPS Heterogeneous Integration Roadmap“ (HIR) II Location: MOA 10-12 |
PDC: “Advanced Packaging for MEMS and Sensors” II Location: MOA 5 Course instructor: Horst Theuss
more Info |
PDC: “Automotive Electronics Reliability – Assurance Approaches and Challenges” II Location: MOA 4 Course instructor: Pradeep Lall
more Info |
PDC: “Flip Chip Fabrication and Applications“ II Location: MOA 3 Course instructor: Eric Perfecto
more Info |
| 11:00am - 3:00pm |
Exhibition Setup Location: Atrium |
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| 12:45pm - 1:30pm |
Break |
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| 1:30pm - 1:45pm |
Opening Location: MOA 10-12 Opening remarks Tanja Braun General Chair IEEE ESTC2024 Welcome on behalf of the German Ministry for Education and Research (BMBF) Engelbert Beyer Deputy Director-General of Directorate 51, Technology-Oriented Research for Innovation, BMBF, Germany |
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| 1:45pm - 2:30pm |
Keynote 1 Location: MOA 10-12 "A Vision for Modular, Ubiquitous and Scalable Compute Systems" Bernd Waidhas Principal Engineer, Silicon Packaging Architecture, Intel |
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| 2:30pm - 2:40pm |
Room change |
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| 2:40pm - 3:55pm |
MIP1_Advanced Material Architectures for Interconnects Location: MOA 10-12 Chair: Glenn Hamilton Ross, Aalto University |
AP1_Advanced Substrates Location: MOA 5 Chair: Andreas Ostmann, IZM |
Opto1_Photonic Module Packaging Location: MOA 4 Chair: Henning Schröder, Fraunhofer IZM |
DTM1_Co-design and Modeling for Chiplets Location: MOA 3 Chair: Chris Bailey, Arizona State University |
| Power1_Electronics Measurement and Simulation Location: MOA 1+2 Chair: Aurelian Kotlar, Eberspächer |
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| 3:00pm - 8:00pm |
Exhibition Location: Atrium |
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| 3:55pm - 4:25pm |
Coffee Break & Exhibition Location: Atrium |
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| 3:55pm - 5:00pm |
Poster Session 1 Location: Atrium Chair: Karl-Friedrich Becker, Fraunhofer IZM |
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| 4:25pm - 4:55pm |
Exhibitor Pitches Location: MOA 10-12 |
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| 4:55pm - 5:00pm |
Room change |
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| 5:00pm - 6:15pm |
MIP2_Advanced Interconnection Metallurgical Materials and Interconnects Location: MOA 10-12 Chair: Ali Roshanghias, Silicon Austria Labs GmbH |
AP2_Hybrid Bonding I Location: MOA 5 Chair: E Jan Vardaman, TechSearch International, Inc. |
Opto2_Heterogenous PIC Integration Location: MOA 4 Chair: Giovanni Delrosso, VTT |
DTM2_Reduced Order Modeling for Advanced Packaging Location: MOA 3 Chair: Kshitij Anil Kolas, Fraunhofer ENAS |
| Power2_Power Semiconductor Packaging and Cooling Location: MOA 1+2 Chair: Gudrun Feix, ECPE European Center for Power Electronics |
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| 6:15pm - 8:00pm |
Welcome Reception Location: Atrium |
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| Date: Thursday, 12/Sept/2024 | ||||
| 8:30am - 9:15am |
Keynote 2 Location: MOA 10-12 "Electronics Integration: Challenges in Computed Tomography Scanners" Dr. Michael Hosemann Head of Digital Electronics at Healthineers Computed Tomography Detector Center, Siemens |
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| 8:30am - 7:00pm |
Exhibition Location: Atrium |
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| 9:15am - 10:30am |
MIP3_Low-temperature Materials for Interconnects and Packaging Location: MOA 10-12 Chair: Hiroshi Nishikawa, Osaka University |
AP3_Hybrid Bonding II Location: MOA 5 Chair: Rolf Aschenbrenner, Fraunhofer IZM |
AMT1_Innovative Assembly Processes Location: MOA 4 Chair: Attila Géczy, Budapest University of Technology and Economics |
DTM3_Reliability and Virtual Prototyping Location: MOA 3 Chair: Pradeep Lall, Auburn University |
| Rel1_Reliability Performance and Electromigration Behavior Location: MOA 1+2 Chair: Matthias Heimann, Siemens AG |
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| 10:30am - 11:00am |
Coffee Break & Exhibition Location: Atrium |
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| 10:30am - 11:45am |
Poster Session 2 Location: Atrium Chair: Karl-Friedrich Becker, Fraunhofer IZM |
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| 11:00am - 12:15pm |
Emerging I_From Mounting to Recycling – Highlites from Emerging Technologies Location: MOA 10-12 Chair: Martin Oppermann, TU Dresden |
AP4_Advances in WLP Technologies I Location: MOA 5 Chair: Rolf Aschenbrenner, Fraunhofer IZM |
AMT2_Computer-aided Process Control Location: MOA 4 Chair: Erik Jung, Fraunhofer IZM |
DTM4_Device Level Modeling Location: MOA 3 Chair: Przemyslaw Gromala, Robert Bosch GmbH |
| Rel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects Location: MOA 1+2 Chair: Romuald Roucou, NXP |
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| 12:15pm - 1:45pm |
Lunch |
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| 1:45pm - 3:15pm |
