Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
 
Session Overview
Session
B3: Session B.3: Modelling of ICs and IC Packaging
Time:
Tuesday, 18/June/2024:
4:30pm - 6:00pm

Session Chair: Sarah Boyd, Aligned Incentives, United States of America
Location: Grenander 1


Show help for 'Increase or decrease the abstract text size'
Presentations

Investigation of Semiconductor Die Area as a Reference Variable for LCA

Marina Proske1, Mathilde Billaud2, Christian Clemm3, David Sanchez1, Yannick Lorf1, Lutz Stobbe1

1Fraunhofer IZM, Germany; 2CEA-Leti, France; 3University of Tokyo, Japan



Parametric Modeling for Improved Die Area Estimation in the Life Cycle Assessment of Electronic Systems

Augustin Wattiez, Robin Dethienne, David Bol

UCLouvain, Belgium



Comparative Life Cycle Assessment (LCA) of Redistribution Layers for 3D Integration

Suzanne Guillou, Damien Saint-Patrice, Laura Vauche, Laetitia Castagné, Stéphane Moreau, Rémi Vélard, Léa Di Cioccio

CEA-Leti, Univ. Grenoble Alpes, France