Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview |
| Date: Tuesday, 18/June/2024 | ||||
| 8:00am - 9:30am |
Check-in |
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| 9:30am - 10:45am |
Opening, Keynotes, EGG-Award Location: Alexander 2+3 Opening by the Conference Chair Prof. Dr. Martin Schneider-Ramelow (Institute Director of Fraunhofer IZM) 1. Keynote: "Sustainable Semiconductor Manufacturing – the Challenge and Opportunity" by Todd Brady (Chief Sustainability Officer at Intel Corporation) 2. Keynote: "Can we create a circular structure for guiding innovation towards both what is and what is to be?" by Mads Kogsgaard Hansen (Director, Head of Product Circularity & Portfolio Planning at Bang & Olufsen A/S) |
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| 10:45am - 11:00am |
Coffee Break |
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| 11:00am - 12:30pm |
A1: Session A.1: Policy - Substance Regulations, RoHS & REACh Location: Friedrich Wilhelm Chair: Otmar Deubzer, Fraunhofer IZM, Germany The RoHS Directive and Sustainable Electronics Electronics industry - Dealing with Substance Restrictions at an early Stage Beyond RoHS, REACH and POP: CMR Substances in Electronic Products |
B1: Session B.1: Bio-based Materials I Location: Grenander 1 Chair: Eduard Wagner, Fraunhofer IZM, Germany Eco-friendly In-Mold Electronics using Polylactic Acid (PLA) Bio-Based Solutions for Sustainable Electronics in a Post-PFAS Era Multifunctional Nanocomposites from Naturally Derived Materials: Exploring the Functionalities of Conductive Melanin and Crystalline Nanocellulose |
C1: Session C.1: Circularity - Principles and Policies Location: Grenander 2 Chair: Yusuke Kishita, The University of Tokyo, Japan Drivers and Barriers for “Circular” Consumer Electronics in the European Union Towards Circularity: Ensuring Success By Overcoming Extended Producer Responsibility Compliance Challenges Take-back System Maturity Model and Development Framework – A Multiple Case Study |
D1: Session D.1: Towards Sustainable Semiconductors Location: Alexander 2+3 Chair: Benedicte ROBIN, CEA, France The Role of Semiconductor Design in Reducing Life Cycle Environmental Impacts Pushing the Boundaries of LCA with AI Integration and Advanced Life Cycle Inventories for Semiconductor Production Towards Sustainable Circular Electronics: Exploring IC Reuse for Circular Economy Transformation |
| 12:30pm - 1:30pm |
Lunch Break & On-site Poster Session |
Online-Poster The posters are constantly displayed in a slideshow. The authors' pre-recorded presentations can be viewed online.
Operational Learning systems for collaborative human-robot demanufacturing Simulation of Stock-Based Circular Production in a Cyber-Physical Lifecycle System The WF-RepTool, Making Reporting of E-waste Treatment Simple and Transparent Vision-based Robotic Grasping with Constraints for Robotic Demanufacturing An Environmental Assessment of Remanufactured Laptops as Part of a Circular Business Model |
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| 12:55pm - 1:25pm |
On-site Poster Session: 1st Screen Location: Alexander 1 |
On-site Poster Session: 2nd Screen Location: Alexander 1 |
On-site Poster Session: 3rd Screen Location: Alexander 1 |
On-site Poster Session: 4th Screen Location: Alexander 1 |
| 1:30pm - 3:30pm |
A2: Session A.2: Policy - Developments in Ecodesign & ESPR Location: Friedrich Wilhelm Chair: Hans-Paul Siderius, The Netherlands Enterprise Agency, Netherlands, The Getting the Priorities Right in Material Efficiency – From the Ecodesign Directive to the Ecodesign for Sustainable Products Regulation Destruction of Data Carriers – Safe and Sustainable. How Standardisation Can Help to Save Resources Pioneering Durability in Electronics – The Role of Standardisation in Policymaking and Vice Versa Testing Challenges and Solutions for Product Durability and Lifetime |
B2: Session B.2: Towards Sustainable PCB Assemblies Location: Grenander 1 Chair: Christian Clemm, The University of Tokyo, Japan Development of Zero Waste Printed Circuit Board Assemblies A Sustainable Revolution in Flex-PCB Manufacturing – Cutting CO2 Emissions by 99 % at Lowered Cost?! LEO – Innovative Metallization and Patterning Process on Flexible Substrates Environmental Analysis of RF Substrates |
C2: Session C.2: Circularity - Battery Challenges I Location: Grenander 2 Chair: Yasushi Umeda, The University of Tokyo, Japan, Japan Assessing the Risk and Disassembly Complexity of Battery-Powered WEEE Ignition and Other Incidents Caused by End-of-Life Lithium-ion-Batteries and Safety Management Measures Enhancing Battery Detection in X-Ray Imaging in WEEE with a 16 bit Deep Learning Pipeline Towards sustainable circular EV battery value chains: A review and comparative analysis between Japan, Germany, and Norway |
D2: Session D.2: Applied LCA and Ecodesign for ICT I Location: Alexander 2+3 Chair: Klaus Verschuere, Cisco, Belgium Simplified LCA for Lifetime-limitation Indication Life Cycle Assessment of Networking Products: A Case Study in ICT ODM Company in Taiwan Advancing the State of Life Cycle Assessments for Computers and Laptops Towards a more Sustainable IT Ecosystem A Methodological Proposal for Determining Priority Product Categories Towards the Development of a Product Reparability Score in the European Union |
| 3:30pm - 4:30pm |
Coffee Break & On-site Poster Session |
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| 3:40pm - 4:25pm |
On-site Poster Session: 1st Screen Location: Alexander 1 |
On-site Poster Session: 2nd Screen Location: Alexander 1 |
On-site Poster Session: 3rd Screen Location: Alexander 1 |
On-site Poster Session: 4th Screen Location: Alexander 1 |
| 4:30pm - 6:00pm |
A3: Session A.3: Policy - Product Labelling Location: Friedrich Wilhelm Chair: Moritz-Caspar Schlegel, Federal Institute for Materials Research and Testing (BAM), Germany Energy Efficiency Labelling for Computers: How can Product Groups be Covered? Developing an EU Energy Label for Computers Accelerating Sustainable Electronics Through Ecolabels: Next Generation EPEAT Criteria |
B3: Session B.3: Modelling of ICs and IC Packaging Location: Grenander 1 Chair: Sarah Boyd, Aligned Incentives, United States of America Investigation of Semiconductor Die Area as a Reference Variable for LCA Parametric Modeling for Improved Die Area Estimation in the Life Cycle Assessment of Electronic Systems Comparative Life Cycle Assessment (LCA) of Redistribution Layers for 3D Integration |
C3: Session C.3: Recycled Plastics and Plastics Recycling Location: Grenander 2 Chair: Mathias Schluep, World Resources Forum, Switzerland Towards Identifying Chemical Substances to be Controlled in WEEE Plastics Postconsumer Plastics for Electronics Towards an effective policy mix for circular plastics in electronics |
D3: Session D.3: Bio-based Materials II Location: Alexander 2+3 Chair: Linda Ritzen, Delft University of Technology (TU Delft), Netherlands, The Bio-Based Materials in Printed Electronics: Unveiling Green Possibilities through Life Cycle Assessment Soluboard – A Solution to E-waste Biobased Biodegradable and Recyclable Cellulose Substrates for Green Flexible Printed Electronics |
| 7:30pm - 10:30pm |
Conference Dinner: Boat Trip Please be in front of the hotel at 18:40 sharp. Guides will escort you to the boat. |
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