Conference Time: 8th Sept 2024, 03:39:17am CEST
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
B2: Session B.2: Towards Sustainable PCB Assemblies
Time:
Tuesday, 18/June/2024:
1:30pm - 3:30pm
Session Chair: Christian Clemm , The University of Tokyo, Japan
Location: Grenander 1
Presentations
Development of Zero Waste Printed Circuit Board Assemblies
Jeff Kettle , Jonathan Harwell, Rudra Mukherjee
University of Glasgow, United Kingdom
A Sustainable Revolution in Flex-PCB Manufacturing – Cutting CO2 Emissions by 99 % at Lowered Cost?!
David Nilsson 1 , Roman Armgarth2
1 RISE Research Institute of Sweden, Sweden; 2 DP Patterning AB, Sweden
LEO – Innovative Metallization and Patterning Process on Flexible Substrates
Jennifer Goldbrunner1 , Sabine Scherbaum 1 , Erwin Yacoub1 , Sajina Tinku1 , Maryam Faghih1 , Marina Proske2 , Sarah-Jane Baur2
1 Fraunhofer EMFT, Germany; 2 Fraunhofer IZM, Germany
Environmental Analysis of RF Substrates
Benjamin Vanhouche 1,2 , Pieter Cardinael3 , Lizzie Boakes1 , Lars-Ake Ragnarsson1 , Cedric Rolin1 , Jean-Pierre Raskin3 , Bertrand Parvais1,2
1 IMEC, Belgium; 2 Vrije Universiteit Brussel, Belgium; 3 UCLouvain, Belgium
