Index of Authors

A list of all persons who contribute to the sessions of this conference. Please select a letter below to list all persons with the corresponding surname. Select the presentation in the right-hand column to access session and presentation details.

 
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Author(s) Organization(s) Session
Abassi, GolnoushNILU, NorwaySession C.10: Digital Product Passport Developments
Abdelbaky, MohammadLCE, Department of Mechanical Engineering, KU Leuven, Belgium;
Flanders Make@KU Leuven, Belgium
Session C.2: Circularity - Battery Challenges I
Acheampong, Frank BoatengGIZ Ghana, GhanaSession D.7: International WEEE Implementation Insights  Presenter
Adrianto, Lugas RakaSwiss Federal Laboratories for Materials Science and Technology (EMPA)Session B.7: Application Focus - Digital Infrastructure
Aghaeian, SoroushTU Delft, The NetherlandsSession C.6: Circularity - Assessment & Tools  Presenter
Ahmed, SaadNTNU Norwegian University of Science and Technology, NorwaySession C.2: Circularity - Battery Challenges I
Ahniyaz, AnwarRISE Research Institutes of Sweden, Bioeconomy & HealthSession D.8: Circularity - Battery Challenges II
Aigner, TheresaFraunhofer IZM, GermanySession C.10: Digital Product Passport Developments  Presenter
Ajie, Maulana PermanaiPoint-systems GmbH, GermanySession B.7: Application Focus - Digital Infrastructure  Presenter
Aladago, DavidGerman Development Cooperation (GIZ GmBH), GhanaSession B.6: Applied LCA - Production and End of Life
Alix, ThecleArts et Metiers Institute of Technology, Univ. Bordeaux, CNRS, Bordeaux INP, INRAE, I2M, UMR 5295, Talence, FranceSession B.10: Application Focus - Power Electronics
Amasawa, EriThe University of Tokyo, JapanSession C.2: Circularity - Battery Challenges I
Amatuni, LevonDepartment of Sustainable Design Engineering (SDE), TU DelftSession C.7: Circularity - ReUse Challenges and Results  Presenter
Anand, KetekiDepartment of Electronic and Computer Engineering, University of Limerick, IrelandOnline-Poster  Presenter
Andreassen, KarenWindowMasterSession C.1: Circularity - Principles and Policies
Antonello, VeronicaTXT e-tech srl, ItalySession A.9: Environmental Data from the Supply Chain
Ariza, MariaiPoint-systems GmbH, GermanySession D.9: Recycling and Mining of Critical Materials  Presenter
Armgarth, RomanDP Patterning AB, SwedenSession B.2: Towards Sustainable PCB Assemblies
Arnold-Keifer, SonjaFraunhofer Institute for Systems and Innovation Research ISI, GermanySession A.4: Product Design - Strategies and Trade-offs I  Presenter
Aryan, VenkatFraunhofer UMSICHT, GermanySession B.9: Application Focus - Automotive Electronics
Aslan, TuganaResearch Fab Microelectronics GermanySession B.7: Application Focus - Digital Infrastructure
Audrain, Guillaumeecosystem, FranceSession B.6: Applied LCA - Production and End of Life
Session C.5: Circularity - Repair Policies  Presenter
Azad, AndishehsadatFraunhofer-Institut für Zuverlässigkeit und Mikrointegration Berlin, GermanySession D.6: WEEE Collection Rates
Bakker, Conny A.Delft University of Technology (TU Delft), Netherlands, The;
TU Delft, The Netherlands
Session B.8: Application Focus - Health and Environmental Sensing
Session C.6: Circularity - Assessment & Tools
Session C.6: Circularity - Assessment & Tools
Balkenende, RuudTU Delft, The NetherlandsSession C.6: Circularity - Assessment & Tools
Balsvik, JonathanWSP USA, United States of AmericaSession D.4: LCA - Simplifications and Limitations
Barkhausen, RobinFraunhofer ISI, GermanySession C.5: Circularity - Repair Policies  Presenter
Bauer, LaraUmwelttechnik BW GmbHSession A.7: LCA - Tools & Databases
Baur, Sarah-JaneFraunhofer IZM, GermanySession A.8: Carbon Neutrality and Net Zero Goals  Presenter
Session B.2: Towards Sustainable PCB Assemblies
Beard, AdrianClariant, GermanySession B.9: Application Focus - Automotive Electronics  Presenter
Becker, Karl-FriedrichFraunhofer IZM, GermanySession A.9: Environmental Data from the Supply Chain
Behfar, Mohammad H.VTT Technical Research Centre of Finland, FinlandSession D.3: Bio-based Materials II
Behrens, FelixÖko-Institut e.V., GermanySession B.7: Application Focus - Digital Infrastructure
Belaineh, DagmawiRISE Research Institutes of Sweden, SwedenSession D.3: Bio-based Materials II  Presenter
Belaineh Yilma, DagmawiRISE Research Institutes of Sweden, SwedenSession B.1: Bio-based Materials I
Beloin-Saint-Pierre, DidierSwiss Federal Laboratories for Materials Science and Technology (EMPA)Session B.7: Application Focus - Digital Infrastructure
Beni, ValerioRISE Research Institutes of Sweden, Digital SystemsSession D.8: Circularity - Battery Challenges II
Bening, Catharina RETH Zurich, SwitzerlandSession C.3: Recycled Plastics and Plastics Recycling
Berger, JoschaVDE Testing and Certification Institute, GermanySession A.1: Policy - Substance Regulations, RoHS & REACh
Bernad-Beltrán, DavidEuropean Commission - Joint Research Centre, SpainSession D.2: Applied LCA and Ecodesign for ICT I
Bernd, NowackEmpa, SwitzerlandSession C.6: Circularity - Assessment & Tools
Berrée, Jean-FrançoisCEA, FranceSession B.4: Sustainable Innovation
Bidoul, NoémieICTEAM, UCLouvain, BelgiumSession B.5: Applied LCA and Ecodesign for ICT II  Presenter
Billaud, MathildeCEA-Leti, FranceSession B.3: Modelling of ICs and IC Packaging
Birkholz, MarioIHP – Leibniz-Institut für innovative Mikroelektronik Im Technologiepark 25, 15236 Frankfurt (Oder), Germany;
IHP - Leibniz-Institut für innovative Mikroelektronik, Germany
On-site Poster Session: 1st Screen  Presenter
Session B.4: Sustainable Innovation  Presenter
Blaszkowski, SolangePhilips International B.V., The NetherlandsSession C.4: Circularity - Consumer Influence and Communication
Bliklen, RebeccaRamboll Deutschland GmbH (ramboll), GermanySession D.6: WEEE Collection Rates
Blömeke, SteffenTechnische Universität Braunschweig, GermanySession C.2: Circularity - Battery Challenges I
Boakes, LizzieIMEC, BelgiumSession B.2: Towards Sustainable PCB Assemblies
Boks, CasperNTNU Norwegian University of Science and Technology, NorwaySession C.2: Circularity - Battery Challenges I
Bol, DavidUCLouvain, Belgium;
UCLouvain, ICTEAM, Belgium
Session B.3: Modelling of ICs and IC Packaging
Session C.7: Circularity - ReUse Challenges and Results
Böni, HeinzSwiss Federal Institute for Materials Science and Technology, SwitzerlandSession D.7: International WEEE Implementation Insights
Bora, RumpeeKTH Royal Institute of TechnologySession D.3: Bio-based Materials II
Boukhatmi, ÄssiaTechnische Universität Berlin;
Berner Fachhochschule
Session C.9: Product Design - Lifetime and Robustness  Presenter
Bouman, Evert A.NILU, NorwaySession C.10: Digital Product Passport Developments
Boyd, SarahAligned Incentives, United States of AmericaSession A.7: LCA - Tools & Databases  Presenter
Boysen, GerritPhoenix Contact Electronics GmbHSession A.8: Carbon Neutrality and Net Zero Goals
Bracke, StefanUniversity of Wuppertal, GermanySession A.5: Product Design - Strategies and Trade-offs II
Bregadze, SopioFraunhofer IZM, GermanySession A.3: Policy - Product Labelling
Brinkfeldt, KlasRISE AB, SwedenSession C.9: Product Design - Lifetime and Robustness
Broekhuijsen, MendelEcoformaSession D.5: LCA - Beyond Conventional Impact Categories
Brooke, RobertRISE Research Institutes of Sweden, SwedenSession B.1: Bio-based Materials I
Brusselmans, NicolasUCLouvain, ICTEAM, BelgiumSession C.7: Circularity - ReUse Challenges and Results  Presenter
Bundgaard, Anja MarieAalborg University, DenmarkSession A.2: Policy - Developments in Ecodesign & ESPR  Presenter
Bunke, DirkÖko-Institut e.V., GermanySession B.7: Application Focus - Digital Infrastructure
Busch, ChrisAppleSession A.8: Carbon Neutrality and Net Zero Goals  Presenter
Calabresi, MattiaTXT e-tech srl, ItalySession A.9: Environmental Data from the Supply Chain
Caldarelli, PaulinaErion Compliance Organization (ECO), ItalySession D.6: WEEE Collection Rates
