Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
 
Session Overview
Date: Wednesday, 11/Sept/2024
8:00am
-
2:30pm
Registration
8:30am
-
10:30am
„IEEE EPS Heterogeneous Integration Roadmap“ (HIR) I
Location: MOA 10-12
PDC: “Advanced Packaging for MEMS and Sensors” I
Location: MOA 5

Course instructor: Horst Theuss

PDC: “Automotive Electronics Reliability – Assurance Approaches and Challenges” I
Location: MOA 4

Course instructor: Pradeep Lall

PDC: “Flip Chip Fabrication and Applications“ I
Location: MOA 3

Course instructor: Eric Perfecto

10:30am
-
10:45am
Break
10:45am
-
12:45pm
„IEEE EPS Heterogeneous Integration Roadmap“ (HIR) II
Location: MOA 10-12
PDC: “Advanced Packaging for MEMS and Sensors” II
Location: MOA 5

Course instructor: Horst Theuss

PDC: “Automotive Electronics Reliability – Assurance Approaches and Challenges” II
Location: MOA 4

Course instructor: Pradeep Lall

PDC: “Flip Chip Fabrication and Applications“ II
Location: MOA 3

Course instructor: Eric Perfecto

11:00am
-
3:00pm
Exhibition Setup
Location: Atrium
12:45pm
-
1:30pm
Break
1:30pm
-
1:45pm
Opening
Location: MOA 10-12

Opening remarks
Tanja Braun
General Chair IEEE ESTC2024

Welcome on behalf of the German Ministry for Education and Research (BMBF)
Engelbert Beyer
Deputy Director-General of Directorate 51, Technology-Oriented Research for Innovation, BMBF, Germany

1:45pm
-
2:30pm
Keynote 1
Location: MOA 10-12

"A Vision for Modular, Ubiquitous and Scalable Compute Systems"

Bernd Waidhas
Principal Engineer, Silicon Packaging Architecture, Intel




2:30pm
-
2:40pm
Room change
2:40pm
-
3:55pm
MIP1_Advanced Material Architectures for Interconnects
Location: MOA 10-12
Chair: Glenn Hamilton Ross, Aalto University
AP1_Advanced Substrates
Location: MOA 5
Chair: Andreas Ostmann, IZM
Opto1_Photonic Module Packaging
Location: MOA 4
Chair: Henning Schröder, Fraunhofer IZM
DTM1_Co-design and Modeling for Chiplets
Location: MOA 3
Chair: Chris Bailey, Arizona State University
Power1_Electronics Measurement and Simulation
Location: MOA 1+2
Chair: Aurelian Kotlar, Eberspächer
 
3:00pm
-
8:00pm
Exhibition
Location: Atrium
3:55pm
-
4:25pm
Coffee Break & Exhibition
Location: Atrium
3:55pm
-
5:00pm
Poster Session 1
Location: Atrium
Chair: Karl-Friedrich Becker, Fraunhofer IZM
4:25pm
-
4:55pm
Exhibitor Pitches
Location: MOA 10-12
4:55pm
-
5:00pm
Room change
5:00pm
-
6:15pm
MIP2_Advanced Interconnection Metallurgical Materials and Interconnects
Location: MOA 10-12
Chair: Ali Roshanghias, Silicon Austria Labs GmbH
AP2_Hybrid Bonding I
Location: MOA 5
Chair: E Jan Vardaman, TechSearch International, Inc.
Opto2_Heterogenous PIC Integration
Location: MOA 4
Chair: Giovanni Delrosso, VTT
DTM2_Reduced Order Modeling for Advanced Packaging
Location: MOA 3
Chair: Kshitij Anil Kolas, Fraunhofer ENAS
Power2_Power Semiconductor Packaging and Cooling
Location: MOA 1+2
Chair: Gudrun Feix, ECPE European Center for Power Electronics
 
6:15pm
-
8:00pm
Welcome Reception
Location: Atrium
Date: Thursday, 12/Sept/2024
8:30am
-
9:15am
Keynote 2
Location: MOA 10-12

"Electronics Integration: Challenges in Computed Tomography Scanners"

Dr. Michael Hosemann
Head of Digital Electronics at Healthineers Computed Tomography Detector Center, Siemens




8:30am
-
7:00pm
Exhibition
Location: Atrium
9:15am
-
10:30am
MIP3_Low-temperature Materials for Interconnects and Packaging
Location: MOA 10-12
Chair: Hiroshi Nishikawa, Osaka University
AP3_Hybrid Bonding II
Location: MOA 5
Chair: Rolf Aschenbrenner, Fraunhofer IZM
AMT1_Innovative Assembly Processes
Location: MOA 4
Chair: Attila Géczy, Budapest University of Technology and Economics
DTM3_Reliability and Virtual Prototyping
Location: MOA 3
Chair: Pradeep Lall, Auburn University
Rel1_Reliability Performance and Electromigration Behavior
Location: MOA 1+2
Chair: Matthias Heimann, Siemens AG
 
10:30am
-
11:00am
Coffee Break & Exhibition
Location: Atrium
10:30am
-
11:45am
Poster Session 2
Location: Atrium
Chair: Karl-Friedrich Becker, Fraunhofer IZM
11:00am
-
12:15pm
Emerging I_From Mounting to Recycling – Highlites from Emerging Technologies
Location: MOA 10-12
Chair: Martin Oppermann, TU Dresden
AP4_Advances in WLP Technologies I
Location: MOA 5
Chair: Rolf Aschenbrenner, Fraunhofer IZM
AMT2_Computer-aided Process Control
Location: MOA 4
Chair: Erik Jung, Fraunhofer IZM
DTM4_Device Level Modeling
Location: MOA 3
Chair: Przemyslaw Gromala, Robert Bosch GmbH
Rel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects
Location: MOA 1+2
Chair: Romuald Roucou, NXP
 
