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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Session

B3: Session B.3: Modelling of ICs and IC Packaging

Time:

Tuesday, 18/June/2024:

4:30pm - 6:00pm

Session Chair: Sarah Boyd, Aligned Incentives, United States of America

Location: Grenander 1

Presentations

Investigation of Semiconductor Die Area as a Reference Variable for LCA

Marina Proske¹, Mathilde Billaud², Christian Clemm³, David Sanchez¹, Yannick Lorf¹, Lutz Stobbe¹

¹Fraunhofer IZM, Germany; ²CEA-Leti, France; ³University of Tokyo, Japan

Parametric Modeling for Improved Die Area Estimation in the Life Cycle Assessment of Electronic Systems

Augustin Wattiez, Robin Dethienne, David Bol

UCLouvain, Belgium

Comparative Life Cycle Assessment (LCA) of Redistribution Layers for 3D Integration

Suzanne Guillou, Damien Saint-Patrice, Laura Vauche, Laetitia Castagné, Stéphane Moreau, Rémi Vélard, Léa Di Cioccio

CEA-Leti, Univ. Grenoble Alpes, France

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