Cardinael, PieterUCLouvain, BelgiumSession B.2: Towards Sustainable PCB Assemblies
Cardon, LudwigCentre for Polymer and Material Technologies (CPMT), Department of Materials, Textiles and Chemical Engineering, Ghent University, Technologiepark 130, 9052 Ghent, BelgiumSession B.1: Bio-based Materials I
Castagné, LaetitiaCEA-Leti, Univ. Grenoble Alpes, FranceSession B.3: Modelling of ICs and IC Packaging
Cauwe, MaartenCentre for Microsystems Technology (CMST), imec and Ghent University, Technologiepark 126, 9052 Ghent, BelgiumSession B.1: Bio-based Materials I
Chaianong, AksornchanChulalongkorn University Bangkok, ThailandSession C.4: Circularity - Consumer Influence and Communication
Chang, JojoNanya Technology Coporation New Taipei City, TaiwanSession D.5: LCA - Beyond Conventional Impact Categories
Chen, Yi XuanNanya Technology Coporation New Taipei City, TaiwanSession D.5: LCA - Beyond Conventional Impact Categories
Cherem Lopes, SophiaGoogle Inc.Session D.2: Applied LCA and Ecodesign for ICT I
Chinen, AiWaseda University, JapanSession C.4: Circularity - Consumer Influence and Communication
Chinen, KenichiroCalifornia State University, Sacramento, USASession C.4: Circularity - Consumer Influence and Communication
Claudia, SomEmpa, SwitzerlandSession C.6: Circularity - Assessment & Tools
Clemm, ChristianUniversity of Tokyo, Japan;
Department of Precision Engineering, University of Tokyo
Session B.3: Modelling of ICs and IC Packaging
Session C.4: Circularity - Consumer Influence and Communication
Session C.7: Circularity - ReUse Challenges and Results
Session A.10: LCA - Artificial Intelligence for Workflow Enhancement
Session C.4: Circularity - Consumer Influence and Communication  Presenter
Coopman, AnthonieDepartment of Mechanical Engineering KU Leuven, Celestijnenlaan 300, Leuven 3001, Belgium;
Flanders Make@KU Leuven, 3000 Leuven, Belgium
Online-Poster  Presenter
Cotovia Pimentel, Marcos BatistaCTI Renato Archer / Brazilian Ministry of Science, Technology and Innovation, BrazilSession D.7: International WEEE Implementation Insights  Presenter
Crebier, Jean-ChristopheG2Elab, Grenoble INP, CNRS, University Grenoble Alpes, Grenoble, FranceSession B.10: Application Focus - Power Electronics
Cuccaro, LauraAppleSession A.5: Product Design - Strategies and Trade-offs II
Cuénot, Laurèneecosystem, FranceSession B.6: Applied LCA - Production and End of Life
Session C.5: Circularity - Repair Policies
Czymai, MaxBTU Cottbus, GermanySession B.8: Application Focus - Health and Environmental Sensing
D'Angelo, ElenaUnited Nations Institute for Training and Research (UNITAR), GermanySession D.6: WEEE Collection Rates
D'Olif, LukasHelbling, SwitzerlandSession A.7: LCA - Tools & Databases
Dalhammar, Carl JohanLund University, SwedenSession C.1: Circularity - Principles and Policies  Presenter
De Marelle, DieterDepartment of Mechanical Engineering KU Leuven, Belgium;
Flanders Make@KU Leuven, Belgium
Session D.10: Disassembly and Recycling Enhancement
De Meester, StevenLaboratory for Circular Process Engineering (LCPE), Department of Green Chemistry and Technology, Ghent University, Graaf Karel De Goedelaan 5, 8500 Kortrijk, BelgiumSession B.1: Bio-based Materials I
de Pauw, IngridDelft University of Technology, Delft, the NetherlandsSession D.10: Disassembly and Recycling Enhancement
Deckelmann, SarahFraunhofer IPA, GermanySession A.1: Policy - Substance Regulations, RoHS & REACh  Presenter
Dell’Ambrogio, SiroSUPSI, SwitzerlandSession B.9: Application Focus - Automotive Electronics
Demierre, JonathanHelbling, SwitzerlandSession A.7: LCA - Tools & Databases  Presenter
Dethienne, RobinUCLouvain, BelgiumSession B.3: Modelling of ICs and IC Packaging
Dewulf, WimDepartment of Mechanical Engineering, KU Leuven, Belgium;
Flanders Make@KU Leuven, Belgium
Session C.2: Circularity - Battery Challenges I
Session D.10: Disassembly and Recycling Enhancement
Di Cioccio, LéaCEA-Leti, Univ. Grenoble Alpes, FranceSession B.3: Modelling of ICs and IC Packaging
Dillon, PatriciaGlobal Electronics Council, United States of AmericaSession A.3: Policy - Product Labelling  Presenter
DiNino, Susan BrennanCiscoSession D.4: LCA - Simplifications and Limitations
Dittrich, FionaAfB gGmbHSession A.7: LCA - Tools & Databases
Session C.7: Circularity - ReUse Challenges and Results
Dittrich, KoenRotterdam School of Management, Erasmus University, Rotterdam, The Netherlands;
Rotterdam University of Applied Sciences, Rotterdam, The Netherlands
Session C.8: Circularity - Business Transformation
Dobs, TomSiemens AG, Berlin, GermanySession C.9: Product Design - Lifetime and Robustness
Dowd, CeciliaEARN Elektroaltgeräte Service GmbH, GermanySession C.1: Circularity - Principles and Policies
Dreger, JonasAppleSession A.5: Product Design - Strategies and Trade-offs II
Druschke, JanFraunhofer Institute for Reliability and Microintegration IZM, GermanySession A.10: LCA - Artificial Intelligence for Workflow Enhancement
Durand, AntoineFraunhofer ISI, GermanySession C.5: Circularity - Repair Policies
Ebert, ThomasAppleSession A.5: Product Design - Strategies and Trade-offs II
Edberg, JesperRISE Research Institutes of Sweden, Sweden;
RISE Research Institutes of Sweden, Digital Systems
Session B.1: Bio-based Materials I  Presenter
Session D.3: Bio-based Materials II
Session D.8: Circularity - Battery Challenges II
Eichstädt, SaschaPhysikalisch-Technische Bundesanstalt (PTB), GermanySession C.10: Digital Product Passport Developments
El Jaoua, WafaPhysikalisch-Technische Bundesanstalt (PTB), GermanySession C.10: Digital Product Passport Developments
Eleutério Filho, SebastiaoCTI Renato Archer / Brazilian Ministry of Science, Technology and Innovation, BrazilSession D.7: International WEEE Implementation Insights
Elsotohy, MariamFraunhofer IZM, Germany;
Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin, Germany
Session A.2: Policy - Developments in Ecodesign & ESPR
Session C.9: Product Design - Lifetime and Robustness  Presenter
Emery, IsaacWSP USASession D.1: Towards Sustainable Semiconductors
Eng, Mattias P.RISE AB, SwedenSession C.9: Product Design - Lifetime and Robustness
Engelkamp, HendrikEuropean Commission, BelgiumSession A.1: Policy - Substance Regulations, RoHS & REACh  Presenter
Eschenbach, KimFraunhofer IZM, GermanySession B.8: Application Focus - Health and Environmental Sensing
Esquivel, Juan PabloBCMaterials, Basque Centre for Materials, Applications and Nanostructures, UPV/EHU Science Park, Leioa, Spain;
Ikerbasque, Basque Foundation for Science, Bilbao, Spain
Session D.8: Circularity - Battery Challenges II  Presenter
Etheridge, TomEarthShift Global, USASession D.1: Towards Sustainable Semiconductors
Evans, Holly AnneResponsible Business Alliance, United States of AmericaSession D.9: Recycling and Mining of Critical Materials  Presenter
F. Mendoza, Joan ManuelMondragon Unibertsitatea, Faculty of Engineering, Mechanics and Industrial Production, Gipuzkoa, Spain;
IKERBASQUE, Basque Foundation for Science, Bilbao, Spain
Session B.10: Application Focus - Power Electronics
Faghih, MaryamFraunhofer EMFT, GermanySession B.2: Towards Sustainable PCB Assemblies
Fahle, JuliaBochum University of Applied Sciences, GermanySession B.9: Application Focus - Automotive Electronics
Faludi, JeremyDelft University of Technology (TU Delft), Netherlands, The;
TU Delft, Netherlands, The
Session B.8: Application Focus - Health and Environmental Sensing
Session C.9: Product Design - Lifetime and Robustness  Presenter
Faniel, SebastienICTEAM, UCLouvain, BelgiumSession B.5: Applied LCA and Ecodesign for ICT II
Fazlali, ZahraCentre for Microsystems Technology (CMST), imec and Ghent University, Technologiepark 126, 9052 Ghent, BelgiumSession B.1: Bio-based Materials I  Presenter
Fernandez, ElenaUNITAR, GermanySession C.10: Digital Product Passport Developments
Fernandez Mendoza, Joan ManuelMondragon Unibertsitatea, Faculty of Engineering, Mechanics and Industrial Production, Gipuzkoa, Spain.;
IKERBASQUE, Basque Foundation for Science, Bilbao, Spain.