12:15pm
-
1:45pm
Lunch
1:45pm
-
3:15pm
Special Session
Location: MOA 10-12
Chair: Steffen Kroehnert, ESPAT-Consulting
Chair: Klaus Pressel, Infineon

The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing I
IPCEI ME/CT and Pack4EU/ EU CHIPS ACT



AP5_Advances in WLP Technologies II
Location: MOA 5
Chair: Michael Schiffer, Fraunhofer IZM
AMT3_Process for Enhancement of Device Robustness
Location: MOA 4
Chair: David Henry, CEA LETI
Special Session
Location: MOA 3

PUNCH - Photonic Packaging



Special Session
Location: MOA 1+2

Education I: The Education, Training and Qualification Offer for Sustainable Electronics



 
3:15pm
-
3:45pm
Coffee Break & Exhibition
Location: Atrium
3:45pm
-
5:15pm
Special Session
Location: MOA 10-12
Chair: Klaus Pressel, Infineon
Chair: Steffen Kroehnert, ESPAT-Consulting

The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing II
IPCEI ME/CT and Pack4EU/ EU CHIPS ACT



AP6_Challenges and Solutions for HI
Location: MOA 5
Chair: Kay Essig, ASE Group
Emerging II
Location: MOA 4
Chair: Martin Schneider-Ramelow, Fraunhofer IZM
Special Session
Location: MOA 3
Chair: Toni Mattila, Business Finland

Quantum Computing



Special Session
Location: MOA 1+2
Chair: Jeffrey C. Suhling, Auburn University
Chair: Klaus-Jürgen Wolter, TU Dresden

Education II: t.b.c.



 
5:15pm
-
6:45pm
Panel Discussion

"Chiplet Architectures for Automotive: Package Options and Special Considerations"

E. Jan Vardaman, TechSearch International, Inc.
Vikas Gupta, ASE





7:10pm
-
7:35pm
Bus Transfer
7:30pm
-
11:00pm
Gala Dinner at Wasserwerk
Date: Friday, 13/Sept/2024
8:30am
-
9:15am
Keynote 3
Location: MOA 10-12

"Challenges and Opportunities of Semiconductor Packaging in the Chiplet Era"

Dr. Yasumitsu Orii
Senior Managing Executive Officer in 3D Assembly Division, Rapidus Corporation




8:30am
-
1:45pm
Exhibition
Location: Atrium
9:15am
-
10:30am
MIP4_Mechanical properties of Materials for Interconnects
Location: MOA 10-12
Chair: Glenn Hamilton Ross, Aalto University
AP7_Fan Out Packages
Location: MOA 5
Chair: Erik Jung, Fraunhofer IZM
AMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration
Location: MOA 4
Chair: Hoang-Vu Nguyen, University of South-Eastern Norway
Flex1_Reliability Assessment of Flexible Electronics
Location: MOA 3
Chair: Jean Charles Souriau, CEA-Leti
RF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems
Location: MOA 1+2
Chair: Matthias Wietstruck, IHP - Leibniz Institut für innovative Mikroelektronik
 
10:30am
-
11:00am
Coffee Break & Exhibition
Location: Atrium
10:30am
-
11:45am
Poster Session 3
Location: Atrium
Chair: Karl-Friedrich Becker, Fraunhofer IZM
11:00am
-
12:15pm
MIP5_Microstructural Properties of Materials for Interconnects
Location: MOA 10-12
Chair: Kay Essig, ASE Group
AP8_Fan Out Reliability Aspects
Location: MOA 5
Chair: Grace O'Malley, INEMI
AMT5_Advanced Materials and Processes
Location: MOA 4
Chair: Attila Géczy, Budapest University of Technology and Economics
Flex2_Formation of a Conductive Interconnection for Flexible Electronics
Location: MOA 3
Chair: Jukka Hast, VTT Technical Research Centre of Finland ltd.
Rel3_Progress in Failure Analytical and Material Testing Methods
Location: MOA 1+2
Chair: Matthias Petzold, Fraunhofer IMWS
 
12:15pm
-
1:45pm
Lunch
1:45pm
-
3:00pm
MIP6_New materials for Heterogeneous Integration
Location: MOA 10-12
Chair: Nikhilendu Tiwary, Aalto University
AP9_Power Electronics Packaging
Location: MOA 5
Chair: Klaus Pressel, Infineon
AMT6_Enhanced Process Control
Location: MOA 4
Chair: Knut E. Aasmundtveit, University of South-Eastern Norway
RF2_Embedded System-in-Package and Interconnections Technologies
Location: MOA 3
Chair: Maurizio Cirillo, Rheinmetall Italia SpA
Rel4_New Approaches in Reliability Simulation and Modelling
Location: MOA 1+2
Chair: Olaf Wittler, Fraunhofer IZM
 
3:00pm
-
3:10pm
Room Change
Location: Atrium
3:10pm
-
3:55pm
Keynote 4
Location: MOA 10-12

"CHIPS -NAPMP: Overview and Next Steps"

George Orji
Deputy Director of CHIPS NAPMP, USA




3:55pm
-
4:25pm
Closing
Date: Saturday, 14/Sept/2024
8:30am
-
3:30pm
IEEE EPS Board of Governors Meeting (not public)

 
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