Conference Agenda

Session

B2: Session B.2: Towards Sustainable PCB Assemblies

Time:

Tuesday, 18/June/2024:

1:30pm - 3:30pm

Session Chair: Christian Clemm, The University of Tokyo, Japan

Location: Grenander 1

Presentations

Development of Zero Waste Printed Circuit Board Assemblies

Jeff Kettle, Jonathan Harwell, Rudra Mukherjee

University of Glasgow, United Kingdom

A Sustainable Revolution in Flex-PCB Manufacturing – Cutting CO2 Emissions by 99 % at Lowered Cost?!

David Nilsson¹, Roman Armgarth²

¹RISE Research Institute of Sweden, Sweden; ²DP Patterning AB, Sweden

LEO – Innovative Metallization and Patterning Process on Flexible Substrates

Jennifer Goldbrunner¹, Sabine Scherbaum¹, Erwin Yacoub¹, Sajina Tinku¹, Maryam Faghih¹, Marina Proske², Sarah-Jane Baur²

¹Fraunhofer EMFT, Germany; ²Fraunhofer IZM, Germany

Environmental Analysis of RF Substrates

Benjamin Vanhouche^1,2, Pieter Cardinael³, Lizzie Boakes¹, Lars-Ake Ragnarsson¹, Cedric Rolin¹, Jean-Pierre Raskin³, Bertrand Parvais^1,2

¹IMEC, Belgium; ²Vrije Universiteit Brussel, Belgium; ³UCLouvain, Belgium