Session B.10: Application Focus - Power Electronics
Feron, Jean-BrieucSwarn, BelgiumSession C.7: Circularity - ReUse Challenges and Results
Feuchter, PhilippTechnical University of Vienna, AustriaSession B.10: Application Focus - Power Electronics
Fishman, TomerInstitute of Environmental Sciences (CML), Leiden University, Leiden, The NetherlandsSession D.6: WEEE Collection Rates
Fitzpatrick, ColinDepartment of Electronic and Computer Engineering, University of Limerick, IrelandOnline-Poster
Flandre, DenisICTEAM, UCLouvain, BelgiumSession B.5: Applied LCA and Ecodesign for ICT II
Flipsen, BasDelft University of Technology, Delft, the Netherlands;
TU Delft, Netherlands, The
Session C.6: Circularity - Assessment & Tools
Session C.9: Product Design - Lifetime and Robustness
Session D.10: Disassembly and Recycling Enhancement
Fontana, AlessandroSUPSI, SwitzerlandSession A.9: Environmental Data from the Supply Chain
Session B.9: Application Focus - Automotive Electronics
Francisco Morgado, JoanaEmpa, SwitzerlandSession C.10: Digital Product Passport Developments  Presenter
Frank, MarisaRefurbed Marketplace GmbH, AustriaSession C.7: Circularity - ReUse Challenges and Results
Frick, FelicitasRamboll Deutschland GmbH (ramboll), GermanySession D.6: WEEE Collection Rates
Fritsch, AndreasKITSession A.7: LCA - Tools & Databases  Presenter
Frost, KaliMicrosoft, United States of AmericaSession A.7: LCA - Tools & Databases
Fuhg, Lena F.Bochum University of Applied Sciences, GermanySession B.9: Application Focus - Automotive Electronics
Fukushige, ShinichiDepartment of Industrial and Management Systems Engineering, School of Creative Science and Engineering, Waseda UniversityOnline-Poster
Gallina, ViolaFraunhofer Austria Research GmbHSession C.10: Digital Product Passport Developments
Gasser, MikeE[co]work, IndiaSession D.7: International WEEE Implementation Insights
Glaser, SebastianTechnical University of Vienna, AustriaSession B.10: Application Focus - Power Electronics  Presenter
Goldbrunner, JenniferFraunhofer EMFT, GermanySession B.2: Towards Sustainable PCB Assemblies
Graf, DominicUmwelttechnik BW GmbHSession A.7: LCA - Tools & Databases
Graf, MarkusKarlsruhe University of Applied Sciences, GermanySession B.5: Applied LCA and Ecodesign for ICT II  Presenter
Granberg, HjalmarRISE Research Institutes of Sweden, Bioeconomy & HealthSession D.8: Circularity - Battery Challenges II
Grieger, SvenEARN Elektroaltgeräte Service GmbH, GermanySession C.1: Circularity - Principles and Policies
Griffioen, Niels Jan CorneDepartment of Mechanical Engineering, KU Leuven, Belgium;
FlandersMake@KU Leuven, Belgium   
Session C.2: Circularity - Battery Challenges I  Presenter
Grimmel, PhilippTechnische Universität Braunschweig, GermanySession C.2: Circularity - Battery Challenges I
Grobe, KlausAdtran Networks SE, GermanyOn-site Poster Session: 1st Screen  Presenter
Session D.2: Applied LCA and Ecodesign for ICT I  Presenter
Gröger, JensÖko-Institut e.V., GermanySession B.7: Application Focus - Digital Infrastructure
Grösser, StefanBerner FachhochschuleSession C.9: Product Design - Lifetime and Robustness
Guillou, SuzanneCEA-Leti, Univ. Grenoble Alpes, FranceSession B.3: Modelling of ICs and IC Packaging  Presenter
Gupta, AnuragE[co]work, IndiaSession D.7: International WEEE Implementation Insights
Guzzo, RobAppleSession A.5: Product Design - Strategies and Trade-offs II
Hada, ChihiroDepartment of Industrial and Management Systems Engineering, Graduate School of Creative Science and Engineering, Waseda University, JapanOnline-Poster
Hagiwara, ToruMizuho Research & Technologies, Ltd.Session C.2: Circularity - Battery Challenges I
Hahn, DanielFraunhofer IZM, GermanySession A.2: Policy - Developments in Ecodesign & ESPR
Hajosi, EnikoWEEE Forum, BelgiumOnline-Poster
Hakola, LiisaVTT Technical Research Centre of Finland Ltd, FinlandSession A.5: Product Design - Strategies and Trade-offs II  Presenter
Han, Zhaoyang HankLogitech Europe SA, Lausanne, SwitzerlandSession D.10: Disassembly and Recycling Enhancement
Harsch, MatthiasLCS Life Cycle Simulation GmbH, GermanySession A.7: LCA - Tools & Databases
Harwell, JonathanUniversity of Glasgow, United KingdomSession B.2: Towards Sustainable PCB Assemblies
Hasunuma, KazuoMizuho Research & Technologies, Ltd.Session C.2: Circularity - Battery Challenges I
Herreras, LuciaWEEE Forum, BelgiumOnline-Poster  Presenter
Herring, JackJiva Materials, United KingdomSession D.3: Bio-based Materials II  Presenter
Hink-Lemke, EvaiPoint-systems GmbH, GermanySession D.9: Recycling and Mining of Critical Materials
Hintemann, RalphBorderstep Institute for Innovation and Sustainability, GermanySession B.7: Application Focus - Digital Infrastructure  Presenter
Hinterholzer, SimonBorderstep Institute for Innovation and Sustainability, GermanySession B.7: Application Focus - Digital Infrastructure
Hirzel, SimonFraunhofer Institute for Systems and Innovation Research ISI, GermanySession A.4: Product Design - Strategies and Trade-offs I
Hischier, RolandEmpa, SwitzerlandSession C.6: Circularity - Assessment & Tools
Hölck, OleFraunhofer IZM, GermanySession A.9: Environmental Data from the Supply Chain  Presenter
Hooyberghs, JefUHasselt, Data Science Institute, Theory Lab , Agoralaan, 3590 Diepenbeek, BelgiumOn-site Poster Session: 1st Screen
Hoske, RobinFraunhofer IZM, GermanySession B.8: Application Focus - Health and Environmental Sensing
Hoveling, TamaraDelft University of Technology (TU Delft), Netherlands, TheSession B.8: Application Focus - Health and Environmental Sensing  Presenter
Hsu, Chen ChungNanya Technology Coporation New Taipei City, TaiwanSession D.5: LCA - Beyond Conventional Impact Categories
Hu*, Allen H.National Taipei University of Technology (Taipei Tech), TaiwanSession D.5: LCA - Beyond Conventional Impact Categories  Presenter
Huang, Lance HongweiNational Taipei University of Technology (Taipei Tech), TaiwanSession D.5: LCA - Beyond Conventional Impact Categories
Hutzschenreuter, DanielPhysikalisch-Technische Bundesanstalt (PTB), GermanySession C.10: Digital Product Passport Developments
Huulgaard, Rikke DorotheaAalborg University, DenmarkSession A.2: Policy - Developments in Ecodesign & ESPR
Ilgemann, PabloInstitute of Environmental Sciences (CML), Leiden University, Leiden, The NetherlandsSession D.6: WEEE Collection Rates  Presenter
Imaizumi, YoshitakaNational Institute for Environmental Studies, JapanSession C.3: Recycled Plastics and Plastics Recycling
Inoue, MasatoMeiji University, JapanSession A.5: Product Design - Strategies and Trade-offs II  Presenter
Inoue, TomoyaMizuho Research & Technologies, Ltd., JapanSession C.3: Recycled Plastics and Plastics Recycling
Isoaho, JussiNokia Oyj, FinlandSession D.5: LCA - Beyond Conventional Impact Categories  Presenter
Izumida, YutoDepartment of Industrial and Management Systems Engineering, Graduate School of Creative Science and Engineering, Waseda University, JapanOnline-Poster  Presenter
Jaeger, Florian AnsgarSiemens AGSession A.9: Environmental Data from the Supply Chain
Jaeschke, JohannesFraunhofer IZM, Germany;
Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin, Germany
Session A.2: Policy - Developments in Ecodesign & ESPR
Session C.9: Product Design - Lifetime and Robustness
Jager, WalterECD Compliance, CanadaSession C.4: Circularity - Consumer Influence and Communication  Presenter
Jaiswal, Aayush KumarVTT Technical Research Centre of Finland, FinlandSession D.3: Bio-based Materials II  Presenter
Jansson, ElinaVTT Technical Research Centre of Finland, FinlandSession D.3: Bio-based Materials II
Jarmer, Jan-PhilippFraunhofer Institute for Material Flow and Logistics IML, GermanySession B.9: Application Focus - Automotive Electronics
Jayanathan, StephenAppleSession A.5: Product Design - Strategies and Trade-offs II  Presenter
Jiang, MeihuiRotterdam School of Management, Erasmus University, Rotterdam, The NetherlandsSession C.8: Circularity - Business Transformation  Presenter
Jin, YichenDelft University of Technology (TU Delft), Netherlands, TheSession B.8: Application Focus - Health and Environmental Sensing
Joachimsthaler, CharlotteFraunhofer Institute for Material Flow and Logistics IML, GermanySession B.9: Application Focus - Automotive Electronics  Presenter
Johannes, VeronikaGerman Development Cooperation (GIZ GmBH), Ghana;
GIZ Ghana, Ghana
Session B.6: Applied LCA - Production and End of Life  Presenter
Session D.7: International WEEE Implementation Insights
Johannisson, JonasTÜV SÜD Product Service GmbHSession D.4: LCA - Simplifications and Limitations  Presenter
Jørgensen, RasmusCopenhagen Business School, DenmarkSession C.1: Circularity - Principles and Policies  Presenter
Justel, DanielMondragon Unibertsitatea, Faculty of Engineering, Mechanics and Industrial Production, Gipuzkoa, SpainSession B.10: Application Focus - Power Electronics
Justel Lozano, DaniMondragon Unibertsitatea, Faculty of Engineering, Mechanics and Industrial Production, Gipuzkoa, Spain.Session B.10: Application Focus - Power Electronics
Kaboggoza, StephenA & S Electronics Limited,Session B.4: Sustainable Innovation  Presenter
Kallio, SusannaNokia Oyj, FinlandSession D.5: LCA - Beyond Conventional Impact Categories
Kamigaki, KoshiNational Institute of Advanced Industrial Science and Technology (AIST), JapanSession C.4: Circularity - Consumer Influence and Communication
Kamran, FaisalSony Europe B.V. Basingstoke, UKSession C.6: Circularity - Assessment & Tools
Kano, ShingoE&E Solutions Inc.Session C.2: Circularity - Battery Challenges I
Karpenja, TatjanaRISE Research Institutes of Sweden, Sweden;
RISE Research Institutes of Sweden, Digital Systems
Session C.8: Circularity - Business Transformation
Session D.8: Circularity - Battery Challenges II  Presenter
Kasule, JoshuaSky Tower Technologies LimitedSession B.4: Sustainable Innovation
Kegler, SarahFraunhofer Institute for Manufacturing Engineering and Automation, GermanySession C.10: Digital Product Passport Developments
Kellens, KarelDepartment of Mechanical Engineering, KU Leuven, Celestijnenlaan 300, Leuven 3000, Belgium;
Flanders Make@KU Leuven, Celestijnenlaan 300, Leuven 3000, Belgium;
Department of Mechanical Engineering KU Leuven, Wetenschapspark 27, Diepenbeek 3590, Belgium
Online-Poster
Kettle, JeffUniversity of Glasgow, United KingdomSession B.2: Towards Sustainable PCB Assemblies  Presenter
Keune, KaiAfB gGmbH, GermanySession C.7: Circularity - ReUse Challenges and Results  Presenter
Khatiwada, DilipKTH Royal Institute of TechnologySession D.3: Bio-based Materials II
Khetriwal, Deepali SinhaE[co]work, IndiaSession D.7: International WEEE Implementation Insights  Presenter
King, MichaelCiscoSession D.4: LCA - Simplifications and Limitations
Kishita, YusukeThe University of Tokyo, JapanSession C.2: Circularity - Battery Challenges I  Presenter
Session C.4: Circularity - Consumer Influence and Communication
Kobayashi, GenMizuho Research & Technologies, Ltd.Session C.2: Circularity - Battery Challenges I
Kögler, MartinVTT Technical Research Centre of Finland, Kaitoväylä 1, 90590 Oulu, FinlandOn-site Poster Session: 1st Screen
Kohl, VincentFraunhofer Institute for Systems and Innovation Research ISI, GermanySession A.4: Product Design - Strategies and Trade-offs I
Kohlmeyer, ReginaGerman Environment Agency (UBA), GermanySession A.2: Policy - Developments in Ecodesign & ESPR  Presenter
Köhn, MarinaGerman Environment Agency (UBA), GermanySession A.2: Policy - Developments in Ecodesign & ESPR
Koller, JanFraunhofer Institute for Manufacturing Engineering and Automation, GermanySession C.10: Digital Product Passport Developments
Komatsu, YukiMeiji University, JapanSession A.5: Product Design - Strategies and Trade-offs II
Koscielski, MarekŁukasiewicz Research Network – Tele and Radio Research Institute, Warsaw, PolandSession B.5: Applied LCA and Ecodesign for ICT II
Koyama, YosukeNational Institute for Environmental Studies, JapanSession C.3: Recycled Plastics and Plastics Recycling
Kraft, ManfredScholz und Volkmer, GermanySession B.8: Application Focus - Health and Environmental Sensing
Kuhlmann, MarianneCircularity, GermanySession A.4: Product Design - Strategies and Trade-offs I
Kumar, VinayVTT Technical Research Centre of Finland, FinlandSession D.3: Bio-based Materials II
Kuo, Chien-HungNational Taipei University of Technology (Taipei Tech), TaiwanSession D.5: LCA - Beyond Conventional Impact Categories
Kwant, GerardEnvalior, NetherlandsSession B.9: Application Focus - Automotive Electronics
Landolfi, GiuseppeSUPSI, SwitzerlandSession A.9: Environmental Data from the Supply Chain
Langbehn, Pauline FrederikeiPoint-systems, GermanySession A.9: Environmental Data from the Supply Chain  Presenter
Laurié, CyrilCEA, FranceSession D.5: LCA - Beyond Conventional Impact Categories
Laurin, LiseEarthShift Global, USASession D.1: Towards Sustainable Semiconductors
Leadbetter, AdamLogitech Ireland Services Ltd.Session A.10: LCA - Artificial Intelligence for Workflow Enhancement
Lembeye, YvesG2Elab, Grenoble INP, CNRS, University Grenoble Alpes, Grenoble, FranceSession B.10: Application Focus - Power Electronics
Lemke, FrederikAdtran Networks SE, GermanyOn-site Poster Session: 1st Screen
Lemmens, StefRotterdam School of Management, Erasmus University, Rotterdam, The NetherlandsSession C.8: Circularity - Business Transformation
Leroy, PascalWEEE Forum a.i.s.b.l. (WEEE Forum), BelgiumSession D.6: WEEE Collection Rates
Li, Chia wenNational Taipei University of Technology (Taipei Tech), TaiwanSession D.5: LCA - Beyond Conventional Impact Categories
Li, LynnWSP USA, United States of AmericaSession D.4: LCA - Simplifications and Limitations
Lin, Hsin-TienNational Cheng Kung University, TaiwanSession D.2: Applied LCA and Ecodesign for ICT I  Presenter
Liu, RanÖko-Institut e.V., GermanySession B.7: Application Focus - Digital Infrastructure  Presenter
Liu, XiaolingLogitech Europe SA, Lausanne, SwitzerlandSession D.10: Disassembly and Recycling Enhancement
Lohtander-Piispa, TiaVTT Technical Research Centre of Finland, FinlandSession D.3: Bio-based Materials II
Lorf, YannickFraunhofer IZM, GermanySession B.3: Modelling of ICs and IC Packaging
