Conference Agenda

Session
B2: Session B.2: Towards Sustainable PCB Assemblies
Time:
Tuesday, 18/June/2024:
1:30pm - 3:30pm

Session Chair: Christian Clemm, The University of Tokyo, Japan
Location: Grenander 1


Presentations

Development of Zero Waste Printed Circuit Board Assemblies

Jeff Kettle, Jonathan Harwell, Rudra Mukherjee

University of Glasgow, United Kingdom



A Sustainable Revolution in Flex-PCB Manufacturing – Cutting CO2 Emissions by 99 % at Lowered Cost?!

David Nilsson1, Roman Armgarth2

1RISE Research Institute of Sweden, Sweden; 2DP Patterning AB, Sweden



LEO – Innovative Metallization and Patterning Process on Flexible Substrates

Jennifer Goldbrunner1, Sabine Scherbaum1, Erwin Yacoub1, Sajina Tinku1, Maryam Faghih1, Marina Proske2, Sarah-Jane Baur2

1Fraunhofer EMFT, Germany; 2Fraunhofer IZM, Germany



Environmental Analysis of RF Substrates

Benjamin Vanhouche1,2, Pieter Cardinael3, Lizzie Boakes1, Lars-Ake Ragnarsson1, Cedric Rolin1, Jean-Pierre Raskin3, Bertrand Parvais1,2

1IMEC, Belgium; 2Vrije Universiteit Brussel, Belgium; 3UCLouvain, Belgium