Conference Agenda

Enhancing Ease-of-disassembly Tools for Electronic Products: Insights from Assessing Computer Mice

Yi-Hsieh Wang¹, Chi-Yi Tsai¹, Xiaoling Liu¹, Zhaoyang Hank Han¹, Ingrid de Pauw², Bas Flipsen²

¹Logitech Europe SA, Lausanne, Switzerland; ²Delft University of Technology, Delft, the Netherlands

Multi-view Graph Convolutional Network for WEEE Classification

Chuangchuang Zhou^1,2,3, Yifan Wu^1,2,3, Wouter Sterkens^1,2,3, Patrick Vandewalle², Jef Peeters^1,3

¹LCE, Department of Mechanical Engineering, KU Leuven, Belgium; ²PSI-EAVISE, KU Leuven, Sint-Katelijne-Waver, Belgium; ³Flanders Make@KU Leuven, Belgium

A Color and Depth Image Defect Segmentation Framework for EEE Reuse and Recycling

Yifan Wu^1,2, Chuangchuang Zhou^1,2,3, Wouter Sterkens^1,2,3, Mathijs Piessens^1,2, Dieter De Marelle^1,2, Wim Dewulf^1,2, Jef Peeters^1,2

¹Department of Mechanical Engineering KU Leuven, Belgium; ²Flanders Make@KU Leuven, Belgium; ³PSI-EAVISE-KU Leuven, Sint-Katelijne-Waver, Belgium

Circular Solutions: A Novel Methodology for Evaluating Circularity Performance in Waste Electrical and Electronic Equipment Management

Dea Wehrli, Kirsten Remmen

Empa, Switzerland