Lövehagen, NinaEricsson AB, SwedenSession D.4: LCA - Simplifications and Limitations
MacMaster, StevenCirca Technologies, Inc., United States of AmericaSession A.10: LCA - Artificial Intelligence for Workflow Enhancement  Presenter
Maga, DanielFraunhofer UMSICHT, GermanySession B.9: Application Focus - Automotive Electronics
Mager, ThomasFraunhofer IEM, Paderborn, GermanySession B.5: Applied LCA and Ecodesign for ICT II
Malfante, LaureCEA, FranceSession D.5: LCA - Beyond Conventional Impact Categories
Malinverno, NadiaEmpa, SwitzerlandSession C.6: Circularity - Assessment & Tools
Malmodin, JensEricsson AB, SwedenSession D.4: LCA - Simplifications and Limitations  Presenter
Maloney, RyanAppleSession A.8: Carbon Neutrality and Net Zero Goals
Manhaeghe, DaveLaboratory for Circular Process Engineering (LCPE), Department of Green Chemistry and Technology, Ghent University, Graaf Karel De Goedelaan 5, 8500 Kortrijk, BelgiumSession B.1: Bio-based Materials I
Marwede, MaxFraunhofer IZM, GermanySession B.8: Application Focus - Health and Environmental Sensing  Presenter
Matschalow, YaraBochum University of Applied Sciences, GermanySession B.9: Application Focus - Automotive Electronics
Matsumoto, MitsutakaNational Institute of Advanced Industrial Science and Technology (AIST), JapanSession C.4: Circularity - Consumer Influence and Communication  Presenter
Maung Thant, XXXDepartment of Mechanical Engineering, KU Leuven, Celestijnenlaan 300, Leuven 3000, BelgiumOnline-Poster
McAlister, CatrionaECOS c/o WeWork.Session A.2: Policy - Developments in Ecodesign & ESPR
Mealing, VeeAnderWSP, United States of America;
WSP USA
Session A.7: LCA - Tools & Databases
Session D.1: Towards Sustainable Semiconductors
Session D.4: LCA - Simplifications and Limitations
Mehdipour, ZahraTerraNEXT.io, GermanySession A.10: LCA - Artificial Intelligence for Workflow Enhancement  Presenter
Mendes de Oliveira, Carlos RobertoCTI Renato Archer / Brazilian Ministry of Science, Technology and Innovation, BrazilSession D.7: International WEEE Implementation Insights
Mendiburu Valor, EiderMondragon Unibertsitatea, Faculty of Engineering, Mechanics and Industrial Production, Gipuzkoa, SpainSession B.10: Application Focus - Power Electronics
Session B.10: Application Focus - Power Electronics  Presenter
Mennenga, MarkTechnische Universität Braunschweig, GermanySession C.2: Circularity - Battery Challenges I
Milios, LeonidasEuropean Commission - Joint Research Centre, SpainSession D.2: Applied LCA and Ecodesign for ICT I
Mintjes, BerendCML, The NetherlandsSession C.10: Digital Product Passport Developments
Mishra, MadhavRISE AB, SwedenSession C.9: Product Design - Lifetime and Robustness
Mogollón, JoséInstitute of Environmental Sciences (CML), Leiden UniversitySession C.7: Circularity - ReUse Challenges and Results
Molnár, MagdolnaBrandenburgische Technische Universität Cottbus-Senftenberg, GermanySession C.5: Circularity - Repair Policies  Presenter
Montenegro, PhilippLund University, SwedenSession C.1: Circularity - Principles and Policies
Moreau, StéphaneCEA-Leti, Univ. Grenoble Alpes, FranceSession B.3: Modelling of ICs and IC Packaging
Mukherjee, RudraUniversity of Glasgow, United KingdomSession B.2: Towards Sustainable PCB Assemblies
Mulla, Mohammad YusufRISE Research Institutes of Sweden, SwedenSession D.3: Bio-based Materials II
Muller, StephanieBRGM, FranceSession C.10: Digital Product Passport Developments
Muñoz-Alcántara, JesúsEcoformaSession D.5: LCA - Beyond Conventional Impact Categories  Presenter
Murcia, DanielaWRFA, SwitzerlandSession D.9: Recycling and Mining of Critical Materials
Natarajan, MukunthWSP, United States of America;
WSP USA
Session A.7: LCA - Tools & Databases
Session D.1: Towards Sustainable Semiconductors
Session D.4: LCA - Simplifications and Limitations
Navarro-Segarra, MarinaBCMaterials, Basque Centre for Materials, Applications and Nanostructures, UPV/EHU Science Park, Leioa, SpainSession D.8: Circularity - Battery Challenges II
Ncube, AmosEarthShift Global, USASession D.1: Towards Sustainable Semiconductors  Presenter
Nerad, GuyMarvell Technology Inc., United States of AmericaSession D.1: Towards Sustainable Semiconductors
Niederhausen, JensPhysikalisch-Technische Bundesanstalt (PTB), GermanySession C.10: Digital Product Passport Developments  Presenter
Nika, JenniferSUPSI, SwitzerlandSession A.9: Environmental Data from the Supply Chain
Session B.9: Application Focus - Automotive Electronics
Nilsson, DavidRISE Research Institute of Sweden, SwedenSession B.2: Towards Sustainable PCB Assemblies  Presenter
Nissen, Nils F.Fraunhofer IZM, GermanySession A.8: Carbon Neutrality and Net Zero Goals
Session A.3: Policy - Product Labelling
Session A.5: Product Design - Strategies and Trade-offs II  Presenter
Session B.7: Application Focus - Digital Infrastructure
Nowak, MaximilianFraunhofer Austria Research GmbH, AustriaSession C.7: Circularity - ReUse Challenges and Results
Nuffer, Anne-KathrinFraunhofer IPA, GermanySession A.1: Policy - Substance Regulations, RoHS & REACh
Oguchi, MasahiroNational Institute for Environmental Studies, JapanSession C.2: Circularity - Battery Challenges I
Session C.3: Recycled Plastics and Plastics Recycling  Presenter
Oudshoorn, RalphStichting OPEN, Zoetermeer, The NetherlandsSession D.6: WEEE Collection Rates
Pamminger, RainerTechnical University of Vienna, AustriaSession B.10: Application Focus - Power Electronics
Pantelatos, LeanderNTNU Norwegian University of Science and Technology, NorwaySession C.2: Circularity - Battery Challenges I
Parvais, BertrandIMEC, Belgium;
Vrije Universiteit Brussel, Belgium
Session B.2: Towards Sustainable PCB Assemblies
Pedersen, TorbenCopenhagen Business School, DenmarkSession C.1: Circularity - Principles and Policies
Peeters, Jef R.Department of Mechanical Engineering, KU Leuven, Celestijnenlaan 300, Leuven 3000, Belgium;
Flanders Make@KU Leuven, Celestijnenlaan 300, Leuven 3000, Belgium;
Flanders Make@KU Leuven, 3000 Leuven, Belgium;
LCE, Department of Mechanical Engineering, KU Leuven;
FlandersMake@KU Leuven, Belgium   
Online-Poster
Online-Poster
Session B.6: Applied LCA - Production and End of Life
Session C.2: Circularity - Battery Challenges I
Session D.10: Disassembly and Recycling Enhancement
Session D.10: Disassembly and Recycling Enhancement
Session C.2: Circularity - Battery Challenges I
Peng, Yin-TsuNational Cheng Kung University, TaiwanSession D.2: Applied LCA and Ecodesign for ICT I
Peralta, MaximeCEA, FranceSession B.4: Sustainable Innovation
Perry, NicolasArts et Metiers Institute of Technology, Univ. Bordeaux, CNRS, Bordeaux INP, INRAE, I2M, UMR 5295, Talence, FranceSession B.10: Application Focus - Power Electronics
Peterson, LisaAftan Engineering, USASession D.1: Towards Sustainable Semiconductors
Petsagkourakis, IoannisRISE Research Institutes of Sweden, SwedenSession B.1: Bio-based Materials I
Pfeffer, David AETH Zurich, SwitzerlandSession C.3: Recycled Plastics and Plastics Recycling  Presenter
Pharino, ChanathipChulalongkorn University Bangkok, ThailandSession C.4: Circularity - Consumer Influence and Communication