Special Session Location: MOA 10-12 Chair: Steffen Kroehnert, ESPAT-Consulting Chair: Klaus Pressel, Infineon The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing I IPCEI ME/CT and Pack4EU/ EU CHIPS ACT |
AP5_Advances in WLP Technologies II Location: MOA 5 Chair: Michael Schiffer, Fraunhofer IZM |
AMT3_Process for Enhancement of Device Robustness Location: MOA 4 Chair: David Henry, CEA LETI |
Special Session Location: MOA 3 PUNCH - Photonic Packaging |
| Special Session Location: MOA 1+2 Education I: The Education, Training and Qualification Offer for Sustainable Electronics |
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| 3:15pm - 3:45pm |
Coffee Break & Exhibition Location: Atrium |
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| 3:45pm - 5:15pm |
Special Session Location: MOA 10-12 Chair: Klaus Pressel, Infineon Chair: Steffen Kroehnert, ESPAT-Consulting The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing II IPCEI ME/CT and Pack4EU/ EU CHIPS ACT |
AP6_Challenges and Solutions for HI Location: MOA 5 Chair: Kay Essig, ASE Group |
Emerging II Location: MOA 4 Chair: Martin Schneider-Ramelow, Fraunhofer IZM |
Special Session Location: MOA 3 Chair: Toni Mattila, Business Finland Quantum Computing |
| Special Session Location: MOA 1+2 Chair: Jeffrey C. Suhling, Auburn University Chair: Klaus-Jürgen Wolter, TU Dresden Education II: t.b.c. |
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| 5:15pm - 6:45pm |
Panel Discussion "Chiplet Architectures for Automotive: Package Options and Special Considerations" E. Jan Vardaman, TechSearch International, Inc. |
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| 7:10pm - 7:35pm |
Bus Transfer |
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| 7:30pm - 11:00pm |
Gala Dinner at Wasserwerk |
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| Date: Friday, 13/Sept/2024 | ||||
| 8:30am - 9:15am |
Keynote 3 Location: MOA 10-12 "Challenges and Opportunities of Semiconductor Packaging in the Chiplet Era" Dr. Yasumitsu Orii Senior Managing Executive Officer in 3D Assembly Division, Rapidus Corporation |
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| 8:30am - 1:45pm |
Exhibition Location: Atrium |
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| 9:15am - 10:30am |
MIP4_Mechanical properties of Materials for Interconnects Location: MOA 10-12 Chair: Glenn Hamilton Ross, Aalto University |
AP7_Fan Out Packages Location: MOA 5 Chair: Erik Jung, Fraunhofer IZM |
AMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration Location: MOA 4 Chair: Hoang-Vu Nguyen, University of South-Eastern Norway |
Flex1_Reliability Assessment of Flexible Electronics Location: MOA 3 Chair: Jean Charles Souriau, CEA-Leti |
| RF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems Location: MOA 1+2 Chair: Matthias Wietstruck, IHP - Leibniz Institut für innovative Mikroelektronik |
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| 10:30am - 11:00am |
Coffee Break & Exhibition Location: Atrium |
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| 10:30am - 11:45am |
Poster Session 3 Location: Atrium Chair: Karl-Friedrich Becker, Fraunhofer IZM |
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| 11:00am - 12:15pm |
MIP5_Microstructural Properties of Materials for Interconnects Location: MOA 10-12 Chair: Kay Essig, ASE Group |
AP8_Fan Out Reliability Aspects Location: MOA 5 Chair: Grace O'Malley, INEMI |
AMT5_Advanced Materials and Processes Location: MOA 4 Chair: Attila Géczy, Budapest University of Technology and Economics |
Flex2_Formation of a Conductive Interconnection for Flexible Electronics Location: MOA 3 Chair: Jukka Hast, VTT Technical Research Centre of Finland ltd. |
| Rel3_Progress in Failure Analytical and Material Testing Methods Location: MOA 1+2 Chair: Matthias Petzold, Fraunhofer IMWS |
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| 12:15pm - 1:45pm |
Lunch |
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| 1:45pm - 3:00pm |
MIP6_New materials for Heterogeneous Integration Location: MOA 10-12 Chair: Nikhilendu Tiwary, Aalto University |
AP9_Power Electronics Packaging Location: MOA 5 Chair: Klaus Pressel, Infineon |
AMT6_Enhanced Process Control Location: MOA 4 Chair: Knut E. Aasmundtveit, University of South-Eastern Norway |
RF2_Embedded System-in-Package and Interconnections Technologies Location: MOA 3 Chair: Maurizio Cirillo, Rheinmetall Italia SpA |
| Rel4_New Approaches in Reliability Simulation and Modelling Location: MOA 1+2 Chair: Olaf Wittler, Fraunhofer IZM |
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| 3:00pm - 3:10pm |
Room Change Location: Atrium |
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| 3:10pm - 3:55pm |
Keynote 4 Location: MOA 10-12 "CHIPS -NAPMP: Overview and Next Steps" George Orji Deputy Director of CHIPS NAPMP, USA |
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| 3:55pm - 4:25pm |
Closing |
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| Date: Saturday, 14/Sept/2024 | |
| 8:30am - 3:30pm |
IEEE EPS Board of Governors Meeting (not public) |
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