Piel, ArianeCEA, FranceSession B.4: Sustainable Innovation
Piessens, MathijsDepartment of Mechanical Engineering KU Leuven, Celestijnenlaan 300, Leuven 3001, Belgium;
Flanders Make@KU Leuven, 3000 Leuven, Belgium;
LCE, Department of Mechanical Engineering, KU Leuven
Online-Poster
Session B.6: Applied LCA - Production and End of Life  Presenter
Session D.10: Disassembly and Recycling Enhancement
Pip, AlexICTEAM, UCLouvain, BelgiumSession B.5: Applied LCA and Ecodesign for ICT II
Poppe, ErikFraunhofer IZM, GermanySession D.2: Applied LCA and Ecodesign for ICT I
Poppelaars, FloraPartners for Innovation, Netherlands, TheSession D.6: WEEE Collection Rates  Presenter
Pozo Arcos, BeatriziFixit, United States of AmericaSession C.5: Circularity - Repair Policies
Proff, MoritzTechnische Universität Braunschweig, GermanySession C.2: Circularity - Battery Challenges I
Proske, MarinaFraunhofer IZM, GermanySession A.5: Product Design - Strategies and Trade-offs II
Session A.8: Carbon Neutrality and Net Zero Goals
Session B.2: Towards Sustainable PCB Assemblies
Session B.3: Modelling of ICs and IC Packaging  Presenter
Session B.7: Application Focus - Digital Infrastructure
Session D.2: Applied LCA and Ecodesign for ICT I
Quay, RüdigerINATECH Freiburg, GermanySession B.8: Application Focus - Health and Environmental Sensing
Ragnarsson, Lars-AkeIMEC, BelgiumSession B.2: Towards Sustainable PCB Assemblies
Rama, MathieuECOS c/o WeWork.Session A.2: Policy - Developments in Ecodesign & ESPR
Ramirez Quintero, Deyber AlexanderCTI Renato Archer / Brazilian Ministry of Science, Technology and Innovation, BrazilSession D.7: International WEEE Implementation Insights
Ranjith Vempati, AjayCisco Systems, United States of AmericaSession B.5: Applied LCA and Ecodesign for ICT II  Presenter
Raskin, Jean-PierreUCLouvain, Belgium;
UCLouvain, ICTEAM, Belgium
Session B.2: Towards Sustainable PCB Assemblies
Session B.5: Applied LCA and Ecodesign for ICT II
Session C.7: Circularity - ReUse Challenges and Results
Rauhala, TainaVTT Technical Research Centre of Finland Ltd, FinlandSession A.5: Product Design - Strategies and Trade-offs II
Raux, PaulineICTEAM, UCLouvain, BelgiumSession B.5: Applied LCA and Ecodesign for ICT II
Reichling, MarkusPanasonic Europe B.V., GermanySession C.8: Circularity - Business Transformation  Presenter
Reike, DeniseETH Zurich, SwitzerlandSession C.3: Recycled Plastics and Plastics Recycling
Rem, Peter CarloTU Delft, Netherlands, TheSession D.9: Recycling and Mining of Critical Materials
Remmen, ArneAalborg University, DenmarkSession A.2: Policy - Developments in Ecodesign & ESPR
Remmen, KirstenEmpa, SwitzerlandSession C.10: Digital Product Passport Developments
Session D.10: Disassembly and Recycling Enhancement
Renaux, ChristianICTEAM, UCLouvain, BelgiumSession B.5: Applied LCA and Ecodesign for ICT II
Reuter, Markus A.MARAS B.V., NetherlandSession B.9: Application Focus - Automotive Electronics
Reznicek, BorisDIN Deutsches Institut für Normung e. V., GermanySession A.2: Policy - Developments in Ecodesign & ESPR
Richter, Jessika LuthLund University, SwedenSession C.1: Circularity - Principles and Policies
Riess, MichaelVDE Testing and Certification Institute, GermanySession A.1: Policy - Substance Regulations, RoHS & REACh  Presenter
Ritsma, RutgerTU Delft, Netherlands, TheSession C.9: Product Design - Lifetime and Robustness
Ritter, Evelyn3e Europe GmbH, GermanySession C.10: Digital Product Passport Developments  Presenter
Ritzen, LindaDelft University of Technology, Delft, the NetherlandsSession C.6: Circularity - Assessment & Tools
Robin, BénédicteCEA, FranceSession B.4: Sustainable Innovation  Presenter
Session D.5: LCA - Beyond Conventional Impact Categories
Rohde, ClemensFraunhofer Institute for Systems and Innovation Research ISI, GermanySession A.4: Product Design - Strategies and Trade-offs I
Rolin, CedricIMEC, BelgiumSession B.2: Towards Sustainable PCB Assemblies
Rosa, PaoloPolitecnico di Milano, ItalySession A.9: Environmental Data from the Supply Chain
Session B.9: Application Focus - Automotive Electronics
Rossi, LudovicaSUPSI, SwitzerlandSession A.9: Environmental Data from the Supply Chain  Presenter
Session B.9: Application Focus - Automotive Electronics  Presenter
Roy, Axelecosystem, FranceSession B.6: Applied LCA - Production and End of Life  Presenter
Session C.5: Circularity - Repair Policies
Rückschloss, JanaFraunhofer IZM, GermanySession A.3: Policy - Product Labelling  Presenter
Session A.4: Product Design - Strategies and Trade-offs I
Rudorf, PaulFraunhofer Austria Research GmbH, AustriaSession C.7: Circularity - ReUse Challenges and Results  Presenter
Ruiz de Azua Lahidalga, IratiMondragon Unibertsitatea, Faculty of Engineering, Mechanics and Industrial Production, Gipuzkoa, SpainSession B.10: Application Focus - Power Electronics  Presenter
Session B.10: Application Focus - Power Electronics
Ruiz Pachon, EliaSUPSI, SwitzerlandSession B.9: Application Focus - Automotive Electronics
Ryan-Fogarty, YvonneDepartment of Chemical Sciences, University of Limerick, IrelandOnline-Poster
Rydberg, TomasIVL, SwedenSession B.9: Application Focus - Automotive Electronics
Saiger, MaximilianLCS Life Cycle Simulation GmbH, GermanySession A.7: LCA - Tools & Databases  Presenter
Saint-Patrice, DamienCEA-Leti, Univ. Grenoble Alpes, FranceSession B.3: Modelling of ICs and IC Packaging
Sallén, JosefinaRISE Research Institutes of Sweden, SwedenSession C.8: Circularity - Business Transformation
Sánchez, DavidFraunhofer IZM, GermanySession A.3: Policy - Product Labelling
Sanchez, DavidFraunhofer IZMSession A.5: Product Design - Strategies and Trade-offs II
Session B.3: Modelling of ICs and IC Packaging
Sánchez, DavidFraunhofer IZM, GermanySession D.2: Applied LCA and Ecodesign for ICT I
Sandionigi, ChiaraCEA, FranceSession B.4: Sustainable Innovation
Session D.5: LCA - Beyond Conventional Impact Categories  Presenter
Santandrea, FabioRISE Research Institutes of Sweden, SwedenSession D.3: Bio-based Materials II
Schaffer, MarkSchaffer Environmental LLC, USASession D.1: Towards Sustainable Semiconductors
Schaubroeck, DavidCentre for Microsystems Technology (CMST), imec and Ghent University, Technologiepark 126, 9052 Ghent, BelgiumSession B.1: Bio-based Materials I
Scheller, ChristianTechnische Universität Braunschweig, GermanySession C.2: Circularity - Battery Challenges I
Scherbaum, SabineFraunhofer EMFT, GermanySession B.2: Towards Sustainable PCB Assemblies  Presenter
Schiffleitner, AndreasiPoint systems GmbH, Germany;
iPoint-systems, Germany
Session A.10: LCA - Artificial Intelligence for Workflow Enhancement
Session A.9: Environmental Data from the Supply Chain
Schischke, KarstenFraunhofer IZM, GermanySession A.3: Policy - Product Labelling
Session A.5: Product Design - Strategies and Trade-offs II
Session A.5: Product Design - Strategies and Trade-offs II
Session A.7: LCA - Tools & Databases
Session D.2: Applied LCA and Ecodesign for ICT I  Presenter
Schlegel, Moritz-CasparFederal Institute for Materials Research and Testing (BAM)Session A.2: Policy - Developments in Ecodesign & ESPR  Presenter
Session A.4: Product Design - Strategies and Trade-offs I
Schluep, MathiasWorld Resources Forum, Switzerland;
WRFA, Switzerland
Session D.7: International WEEE Implementation Insights  Presenter
Session D.9: Recycling and Mining of Critical Materials
Schlund, SebastianTechnische Universität Wien, AustriaSession C.7: Circularity - ReUse Challenges and Results
Schneider-Ramelow, MartinFraunhofer IZM, Germany;
TU Berlin, Germany;
Technische Universität Berlin, Germany
Session A.2: Policy - Developments in Ecodesign & ESPR
Session A.3: Policy - Product Labelling
Session A.5: Product Design - Strategies and Trade-offs II
Session A.9: Environmental Data from the Supply Chain
Schoepel, Miriam3e Europe GmbH, GermanySession C.10: Digital Product Passport Developments
Scholz, RonjaFraunhofer IZM, GermanySession A.8: Carbon Neutrality and Net Zero Goals
Schulz, AdeljaFraunhofer IZM, GermanySession B.7: Application Focus - Digital Infrastructure
Schwesig, Arthurbage plastics group, AustriaSession C.3: Recycled Plastics and Plastics Recycling  Presenter
Scotnic, NatashaCiscoSession D.4: LCA - Simplifications and Limitations
Seeholzer, TheresaInfineon Technologies AG, GermanySession B.8: Application Focus - Health and Environmental Sensing  Presenter
Sehr, FredericFraunhofer IZM, Germany;
Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin, Germany
Session A.2: Policy - Developments in Ecodesign & ESPR
Session C.9: Product Design - Lifetime and Robustness
Sekijima, KeitaSony Corporation, Tokyo, Japan;
Delft University of Technology, Delft, the Netherlands
Session C.6: Circularity - Assessment & Tools  Presenter
Sesana, MicheleTXT e-tech srl, ItalySession A.9: Environmental Data from the Supply Chain
Severengiz, SemihBochum University of Applied Sciences, GermanySession B.9: Application Focus - Automotive Electronics  Presenter
Shim, Bong SupInha University, Korea, Republic of (South Korea)Session B.1: Bio-based Materials I  Presenter
Shintomi, MiyukiE&E Solutions Inc.Session C.2: Circularity - Battery Challenges I
Shoaib, Mohammad MahinDepartment of Mechanical Engineering, KU Leuven, Celestijnenlaan 300, Leuven 3000, Belgium;
Flanders Make@KU Leuven, Celestijnenlaan 300, Leuven 3000, Belgium;
Department of Mechanical Engineering KU Leuven, Wetenschapspark 27, Diepenbeek 3590, Belgium
Online-Poster  Presenter
Siderius, Hans-PaulThe Netherlands Enterprise AgencySession A.3: Policy - Product Labelling  Presenter
Sinistore, JulieWSP, United States of America;
WSP USA
Session A.7: LCA - Tools & Databases
Session D.1: Towards Sustainable Semiconductors
Session D.4: LCA - Simplifications and Limitations
Smolander, MariaVTT Technical Research Centre of Finland Ltd, FinlandSession A.5: Product Design - Strategies and Trade-offs II
Söderkvist Vermelin, WilhelmRISE AB, SwedenSession C.9: Product Design - Lifetime and Robustness  Presenter
Sołtysiński, TomaszPhysikalisch-Technische Bundesanstalt (PTB), GermanySession C.10: Digital Product Passport Developments
Sorlini, MarzioSUPSI, SwitzerlandSession A.9: Environmental Data from the Supply Chain
Session B.9: Application Focus - Automotive Electronics
Spear, John Machinepi Consulting, United KingdomSession A.8: Carbon Neutrality and Net Zero Goals  Presenter
Spiliotopoulos, ChristoforosEuropean Commission - Joint Research Centre, SpainSession D.2: Applied LCA and Ecodesign for ICT I  Presenter
Stapel, MichaelRhenus Data Office GmbH, GermanySession A.2: Policy - Developments in Ecodesign & ESPR
Sterkens, WouterLCE, Department of Mechanical Engineering, KU Leuven, Belgium;
PSI-EAVISE, KU Leuven, Belgium;
Flanders Make@KU Leuven, Belgium;
FlandersMake@KU Leuven, Belgium   ;
PSI-EAVISE, KU Leuven, Sint-Katelijne-Waver, Belgium
Session C.2: Circularity - Battery Challenges I  Presenter
Session C.2: Circularity - Battery Challenges I
Session D.10: Disassembly and Recycling Enhancement
Session D.10: Disassembly and Recycling Enhancement
Stimpson, HowardEARN Elektroaltgeräte Service GmbH, GermanySession C.1: Circularity - Principles and Policies
Stobbe, LutzFraunhofer Institute for Reliability and Microintegration IZM, Germany;
Fraunhofer IZM, Germany;
Fraunhofer IZM, Berlin, Germany
Session A.10: LCA - Artificial Intelligence for Workflow Enhancement  Presenter
Session A.5: Product Design - Strategies and Trade-offs II
Session B.3: Modelling of ICs and IC Packaging
Session B.5: Applied LCA and Ecodesign for ICT II  Presenter
Session B.7: Application Focus - Digital Infrastructure  Presenter
Stock, MarteniPoint systems GmbH, GermanySession A.10: LCA - Artificial Intelligence for Workflow Enhancement  Presenter
Session B.7: Application Focus - Digital Infrastructure
Stolzenberg, CorneliaGIZ Ghana, GhanaSession D.7: International WEEE Implementation Insights
Stringa, FilippoErion Compliance Organization (ECO), ItalySession D.6: WEEE Collection Rates
Su, MaggieNational Taipei University of Technology (Taipei Tech), TaiwanSession D.5: LCA - Beyond Conventional Impact Categories
Sudheshwar, AkshatEmpa, SwitzerlandSession C.6: Circularity - Assessment & Tools
Suleimenova, AluaMarvell Technology Inc., United States of AmericaSession D.1: Towards Sustainable Semiconductors  Presenter
Sundar, NischintWSP USA, United States of AmericaSession D.4: LCA - Simplifications and Limitations
Swanston, JonathanJiva Materials, United KingdomSession D.3: Bio-based Materials II
Tamagaki, YukiMizuho Research & Technologies, Ltd., JapanSession C.3: Recycled Plastics and Plastics Recycling
Tanskanen, PiaNokia Oyj, FinlandSession D.5: LCA - Beyond Conventional Impact Categories
Teck, SanderLCE, Department of Mechanical Engineering, KU Leuven;
Flanders Make@KU Leuven
Session B.6: Applied LCA - Production and End of Life
Terazono, AtsushiNational Institute for Environmental Studies, JapanSession C.2: Circularity - Battery Challenges I
Teusch, ChristophAfB gGmbHSession A.7: LCA - Tools & Databases
Session C.7: Circularity - ReUse Challenges and Results
Tiermersma, TruusEnvalior, NetherlandsSession B.9: Application Focus - Automotive Electronics
Tinku, SajinaFraunhofer EMFT, GermanySession B.2: Towards Sustainable PCB Assemblies
Tochtrop, ChristophWuppertal Institute for Climate, Environment and Energy, GermanySession A.4: Product Design - Strategies and Trade-offs I  Presenter
Tomozawa, HiromitsuMizuho Research & Technologies, Ltd.Session C.2: Circularity - Battery Challenges I
Tosoratti, PaoloEuropean Commission DG ENERSession A.3: Policy - Product Labelling
Trawnitschek, AnnaDIN Deutsches Institut für Normung e. V., GermanySession A.2: Policy - Developments in Ecodesign & ESPR
Tsai, Chi-YiLogitech Europe SA, Lausanne, SwitzerlandSession D.10: Disassembly and Recycling Enhancement
Tukker, ArnoldInstitute of Environmental Sciences (CML), Leiden UniversitySession C.7: Circularity - ReUse Challenges and Results
Session D.6: WEEE Collection Rates
Turkbay Romano, TugceArts et Metiers Institute of Technology, Univ. Bordeaux, CNRS, Bordeaux INP, INRAE, I2M, UMR 5295, Talence, France;
G2Elab, Grenoble INP, CNRS, University Grenoble Alpes, Grenoble, France
Session B.10: Application Focus - Power Electronics  Presenter
Tyrwhitt Jones, EmilyRINA, United KingdomSession A.9: Environmental Data from the Supply Chain  Presenter
Ügdüler, SibelLaboratory for Circular Process Engineering (LCPE), Department of Green Chemistry and Technology, Ghent University, Graaf Karel De Goedelaan 5, 8500 Kortrijk, BelgiumSession B.1: Bio-based Materials I
Uhlherr, MartinDIN Deutsches Institut für Normung e. V., GermanySession A.2: Policy - Developments in Ecodesign & ESPR
Uhlig, EdithTechnische Universität Braunschweig, GermanySession C.2: Circularity - Battery Challenges I
ul Hassan Alvi, NaveedRISE Research Institutes of Sweden, SwedenSession B.1: Bio-based Materials I
Uribe Suarez, LorenaAdtran Networks SE, GermanyOn-site Poster Session: 1st Screen
Valdivia, SoniaWRFA, SwitzerlandSession D.9: Recycling and Mining of Critical Materials  Presenter
van Aerschot, TomICTEAM, UCLouvain, BelgiumSession B.5: Applied LCA and Ecodesign for ICT II
van Beek, Max ChristiaanTU Delft, Netherlands, TheSession D.9: Recycling and Mining of Critical Materials  Presenter
van Dolderen, Dorien C.TU Delft, The NetherlandsSession C.6: Circularity - Assessment & Tools
Van Laere, TineLaboratory for Circular Process Engineering (LCPE), Department of Green Chemistry and Technology, Ghent University, Graaf Karel De Goedelaan 5, 8500 Kortrijk, BelgiumSession B.1: Bio-based Materials I
Van Schaik, AntoinetteMARAS B.V., NetherlandSession B.9: Application Focus - Automotive Electronics
Vandewalle, PatrickPSI-EAVISE, KU Leuven, Sint-Katelijne-Waver, BelgiumSession D.10: Disassembly and Recycling Enhancement
Vanfleteren, JanCentre for Microsystems Technology (CMST), imec and Ghent University, Technologiepark 126, 9052 Ghent, BelgiumSession B.1: Bio-based Materials I
Vanhouche, BenjaminIMEC, Belgium;
Vrije Universiteit Brussel, Belgium
Session B.2: Towards Sustainable PCB Assemblies  Presenter
Vauche, LauraCEA-Leti, Univ. Grenoble Alpes, FranceSession B.3: Modelling of ICs and IC Packaging
Vélard, RémiCEA-Leti, Univ. Grenoble Alpes, FranceSession B.3: Modelling of ICs and IC Packaging
Vempati, Ajay RanjithCiscoSession D.4: LCA - Simplifications and Limitations
Vermeersch, EliseUnited Nations Institute for Training and Research (UNITAR), GermanySession D.6: WEEE Collection Rates  Presenter
Vikingsson, KarolinaRISE AB, SwedenSession C.9: Product Design - Lifetime and Robustness
Vikman, MinnaVTT Technical Research Centre of Finland, FinlandSession D.3: Bio-based Materials II
Vilkman, MarjaVTT Technical Research Centre of Finland Ltd, FinlandSession A.5: Product Design - Strategies and Trade-offs II
Vincitore, MadelineWSP USA, United States of AmericaSession D.4: LCA - Simplifications and Limitations  Presenter
Vital, XavierMicrosoft, United States of AmericaSession A.7: LCA - Tools & Databases
Session D.1: Towards Sustainable Semiconductors  Presenter
Vogel, KealieEmpa, SwitzerlandSession C.6: Circularity - Assessment & Tools  Presenter
Voges, SteveFraunhofer IZM, GermanySession A.9: Environmental Data from the Supply Chain
von Geibler, JustusWuppertal Institute for Climate, Environment and Energy, GermanySession A.4: Product Design - Strategies and Trade-offs I
Wäger, PatrickEmpa, SwitzerlandSession C.10: Digital Product Passport Developments
Wagner, EduardFraunhofer IZM, GermanySession A.9: Environmental Data from the Supply Chain
Session C.10: Digital Product Passport Developments
Wang, Yi-HsiehLogitech Europe SA, Lausanne, SwitzerlandSession D.10: Disassembly and Recycling Enhancement  Presenter
Wästerlid, CeciliaRISE Research Institutes of Sweden, SwedenSession C.8: Circularity - Business Transformation
Watanabe, TatsukiThe University of Tokyo, JapanSession C.4: Circularity - Consumer Influence and Communication
Wattiez, AugustinUCLouvain, BelgiumSession B.3: Modelling of ICs and IC Packaging  Presenter
Wehrli, AndreaSwiss Federal Laboratories for Materials Science and Technology;
E[co]work, India;
Empa, Switzerland
Session D.9: Recycling and Mining of Critical Materials
Session D.10: Disassembly and Recycling Enhancement  Presenter
Wehrli, DeaE[co]work, IndiaSession D.7: International WEEE Implementation Insights
Weng, Kuo-CheNational Cheng Kung University, TaiwanSession D.2: Applied LCA and Ecodesign for ICT I
Werhahn, OlavPhysikalisch-Technische Bundesanstalt (PTB), GermanySession C.10: Digital Product Passport Developments
Werner, FedericoWorld Resources Forum, SwitzerlandSession D.7: International WEEE Implementation Insights
Wewer, ValentinTechnische Universität Berlin, GermanySession C.10: Digital Product Passport Developments
Wiberg, HelenaRISE Research Institutes of Sweden, Sweden;
RISE AB, Sweden
Session C.8: Circularity - Business Transformation  Presenter
Session C.9: Product Design - Lifetime and Robustness
Wiens, KyleiFixit, United States of AmericaSession C.5: Circularity - Repair Policies  Presenter
Wimalawarne, KishanThe University of Tokyo, JapanSession A.10: LCA - Artificial Intelligence for Workflow Enhancement
Winrow, ValerieCiscoSession D.4: LCA - Simplifications and Limitations
Wittler, OlafFraunhofer IZM, GermanySession A.2: Policy - Developments in Ecodesign & ESPR  Presenter
Wöbkenberg, PaulCircularity, GermanySession A.4: Product Design - Strategies and Trade-offs I  Presenter
Wu, JosephNanya Technology Coporation New Taipei City, TaiwanSession D.5: LCA - Beyond Conventional Impact Categories
Wu, YifanDepartment of Mechanical Engineering KU Leuven, Celestijnenlaan 300, Leuven 3001, Belgium;
Flanders Make@KU Leuven, 3000 Leuven, Belgium;
PSI-EAVISE, KU Leuven, Jan Pieter de Nayerlaan 5, Sint-Katelijne-Waver 2860, Belgium;
LCE, Department of Mechanical Engineering, KU Leuven;
PSI-EAVISE, KU Leuven, Sint-Katelijne-Waver, Belgium
Online-Poster
Session B.6: Applied LCA - Production and End of Life
Session D.10: Disassembly and Recycling Enhancement
Session D.10: Disassembly and Recycling Enhancement  Presenter
Wu, YongliTU Delft, Netherlands, TheSession D.9: Recycling and Mining of Critical Materials
Wunderlich, JohannesSiemens AGSession A.9: Environmental Data from the Supply Chain
Yacoub, ErwinFraunhofer EMFT, GermanySession B.2: Towards Sustainable PCB Assemblies
Yamada, ShuhoToyama Prefectural University, JapanSession A.5: Product Design - Strategies and Trade-offs II
Zagorski, AnnaGerman Environment Agency (UBA), GermanySession A.2: Policy - Developments in Ecodesign & ESPR
Zhou, ChuangchuangDepartment of Mechanical Engineering, KU Leuven, Celestijnenlaan 300, Leuven 3000, Belgium;
Flanders Make@KU Leuven, Celestijnenlaan 300, Leuven 3000, Belgium;
PSI-EAVISE, KU Leuven, Jan Pieter de Nayerlaan 5, Sint-Katelijne-Waver 2860, Belgium;
Flanders Make@KU Leuven, 3000 Leuven, Belgium;
LCE, Department of Mechanical Engineering, KU Leuven;
PSI-EAVISE, KU Leuven, Sint-Katelijne-Waver, Belgium
Online-Poster
Online-Poster
Session B.6: Applied LCA - Production and End of Life
Session D.10: Disassembly and Recycling Enhancement  Presenter
Session D.10: Disassembly and Recycling Enhancement